• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification. This architecture maximizes sensitivity and spectral resolution, enabling complex metal hyperfine coupling analysis and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets. The model automates spectral fitting, component characterization, and experimental report generation, and offers predictive guidance for follow-up experiments.

• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification, delivering enhanced sensitivity and spectral resolution for complex metal hyperfine couplings and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets, achieving 99.9% precision for simulations and 92% for real-world samples. The model automates spectral fitting, component characterization, and experimental report generation, and offers predictive guidance for follow-up experiments.

• EPR instruments from X-band benchtop systems to advanced Q-band and W-band platforms
• CAN400 and CAN600 solution NMR spectrometers
• Modernization solutions for existing EPR and NMR systems
• EPRMind, an AI-powered EPR spectral analysis platform

CIQTEK at EFEPR 2026: Next-Generation Q-Band EPR and AI-Driven Spectral Processing

• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification, delivering enhanced sensitivity and spectral resolution for complex metal hyperfine couplings and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets, which automates spectral fitting, component characterization, and experimental report generation while offering predictive guidance for follow-up experiments.

• EPR instruments from X-band benchtop systems to advanced Q-band and W-band platforms
• CAN400 and CAN600 solution NMR spectrometers
• Modernization solutions for existing EPR and NMR systems
• EPRMind, an AI-powered EPR spectral analysis platform

The primary industrial uses for a 172nm excimer light source are surface cleaning, surface activation, TOC degradation, and UV curing. These 7.2 eV photons break molecular bonds without heat, creating a cold, chemical-free process. You will find this technology critical in semiconductor fabrication, display manufacturing, and ultrapure water treatment. This article details each application's mechanism and industrial advantages.

Key Takeaways

• 172nm excimer light removes organic dirt from surfaces without chemicals or heat.

• It makes plastic surfaces sticky by creating new bonds, improving paint and glue attachment.

• It breaks down organic waste in water and cures coatings at room temperature, saving energy.

Primary Industrial Uses in Surface Modification

Photochemical cleaning and surface activation represent the two dominant surface modification applications for this technology. Both processes exploit the high-energy photons to alter surface chemistry without thermal damage.

Photochemical Cleaning

You will find photochemical cleaning essential for removing organic contaminants from precision substrates. Silicon wafers, glass panels, and optical components arrive with photoresist residues, oils, and fingerprints that compromise performance. The 172nm Excimer Lamp breaks carbon-carbon and carbon-hydrogen bonds directly. Simultaneously, the radiation generates ozone from ambient oxygen. This ozone oxidizes the fragmented residues into volatile carbon dioxide and water vapor. The process leaves no liquid waste and requires no drying step.

The efficiency figures impress. One documented case shows a 99.9% removal rate for organic matter on silicon wafer surfaces within three minutes. A customer case confirms the same 99.9% removal rate for wafer pretreatment. These results explain why display panel production, touch panel production, and wafer processing increasingly rely on this dry method.

The removal rate of organic matter on the silicon wafer surface reaches 99.9%, and the processing time is only 3 minutes.

Consider the comparison with traditional wet cleaning. A world-leading semiconductor manufacturer replaced chemical solvent-based cleaning with excimer technology. The old method left chemical residues and raised environmental concerns. After adoption, the company achieved residue-free cleaning, improved efficiency by 30%, and reduced waste liquid treatment costs. The deep ultraviolet photons at 7.2 eV break most chemical bonds rapidly. Unlike wet chemistry, no secondary contamination occurs from cleaning agents themselves.

Surface Activation for Adhesion

Surface activation transforms inert polymer surfaces into chemically reactive interfaces. The 172nm radiation creates hydroxyl and carbonyl groups on polymer chains. These functional groups increase surface energy and wettability dramatically. You need this treatment before applying inks, coatings, or adhesives to low-energy plastics.

The quantitative improvements demonstrate the value. Semi-crystalline PEEK shows adhesion strength rising from 3 MPa untreated to approximately 20 MPa at 100 mJ/cm² and 25 MPa at 1000 mJ/cm². Amorphous PEEK improves from 5 MPa to the same elevated levels.

