In advanced manufacturing industries such as semiconductors, display panels, precision optics, and microelectronics, surface cleanliness can directly influence product quality, process stability, and final manufacturing yield.

Traditional wet cleaning methods often rely on chemicals and solvents. While they can effectively remove contaminants, they may also leave chemical residues and introduce additional cleaning, rinsing, and drying processes. For sensitive and high-precision components, conventional cleaning methods may also create concerns about material damage.

Today, a new dry surface treatment technology based on 172nm excimer light is providing manufacturers with another solution. With its high-energy vacuum ultraviolet radiation and non-contact processing characteristics, 172nm Excimer Lamp technology can remove organic contamination while simultaneously activating the material surface, offering a cleaner and more efficient approach for precision surface treatment.

The Technology Behind It: How Does 172nm Excimer Light Clean and Activate Surfaces?

The 172nm wavelength belongs to the vacuum ultraviolet (VUV) range and provides high-energy photons capable of initiating powerful photochemical reactions. When 172nm VUV radiation reaches organic contaminants on a material surface, the high-energy photons can break molecular bonds and decompose organic compounds.

At the same time, in the presence of oxygen, VUV irradiation promotes the formation of reactive oxygen species that further oxidize and decompose organic residues.This creates a highly effective combination of photolysis and photo-oxidation.The result is a contactless dry-cleaning process that can remove organic contamination from precision surfaces without relying on conventional liquid cleaning agents.

Photochemical Cleaning: Removing Organic Contaminants

The high-energy radiation of a 172nm Excimer Lamp can break down hydrocarbon chains, oil residues, organic contaminants, and other surface impurities.Reactive oxygen species then further oxidize these decomposed compounds, converting organic residues into simpler substances such as CO₂ and H₂O.

This makes 172nm VUV technology particularly suitable for removing microscopic organic contamination before critical manufacturing processes.Unlike mechanical cleaning, the process does not require direct physical contact with the substrate. Compared with conventional wet cleaning, it can also reduce dependence on chemical cleaning agents.

Surface Activation: Improving Hydrophilicity

Cleaning is only one part of the process. The photochemical reaction generated by 172nm excimer light can also modify the chemical characteristics of the material surface. For non-polar materials, VUV irradiation can break hydrocarbon molecular chains and introduce polar hydrophilic groups such as hydroxyl (-OH) and carboxyl (-COOH) groups.

This increases the surface free energy and improves wettability. In practical applications, a surface that was originally hydrophobic can become significantly more hydrophilic after 172nm treatment, creating a better interface for subsequent coating, bonding, printing, and other processes.

The Visible Result: Water Contact Angle Reveals Surface Activation

Water contact angle is one of the most intuitive ways to evaluate surface wettability and surface condition. Before treatment, organic contamination or the naturally low surface energy of certain materials can cause a water droplet to remain rounded on the surface, resulting in a relatively large contact angle.

After treatment with a 172nm Excimer Lamp, the surface can become more hydrophilic, allowing the water droplet to spread across the substrate more easily. Instead of remaining as a spherical droplet, the water can form a more uniform film across the treated surface. This visible change in water contact angle provides a straightforward indication of improved surface wettability.

More importantly, improved wettability can help provide a better surface condition for subsequent manufacturing processes, including:

• Coating

• Thin-film deposition

• Bonding

• Printing

• Adhesive application

• Lamination

For manufacturers working with high-precision materials, improving surface cleanliness and wettability before these processes can contribute to more consistent processing and better adhesion performance.

Multiple Applications: Bringing 172nm VUV Technology to Advanced Manufacturing

The combination of dry cleaning and surface activation makes 172nm excimer technology suitable for a wide range of precision manufacturing applications.

Semiconductor Manufacturing

For semiconductor wafers, MEMS components, and microelectronic devices, 172nm photo-cleaning can be used as a pre-treatment before critical processes such as bonding and thin-film deposition. Removing organic residues from silicon wafer substrates and other precision surfaces can help provide a cleaner interface for subsequent processing.

