Driven by the AI computing wave, intelligent computing and supercomputing projects are being deployed at scale, and power per rack continues to reach new highs. While the industry largely focuses on servers, uninterruptible power supplies (UPS) and liquid cooling systems, recurring failures and incidents serve as a reminder: from grid energy storage to IT servers, every connection node represents an easily overlooked safety vulnerability within computing infrastructure.
See you at the 2026 CIIF
Reliable connections are essential to reliable computing infrastructure.
Leveraging decades of technical expertise in connectors, WAIN delivers a systematic connectivity solution across the entire data center infrastructure.
Two new product launches and WAIN’s full portfolio of end-to-end connectivity products for AI data centers will be officially unveiled at the 26th China International Industry Fair (CIIF).
In addition to product demonstrations, the show will offer opportunities for in-depth technical discussion. WAIN will host dedicated technical seminars at our booth during the show. Industry partners are warmly invited to visit our booth, experience the products firsthand, discuss technologies and explore collaboration opportunities.
01
New Product Debut
WAIN New-Generation Industrial Connectors for Data Centers
Available in IP44 and IP67 versions.
Dustproof, moisture-resistant, flame-retardant and high-temperature resistant Available in a range of current ratings.
Engineered for continuous 24/7 operation.
ORV3 Rack Power Distribution
— Standardized & Space-saving
Compliant with OCP (Open Compute Project) standard interfaces
Compact system integration
Reduced space requirements within the power shelf.
Keyed design helps prevent incorrect mating and reduces the risk of electrical hazards.
02
Featured Products
Floating Mating Frame
Accommodates ±3 mm alignment offset and supports blind mating.
Allows complete battery modules to be inserted and removed as a unit.
Significantly shortens maintenance shutdowns. A two-hour disassembly and reassembly process is replaced by a two-minute module insertion and removal process.
Lightweight Quick-Connect Module Connectors
Special latching mechanism prevents accidental disconnection
Made from high-performance materials
50% overall weight reduction vs conventional metal housings
< End-to-End Connectivity Products for Data Centers >
At CIIF, WAIN will showcase a full product lineup including high-voltage connectors for grid energy storage, PCB-mounted connectors, network connectors and modular connectors. The portfolio covers complete connectivity requirements spanning grid energy storage, rack power distribution and board-level interconnection in data centers.
Additionally, WAIN’s full range of heavy-duty rectangular connectors, circular connectors, new energy and industrial control connectors will also be on display. WAIN provides connectivity solutions for diverse industries including machinery manufacturing, robotics, power and energy, rail transit, industrial automation, wind power, electric vehicles and energy storage systems.
03
Booth Information
Date: Oct 12–16, 2026
Venue: National Exhibition and Convention Center (Shanghai, Hongqiao)
Booth No.: Hall 5.1, E023