Excimer lamps emitting 172nm increase wettability and surface energy across glass, metals, and polymers. This activation serves as an alternative to plasma and corona treatments. PCB manufacturing relies on this step for reliable solder mask adhesion. Automotive part assembly uses it for bonding plastic components. The process integrates seamlessly into "light cleaning" and "light curing" production lines.

Industries adopting this technology include PVC flooring, decorative films, fibreboards, laminates, wood panels, and automotive plastic parts. The primary industrial uses for surface modification continue expanding as manufacturers discover new applications.

Advanced Oxidation and Curing Applications

Beyond surface modification, the 172nm excimer source drives two critical processes: total organic carbon (TOC) degradation in ultrapure water and low-temperature UV curing. Both applications leverage the same high-energy photons to achieve results impossible with conventional technologies.

TOC Degradation in Water

You need ultrapure water with TOC levels below parts-per-billion for semiconductor fabrication and pharmaceutical production. Traditional UV lamps cannot break down stubborn organic compounds effectively. The 172nm wavelength delivers 7.2 eV per photon, enabling advanced oxidation that degrades organic impurities into harmless carbon dioxide and water.

The oxidation potential of this process far exceeds that of conventional UV oxidation methods. You eliminate chemical additives entirely, avoiding secondary contamination. A 172nm Excimer Module integrates directly into water treatment loops, providing continuous TOC reduction without consumable chemicals. Semiconductor fabs rely on this technology to maintain water purity specifications that directly impact device yield. Pharmaceutical manufacturers use the same approach to meet stringent regulatory requirements for water-for-injection systems.

The process operates continuously and requires no regeneration cycles. You monitor TOC levels in real-time and adjust flow rates accordingly. Unlike chemical oxidation methods, this approach leaves no residual byproducts that could compromise downstream processes.

Low-Temperature UV Curing

You face a fundamental challenge when curing adhesives and coatings on heat-sensitive substrates. Conventional mercury lamps emit significant infrared radiation, raising substrate temperatures and causing warping, discoloration, or dimensional changes. The 172nm excimer source solves this problem elegantly.

Unlike conventional medium-pressure mercury UV lamps, excimer lamps emit no IR radiation, resulting in no heat impact on substrates and eliminating the need for elaborate cooling or ozone ventilation.

The thermal stability of excimer technology extends beyond the emission spectrum:

• The surface of an excimer lamp's quartz tube does not get hot (unlike mercury vapor lamps).

• Most excimer lamps run with little-to-no cooling, and are instant ON/OFF with no warm-up or cool-down cycles, confirming thermal stability.

You can cure specialized photopolymer resins at ambient temperatures on plastics, paper, and other delicate materials. High-speed roll-to-roll processes benefit enormously, as you eliminate cooling stations and reduce floor space requirements. The instant ON/OFF capability allows precise energy dosing, preventing over-curing or substrate damage.

Precision applications demand this level of control. When you bond optical components or cure protective coatings on flexible electronics, thermal management becomes critical. A reputable Excimer Lamp Manufacturer will specify the exact energy density required for your resin system, ensuring consistent cure depth without thermal stress.

These advanced oxidation and curing applications represent the second major category of primary industrial uses for this versatile light source. The combination of chemical-free oxidation and cold curing expands manufacturing possibilities across multiple sectors.

The four primary industrial uses—photochemical cleaning, surface activation, TOC degradation, and low-temperature curing—make the 172nm Excimer Lamp essential. You gain precision, cold processing, and chemical-free operation. Industry reports project 10% annual growth. As quality demands rise, adoption of the 172nm Excimer Module will expand. A trusted Excimer Lamp Manufacturer enables next-generation innovation.

FAQ

Does 172nm excimer treatment damage heat-sensitive substrates?