Display and Optoelectronic Manufacturing

In OLED, LCD, and other display manufacturing processes, surface cleanliness and adhesion are critical. 172nm VUV technology can be used for cleaning substrates, evaporation masks, and other components where microscopic organic residues may affect subsequent coating or deposition processes.

Flexible Films and Polymer Materials

Materials such as PET, PI, PP, PE, PMMA, PC, PVC, and PS can be treated using 172nm VUV surface modification. For roll-to-roll manufacturing, surface activation can improve wettability before coating, printing, laminating, or adhesive bonding, helping create a more suitable interface between different materials.

Precision Metal and Glass

172nm surface treatment can also be applied to materials such as titanium, aluminum foil, silicon wafers, and ITO glass. By modifying surface chemistry and increasing surface energy, the treatment can improve wettability without requiring direct mechanical contact with the substrate.

Medical and Dental Components

Titanium is widely used in medical and dental components because of its excellent mechanical and corrosion-resistant properties. However, surface contamination and low wettability can affect subsequent processing and biological interactions.

Beyond Cleaning: 172nm Excimer Technology for Photocuring and Surface Finishing

The application of 172nm excimer light is not limited to surface cleaning. Because of its high photon energy, 172nm excimer technology can also be used for surface matting and photocuring. The specific wavelength can directly interact with polymer molecular structures and initiate rapid photochemical reactions.

In surface finishing applications, this can help create a controlled micro-textured surface and achieve a more uniform matte appearance while improving surface hardness and scratch resistance.

Potential applications include:

• Specialty coatings

• Structural bonding

• High-precision graphic printing

• High-speed inkjet printing

• 3D printing

• Packaging printing

This makes 172nm technology a versatile light-based solution for both surface preparation and surface finishing.

GMY 172nm Excimer Lamp: Reliable VUV Solutions for Precision Manufacturing

As a professional light-source manufacturer, GMY develops 172nm excimer lamp solutions for advanced surface treatment applications.GMY's technology portfolio covers 172nm photo-cleaning, surface modification, hydrophilic activation, photocuring, and related precision manufacturing applications. Its semiconductor-industry solutions are designed for applications including silicon wafer substrates, semiconductor flat-panel displays, microelectronic ICs, high-precision optical components, photovoltaic manufacturing, biomedicine, and micro-nano manufacturing.

Rather than providing only a standalone light source, GMY can support customers with different levels of integration, from 172nm Excimer Lamps and lamp modules to customized application solutions.

What Makes GMY 172nm Excimer Solutions Different?

• Stable VUV Light Source: GMY develops 172nm excimer light sources for demanding industrial applications where stable and reliable UV output is essential.
• Dry and Non-Contact Processing: 172nm VUV treatment provides a contactless approach to organic contamination removal and surface activation, making it suitable for precision substrates and sensitive components.
• Surface Cleaning and Activation in One Process: Depending on the process configuration, the same 172nm technology can be used to remove organic contamination while improving surface wettability and surface energy.
• Application-Specific Customization: Different substrates and production lines require different irradiation areas, power levels, working distances, and mechanical configurations. GMY provides customized OEM and ODM solutions according to customer requirements.
• From Light Source to Integrated Solution: GMY works with manufacturers and equipment developers to provide solutions ranging from core 172nm excimer light sources to customized modules and application-specific systems.

As advanced manufacturing continues to move toward smaller structures, higher precision, and stricter contamination control, conventional surface treatment methods are facing new challenges. It combines high-energy VUV photochemistry with contactless dry processing to achieve:

• Organic contamination removal

• Surface activation

• Improved hydrophilicity

• Higher surface energy

• Better coating and bonding conditions

• Reduced reliance on wet chemical cleaning

• Flexible integration into precision manufacturing processes

From semiconductor wafers and OLED components to precision optics, flexible films, titanium implants, PCB materials, and advanced coatings, 172nm VUV technology is becoming an increasingly valuable tool for modern surface treatment.

If you are looking for a 172nm Excimer Lamp manufacturer for wafer cleaning, surface activation, hydrophilic modification, photocuring, or customized VUV equipment integration, GMY can provide application-oriented solutions based on your specific process requirements.

Explore GMY's 172nm Excimer Lamp solutions and discover how VUV technology can help improve your surface treatment process.

Explore GMY 172nm Excimer Lamp Solutions

Modern industrial manufacturing demands higher precision, lower thermal budgets, and environmentally sustainable processing techniques. As microelectronics shrink, optical displays become more flexible, and medical devices require stricter biocompatibility, conventional wet chemical etching and high-heat thermal treatments often fall short.

The 172nm excimer lamp has emerged as a critical vacuum ultraviolet (VUV) light source across advanced manufacturing. By operating at a quasi-monochromatic wavelength of 172 nanometers, these lamps deliver high-energy photons capable of breaking molecular bonds directly without thermal degradation.

1. Operating Principles of the 172nm Excimer Lamp

To understand why a 172nm excimer lamp delivers such consistent results across sensitive substrates, it is essential to evaluate its underlying physics: dielectric barrier discharge (DBD) and high-energy photon generation.

Dielectric Barrier Discharge and Xenon Chemistry

Unlike conventional medium-pressure or low-pressure mercury discharge lamps, excimer (excited dimer) lamps do not use an electrode arc in direct contact with the gas mixture. Instead, they rely on a dielectric barrier—typically high-purity synthetic quartz—separating the discharge electrodes from a rare gas filling.

Inside a 172nm excimer lamp, the chamber is filled with pure xenon gas (Xe). When an alternating high-voltage, high-frequency electrical field is applied across the dielectric barrier, a non-equilibrium cold plasma forms. Xenon atoms are excited and collide with neutral ground-state xenon atoms to create transient excimer molecules (Xe₂*):

Xe* + Xe + M → Xe₂* + M

Because the ground state of an excimer molecule is weakly repulsive, the molecule rapidly dissociates (within nanoseconds), releasing a photon at a narrow spectral peak centered precisely at 172 nm:

Xe₂* → 2Xe + hν (172 nm)

The Energy Advantage of Vacuum Ultraviolet Photons

A wavelength of 172 nm falls squarely within the vacuum ultraviolet spectrum. The energy carried by a single photon is inversely proportional to its wavelength, calculated by the Planck-Einstein relation:

E = hc / λ ≈ 7.2 eV

A single 172 nm photon delivers approximately 7.2 electron volts (eV) of energy (roughly 696 kJ/mol). This exceeds the binding energies of most covalent chemical bonds found in organic matter and industrial polymers:

• Carbon-Hydrogen (C-H): ≈ 4.3 eV (413 kJ/mol)

• Carbon-Carbon (C-C): ≈ 3.6 eV (347 kJ/mol)

• Carbon-Oxygen (C-O): ≈ 3.7 eV (358 kJ/mol)

• Silicon-Carbon (Si-C): ≈ 3.3 eV (318 kJ/mol)

Because the photon energy exceeds these dissociation thresholds, the 172nm excimer lamp initiates direct photolysis. Substrate bonds break instantaneously without requiring the material to absorb thermal energy, making it an ideal "cold" process.

2. Core Mechanisms: Photolysis and Reactive Oxygen Species

The processing power of a 172nm excimer lamp relies on two concurrent actions: direct molecular bond breaking and the simultaneous generation of aggressive reactive species.

       172nm VUV Photons (7.2 eV)
             /            \
            /              \
  Direct Bond Cleavage   Ambient Oxygen Absorption
  (C-C, C-H, C-O break)   (O₂ + hν → O(¹D) + O(³P))
            \              /
             \            /
         Active Radical Sites
                  ↓
       Functional Hydrophilic Layer 
       (-OH, -COOH, -CHO groups)

1. Direct Photolysis of Contaminants: Trace organic residues, processing oils, photoresist leftovers, and release agents on the substrate absorb 172nm radiation strongly. The VUV photons snap the polymer backbone, converting heavy macromolecules into smaller volatile fragments.