No. The 172nm Excimer Lamp emits no infrared radiation, so substrates remain at ambient temperature. You can process plastics, paper, and flexible electronics without warping, discoloration, or dimensional changes.

How does 172nm surface activation compare to plasma treatment?

Both methods increase surface energy, but excimer offers distinct advantages. You get uniform treatment without vacuum chambers, no electrode contamination, and instant ON/OFF capability. The process integrates inline more easily than plasma systems.

Can you retrofit existing production lines with excimer technology?

Yes. A 172nm Excimer Module mounts directly into current conveyor systems or water treatment loops. You need minimal floor space, no cooling infrastructure, and no chemical storage. Most manufacturers complete integration within days, not weeks.

The artificial intelligence boom is changing more than the way we use technology. Behind every AI model, data center, and intelligent device is a rapidly evolving semiconductor industry that is investing heavily in more advanced chips, higher production capacity, and increasingly precise manufacturing processes.

As AI-driven demand continues to push semiconductor development forward, manufacturers are paying greater attention to every stage of the production process. Advanced chips require not only sophisticated equipment and materials, but also extremely clean and precisely controlled manufacturing environments. One often-overlooked challenge is organic contamination.

Even tiny amounts of organic residue can affect surface properties and process consistency during semiconductor manufacturing. This is one reason why advanced cleaning and surface-treatment technologies are attracting increasing attention.

Among these technologies, 172nm Excimer Lamp solutions offer an interesting approach through high-energy vacuum ultraviolet (VUV) radiation.

Why Does 172nm Light Matter?

A 172nm excimer lamp produces high-energy vacuum ultraviolet radiation that can interact strongly with organic molecules. The energy at this wavelength can break molecular bonds and promote photochemical reactions, making it useful for removing organic contaminants and modifying material surfaces.

Compared with conventional cleaning methods that may depend heavily on chemicals or physical contact, 172nm VUV technology provides a non-contact approach to precision surface treatment.

This makes it attractive for applications where cleanliness, process stability, precision, and equipment integration are important. For semiconductor manufacturing, potential applications include wafer surface cleaning, mask cleaning, organic contamination removal, and surface activation.

From AI Chips to Ultra-Clean Manufacturing

The global AI boom has created enormous demand for advanced semiconductors. However, producing these high-performance chips involves thousands of carefully controlled manufacturing steps. While people often focus on GPU performance, advanced process nodes, high-bandwidth memory, and packaging technologies, the cleanliness of semiconductor surfaces is equally important.

A small amount of organic contamination may appear insignificant, but at the microscopic level, it can interfere with subsequent processing steps. This is why semiconductor manufacturers are constantly exploring more efficient and precise cleaning technologies.

At www.gmyok.com, GMY provides UV and VUV light-source solutions for semiconductor, industrial, environmental, and other precision applications, including 172nm excimer products designed for different cleaning and surface-treatment requirements.

A Practical Solution for Cold Plate Organic Contamination

Semiconductor manufacturing is not the only area where organic contamination matters. Cold plates are increasingly important in high-performance electronics because efficient thermal management is essential for powerful computing systems, AI servers, and other high-density electronic equipment. As computing power continues to increase, manufacturers are looking for better ways to manage heat while maintaining high cleanliness standards.

GMY's 172nm excimer module for cold plate organic particle applications provides a VUV-based solution for addressing organic contamination associated with cold plate processing. The modular design can be integrated into customized equipment and processing systems, giving equipment manufacturers greater flexibility when developing their own cleaning solutions.

For companies working on advanced thermal-management components, 172nm VUV technology provides another option for improving surface cleanliness without relying solely on traditional cleaning processes.

When Smaller Equipment Needs a Smaller Light Source

Not every semiconductor application requires a large production system. Research laboratories, universities, equipment manufacturers, and process-development teams often need compact light sources for testing, prototyping, and small-scale semiconductor processing. This is where GMY's 172nm mini excimer lamp module for Semiconductor Processing can provide a practical solution.

The compact module is designed for semiconductor-related processing applications where installation space and equipment integration are important considerations. It can provide high-energy VUV radiation for organic contamination removal and surface modification while maintaining a compact form factor. For engineers developing new semiconductor processing equipment, a mini excimer module can also make it easier to test VUV technology before moving toward a larger production system.

Beyond Semiconductor Cleaning

The potential applications of 172nm VUV technology extend beyond semiconductor processing. Because of its strong photochemical properties, 172nm excimer technology can also be explored for:

• Organic contamination removal
• Surface activation and modification
• Ultrapure water TOC reduction
• Optical component cleaning
• Display substrate cleaning
• Semiconductor mask cleaning
• Industrial surface treatment
• Photochemical oxidation
• Water purification

One particularly interesting application is ultrapure water treatment. Semiconductor manufacturing requires extremely high-quality water, and controlling total organic carbon (TOC) is an important part of maintaining water purity. High-energy VUV radiation can promote photochemical oxidation reactions that help break down organic compounds. This makes 172nm excimer technology relevant not only to semiconductor surface processing but also to high-purity water applications.

Why Modular VUV Technology Matters

Modern industrial equipment is becoming increasingly customized. Different applications may require different irradiation areas, optical configurations, power levels, installation dimensions, and operating conditions. A standard light source may therefore not always be the most suitable solution. Modular excimer technology offers greater flexibility.

Instead of redesigning an entire system around a fixed lamp, manufacturers can integrate an appropriate VUV module into their existing equipment architecture. This is particularly useful for OEMs and equipment manufacturers developing specialized semiconductor cleaning, surface-treatment, cold plate processing, or water purification systems. At www.gmyok.com, customers can explore GMY's range of UV and VUV light-source products and contact the team to discuss customized requirements and OEM/ODM solutions.

The Future of Semiconductor Manufacturing Is in the Details

The next generation of semiconductor manufacturing will not be defined only by smaller process nodes and more powerful AI chips. It will also depend on countless details: cleaner surfaces, tighter process control, better materials, efficient equipment, and innovative manufacturing technologies. That is why 172nm excimer technology deserves greater attention.

Whether you are developing semiconductor cleaning equipment, researching surface modification, improving cold plate cleanliness, or exploring VUV applications for water purification, the right excimer light source can become an important part of your process.

GMY is committed to providing reliable UV and VUV light-source solutions for semiconductor processing, industrial applications, environmental technologies, and other precision applications. Want to learn more about 172nm excimer technology? Visit www.gmyok.com to explore GMY's 172nm excimer lamp and module solutions, or contact the GMY team to discuss your specific application and customization requirements.

A 172nm Excimer Lamp operates as a cold, quasi-monochromatic Vacuum Ultraviolet (VUV) light source driven by dielectric barrier discharge technology. High-energy photons directly break substrate chemical bonds through photolysis. This photon cleavage action processes materials without transferring thermal radiation to the target surface, allowing manufacturing engineers to achieve damage-free precision processing.

Among modern surface-treatment technologies, 172nm Excimer Lamp solutions offer an advanced, non-thermal approach to high-precision photochemical modification and organic contamination removal.

How a 172nm Excimer Lamp Works

Conventional ultraviolet light sources rely on thermal heating or complex multi-wavelength mercury discharges. In contrast, a 172nm Excimer Lamp generates pure vacuum ultraviolet light through direct electrical excitation of noble gases. The internal lamp operation relies on fundamental atomic physics to convert raw electrical power into high-energy photon output without transferring unwanted heat energy to processing targets.

The excitation sequence begins inside a sealed synthetic quartz discharge envelope filled exclusively with high-purity inert xenon gas. Alternating high-voltage electrical supplies generate a strong electric field across the internal gas volume. This intense electric field accelerates free electrons, driving rapid collisions with ground-state xenon atoms to form temporary diatomic excimer molecules.

Excimer molecules exist exclusively within excited states and dissociate back into individual xenon atoms within nanoseconds. This spontaneous decay releases bound excitation energy directly as single high-energy ultraviolet photons centered tightly at 172nm. The resulting quasi-monochromatic emission spectrum contains zero infrared thermal wavelengths, completely eliminating thermal radiation during sensitive processing.