2. Singlet Oxygen and Ozone Generation: In the presence of ambient or controlled oxygen (O₂), 172nm photons are intensely absorbed. This breaks the molecular oxygen bond to yield ground-state atomic oxygen (O(³P)) and excited-state singlet oxygen (O(¹D)). These radicals react with oxygen to form ozone (O₃).

3. Oxidative Desorption: The atomic oxygen and ozone react with the cleaved hydrocarbon fragments, oxidizing them into benign, volatile byproducts such as carbon dioxide (CO₂), water vapor (H₂O), and trace nitrogen oxides (NOₓ), which are swept away by local exhaust ventilation.

4. Surface Functionalization: On clean base materials (such as polyimide, PET, or glass), the broken bonds leave free surface radicals. These instantly bond with oxygen and ambient moisture to create polar, hydrophilic functional groups such as hydroxyl (-OH), carboxyl (-COOH), and carbonyl (-C=O). This drastically reduces the water contact angle and elevates surface free energy.

3. Key Industrial Applications

The combination of dry photochemical cleaning, a zero-mercury footprint, and low process temperatures makes the 172nm excimer lamp essential across several high-precision sectors.

Semiconductor and Advanced Packaging

In wafer processing, wire bonding, and wafer-to-wafer direct bonding, atomic-scale interface cleanliness dictates final yield. Residues left behind by chemical-mechanical planarization (CMP) slurries or organic solvents compromise bond strength and introduce structural voids.

Using a 172nm excimer lamp allows fabs to clean silicon wafers, silicon carbide (SiC), and gallium nitride (GaN) wafers without the physical abrasion of scrubbers or the environmental hazards of wet solvent benches.

Flat Panel Displays and Flexible Electronics

Display manufacturing—including OLED, QLED, and micro-LED lines—relies on ultra-clean thin-film transistors (TFTs) and uniform surface tension across large glass and polyimide sheets.

• A 172nm system increases surface wettability, enabling optical adhesives, coatings, and inkjet-printed quantum dots to wet out uniformly without pinholes or edge dewetting.

• Because the process generates virtually zero radiant infrared heat, ultra-thin polymer substrates (such as 10 μm to 25 μm polyimide films) remain mechanically stable without curling or warping.

Industrial Coatings and Excimer Matting

In high-end automotive interior trim, architectural flooring, and specialty foils, manufacturers often require deep-matte, soft-touch, yet scratch-resistant finishes.

• When applied to specialized UV-curable acrylate coatings, the shallow penetration depth of 172nm VUV light initiates rapid polymerization of only the top few tens of nanometers of the wet resin.

• This microscopic top skin shrinks and micro-folds while the underlying resin remains fluid.

• Subsequent exposure to longer-wavelength UV sources (such as 365nm or 395nm UV LEDs) cures the bulk layer beneath, locking the micro-folded texture in place. This delivers a uniform physical matting effect without requiring chemical silica matting agents, yielding superior anti-fingerprint and scratch-resistant properties.

Medical Device Manufacturing

Medical components such as catheters, microfluidic chips, and diagnostic cassettes frequently utilize inert engineering plastics (like cyclic olefin copolymers, PEEK, or PTFE). These plastics have low surface energy, making them difficult to print, coat, or bond with medical-grade adhesives.

VUV treatment with a 172nm excimer lamp functionalizes these inert plastics rapidly, yielding robust hydrophilic properties that pass stringent peel tests and maintain bond integrity without introducing toxic chemical primers.

4. Comparing 172nm Excimer Technology to Alternative Methods

Engineers evaluating surface treatment techniques often balance excimer technology against traditional low-pressure mercury lamps, atmospheric plasma, and corona discharge.

172nm Excimer vs. Low-Pressure Mercury Lamps

Low-pressure mercury lamps emit primarily at 254 nm and 185 nm. While the 185 nm line generates ozone, its photon energy (6.7 eV) is lower than that of 172 nm (7.2 eV), leading to significantly slower bond-cleavage rates on refractory organics.