High-Efficiency Dielectric Barrier Discharge

The dielectric barrier discharge (DBD) method enables continuous, stable generation of noble gas excimers. High-grade synthetic quartz glass serves as an effective dielectric barrier material between external drive electrodes and the xenon gas fill.

Applying high-voltage alternating current creates thousands of uniform micro-discharges across the active surface area every second. This restricts electrical current flow, preventing localized thermal arcing while optimizing energy transfer directly to lightweight electrons.

Operating a 172nm Excimer Lamp yields outstanding energy utilization, achieving an electrical-to-optical conversion efficiency of up to 40%. Industrial systems obtain concentrated vacuum ultraviolet output while maintaining remarkably low operational temperatures.

Non-Thermal Photochemical Processing

Photon energy dictates how light interacts with target matter. A 172nm Excimer Lamp emits VUV photons carrying a specific quantum energy level of 7.2 electron volts (eV). This high photon energy easily exceeds the characteristic molecular bond energies found within most organic compounds, including carbon-carbon (3.6 eV) and carbon-hydrogen (4.3 eV) bonds.

Because 7.2 eV surpasses these chemical thresholds, the light breaks molecular chains directly upon contact via photolysis. Unlike traditional thermal treatments that rely on heat to force chemical reactions, VUV photons interact directly with molecular valence electrons without disturbing lattice vibrations. The target surface undergoes immediate molecular restructuring without experiencing measurable temperature rise.

At www.gmyok.com, GMY provides advanced UV and VUV light-source solutions for precision industrial processing, semiconductor manufacturing, and specialized surface treatment applications.

Preventing Thermal Substrate Damage

Industrial manufacturing environments frequently process delicate, heat-sensitive materials that degrade under conventional thermal treatment. Ultra-thin polymer films such as polypropylene, polyethylene, and PET suffer rapid structural deformation, surface melting, and optical haze when exposed to elevated temperatures.

Cold photochemical processing eliminates these thermal bottlenecks. The focused 172nm light alters only the top molecular layers within an extremely shallow penetration depth of just a few nanometers, leaving bulk substrate materials completely unheated and structurally sound.

For delicate electronic components, flexible display substrates, and semiconductor wafers, GMY's 172nm mini excimer lamp module offers high-energy surface modification and organic cleaning in a compact, easily integrated form factor.

Key Applications and Advantages

Because of its strong photochemical properties and zero-thermal-impact mechanism, 172nm excimer technology is widely applied across advanced manufacturing sectors:

• Optical display functional coating pretreatment
• High-temperature capacitor polymer film modification
• Semiconductor wafer and mask organic particle removal
• Cold plate surface activation and cleaning
• Precision glass and ceramic substrate cleaning
• Ultrapure water TOC reduction
• Damage-free thin film surface energy enhancement

In specialized industrial applications such as electronic thermal management, GMY's 172nm excimer module for cold plate organic particle removal delivers stable VUV irradiation to ensure pristine surface cleanliness without affecting underlying metallic or polymer structures.

Mercury-Free Eco-Design and Modern Integration

Modern high-precision manufacturing facilities increasingly adopt 172nm Excimer Lamps over traditional mercury discharge lamps. Unlike mercury lamps that demand lengthy warm-up times and generate hazardous waste, excimer systems offer instant turn-on/turn-off capabilities, maximizing throughput in automated production environments.

The mercury-free xenon design eliminates toxic material handling, ensuring cleanroom safety while lowering regulatory compliance overhead. With high conversion efficiency and flexible modular dimensions, excimer systems can be smoothly integrated into custom OEM equipment architectures.

Frequently Asked Questions (FAQ)

What makes a 172nm excimer lamp a cold light source?
High-energy 7.2 eV photons cleave molecular bonds directly through photolysis. Because the quasi-monochromatic spectrum emits zero infrared thermal wavelengths, the target substrate undergoes photochemical reactions without experiencing temperature rise.