Furthermore, mercury lamps emit considerable infrared heat and broad-spectrum energy, raising substrate temperatures. Mercury lamps also require long warm-up and restrike cycles, whereas dielectric barrier discharge excimer lamps turn on and off instantly.

From an environmental and regulatory standpoint, global initiatives such as the Minamata Convention on Mercury continue to restrict mercury usage, driving manufacturers toward mercury-free excimer configurations.

172nm Excimer vs. Atmospheric Plasma and Corona

Atmospheric plasma and corona discharge treat surfaces via accelerated ions, electrons, and reactive gas jets. While cost-effective for coarse packaging films, plasma and corona methods exhibit limitations on delicate parts:

• Micro-Arcing and ESD: Plasma poses an electrostatic discharge (ESD) risk to sensitive microelectronics, integrated circuits, and active TFT layers. A 172nm excimer lamp works strictly through non-ionizing optical radiation, eliminating electrical charge accumulation.

• Surface Pitting: The kinetic impact of ions in atmospheric plasma torches can physically erode or pit ultra-smooth optical surfaces. 172nm photolysis leaves the underlying physical morphology completely unaltered down to sub-nanometer roughness.

• Uniformity over Wide Areas: Corona and plasma jets suffer from uneven nozzle wear and aerodynamic boundary layer variations across wide webs. Excimer tubular lamps deliver uniform photon flux across broad substrate widths.

5. Engineering and Integration Guide for B2B Buyers

Integrating a 172nm excimer lamp into an automated roll-to-roll line, cleanroom conveyor, or indexing station requires careful attention to optical path mechanics, thermal management, and safety protocols.

Controlling the Process Atmosphere (Nitrogen Purging)

Atmospheric air contains approximately 21% molecular oxygen. Because 172nm photons are strongly absorbed by oxygen, VUV light attenuates over short travel distances in standard air:

Transmission: I = I₀ × e^(-αpx)

To prevent premature photon loss before the light strikes the target substrate, the optical path must be enclosed and purged with high-purity industrial nitrogen (N₂).

• Maintaining an oxygen concentration between 10 ppm and 500 ppm in the working gap allows maximum VUV energy to strike the substrate while retaining just enough trace oxygen to produce functional singlet oxygen.

• The gap distance between the lamp quartz face and the substrate is typically engineered between 1 mm and 5 mm to minimize purge volume and maximize photon flux.

Lamp Geometries and Integration

Depending on the production format, industrial excimer systems utilize distinct physical configurations:

• Linear Tubular Lamps: These provide continuous, uniform exposure zones across web widths spanning from 100 mm to over 2,000 mm, making them standard for roll-to-roll film lines, wide glass cleaning, and continuous sheet lines.

• Flat Panel/Planar Configurations: Planar excimer configurations provide wide, uniform two-dimensional irradiation for static chamber batch processing, wafer chucks, and microfluidic plate bonding.

Thermal Dissipation and Power Supply Matching

Although excimer discharge is inherently cold, the electrical efficiency of VUV generation results in a portion of input power converting into ambient quartz heating.

• System builders must match the excimer lamp with a dedicated high-frequency, high-voltage resonant inverter power supply.

• Controlled cooling—via filtered laminar nitrogen flow, dry clean air (CDA) shrouds, or integrated water-cooled electrode blocks—ensures stable operating temperatures and protects the quartz dielectric seal, extending lamp life beyond 3,000 to 5,000 operating hours.

6. Sourcing Industrial Optical Solutions from GMY

Selecting the right light source requires pairing component specifications with production line mechanics. Industrial sourcing teams must verify electrical matching, spectral emission purity, and quartz material standards to avoid mid-run process variations.

For technical teams seeking reliable VUV integration, GMY develops professional lighting and industrial optical solutions engineered to rigorous industrial tolerances. GMY provides comprehensive design support, helping systems integrators and factory managers deploy lighting configurations that match their exact dimensional constraints and throughput targets.

By visiting www.gmyok.com, process engineers and procurement specialists can access detailed product data, explore industrial lighting portfolios, and discuss specialized OEM/ODM manufacturing requirements directly with technical experts.