How efficient is a 172nm excimer lamp system?
The dielectric barrier discharge mechanism transfers electrical energy directly to xenon gas atoms without heating heavy ions, achieving an electrical-to-optical conversion efficiency of up to 40%.

Why do manufacturers prefer mercury-free excimer lamps?
Excimer lamps provide instant switching, superior optical output stability, and complete freedom from toxic mercury hazards, reducing cleanroom maintenance and environmental compliance costs.

GMY is committed to delivering reliable UV and VUV light-source solutions for advanced semiconductor, electronic, and industrial manufacturing. Want to explore 172nm excimer technology for your production line? Visit www.gmyok.com to view our complete product catalog or contact the GMY team for custom OEM/ODM solutions.

From August 2 to 6, 2026, the 65th Annual Rocky Mountain Conference on Magnetic Resonance (RMCMR 2026) was held at the Snowbird Resort & Conference Center in Snowbird, Utah, USA. CIQTEK participated at Booth 8, presenting products and upgrade solutions for Electron Paramagnetic Resonance (EPR) and Nuclear Magnetic Resonance (NMR) research.

RMCMR comprises the EPR Symposium and the Solid-State NMR Symposium. The conference focuses on advances in magnetic resonance and its applications in biological, chemical, engineering, and quantum information sciences, providing a platform for scientific exchange and professional interaction.

Oral Presentation: AI-Enhanced EPR Spectral Processing

On Thursday, August 6, at 9:40 AM, CIQTEK Magnetic Resonance Solution Manager Dr. Jeff Sun delivered an oral presentation in the 2026 EPR Tentative Program session. Titled "Next-Generation EPR: Combining High-Performance Q Band Instrumentation with Artificial Intelligence Enhanced Spectral Processing," the talk demonstrated how CIQTEK integrates high-frequency Q-band hardware with AI-driven algorithms to revolutionize spectral resolution and data efficiency.

Showcasing the l Magnetic Resonance Portfolio

At Booth 8, CIQTEK's display materials covered a range of magnetic resonance products and upgrade solutions, including:

· EPR modernization solutions for existing EPR systems;

· Pulsed EPR product series, including EPR100 and EPR-Q400;

· Continuous-wave EPR product series, including EPR200M and EPR300;

· Solutions related to 400 MHz and 600 MHz NMR spectrometers;

· A compatible upgrade solution for existing NMR systems, designed for 300–600 MHz magnets.

CIQTEK thanks the RMCMR organizing committee and looks forward to continued engagement with the global magnetic resonance research community at future scientific events.

CIQTEK Participates in Microscopy & Microanalysis 2026

August 12, 2026

From August 2 to 6, CIQTEK participated in Microscopy & Microanalysis 2026 (M&M 2026) at the Baird Center in Milwaukee, Wisconsin, USA. At Booth 718, CIQTEK presented its SEM3300 tungsten filament scanning electron microscope and met with conference attendees.

M&M is an annual forum for the science and technology of microscopy and microanalysis. During the event, CIQTEK displayed the SEM3300 tungsten filament SEM at its booth. Through product materials, image displays, and on-site conversations, the team introduced CIQTEK's electron microscopy products and application directions to visitors.

On August 3, CIQTEK delivered a Vendor Tutorial titled:

Unlocking the Power of Unique High-Speed Scanning Electron Microscopy with No Compromise of Superb Imaging Resolution at Low kV for Large Scale Volume Microscopy Applications from CIQTEK

The presentation focused on high-speed scanning electron microscopy for large-scale volume microscopy applications. Attendees joined the presentation and exchanged ideas with the CIQTEK team at the booth.

Throughout the conference, the CIQTEK team welcomed visitors and held conversations on electron microscopy products and related applications. We thank the M&M 2026 organizers and everyone who visited the CIQTEK booth. CIQTEK will continue to develop electron microscopy technologies and products for scientific and industrial users.