Frequently Asked Questions (FAQ)

What is the typical service life of an industrial 172nm excimer lamp?

Industrial 172nm excimer lamps typically offer an operating lifespan between 3,000 and 5,000 hours, depending on operating duty cycles, electrical frequency matching, and thermal management. Because there are no internal metal filaments or electrodes to sputter onto the quartz envelope, excimer lamps deliver superior lumen maintenance and slower output decay compared to mercury arc lamps.

Why is nitrogen purging necessary when operating a 172nm excimer lamp?

Photons at 172 nm are readily absorbed by standard atmospheric oxygen. If operated in ambient room air, the VUV energy is completely absorbed within a few millimeters, converting the oxygen to ozone without reaching the target surface. Purging the chamber with industrial nitrogen allows the VUV photons to travel efficiently to the substrate while precisely metering the reactive species generated at the boundary layer.

Does 172nm treatment damage delicate thin films or transparent conductive oxides (TCO)?

Because 172nm treatment relies on photochemical bond cleavage rather than physical ion bombardment or intense heat, it preserves the physical topography and bulk crystalline properties of the material. When calibrated to the appropriate line speed and dosage, it cleans and functionalizes transparent conductive layers (such as ITO or silver nanowires) without causing optical hazing, thermal deformation, or resistivity spikes.

How do operators manage ozone generated during 172nm excimer operation?

Any exhaust containing residual ozone from the process chamber must be routed through a dedicated industrial ozone decomposer. These systems typically utilize thermal destruct units or manganese dioxide/copper oxide catalytic filters to safely break ozone (O₃) back down into standard molecular oxygen (O₂) prior to facility exhaust discharge.

Advance Your Precision Surface Treatment Line

Whether retrofitting an existing display production line, enhancing wafer-bonding adhesion, or developing next-generation ultra-matte industrial coatings, incorporating a high-performance 172nm excimer lamp provides non-destructive, mercury-free, cold-surface processing.

Visit GMY today to explore industrial light source configurations, request technical specifications, and connect with optical engineers ready to support your manufacturing goals.

Explore GMY 172nm Excimer Lamp Solutions

• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification. This architecture maximizes sensitivity and spectral resolution, enabling complex metal hyperfine coupling analysis and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets. The model automates spectral fitting, component characterization, and experimental report generation, and offers predictive guidance for follow-up experiments.

• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification, delivering enhanced sensitivity and spectral resolution for complex metal hyperfine couplings and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets, achieving 99.9% precision for simulations and 92% for real-world samples. The model automates spectral fitting, component characterization, and experimental report generation, and offers predictive guidance for follow-up experiments.

• EPR instruments from X-band benchtop systems to advanced Q-band and W-band platforms
• CAN400 and CAN600 solution NMR spectrometers
• Modernization solutions for existing EPR and NMR systems
• EPRMind, an AI-powered EPR spectral analysis platform

CIQTEK at EFEPR 2026: Next-Generation Q-Band EPR and AI-Driven Spectral Processing

• High-performance Q-band hardware — a pulsed EPR system achieving sub-10-nanosecond π/2 pulse excitation via solid-state power amplification, delivering enhanced sensitivity and spectral resolution for complex metal hyperfine couplings and high-resolution DEER distance mapping.
• AI-driven spectral analysis — a dedicated three-layer AI model for EPR, trained on over 100,000 real and simulated datasets, which automates spectral fitting, component characterization, and experimental report generation while offering predictive guidance for follow-up experiments.

• EPR instruments from X-band benchtop systems to advanced Q-band and W-band platforms
• CAN400 and CAN600 solution NMR spectrometers
• Modernization solutions for existing EPR and NMR systems
• EPRMind, an AI-powered EPR spectral analysis platform

The primary industrial uses for a 172nm excimer light source are surface cleaning, surface activation, TOC degradation, and UV curing. These 7.2 eV photons break molecular bonds without heat, creating a cold, chemical-free process. You will find this technology critical in semiconductor fabrication, display manufacturing, and ultrapure water treatment. This article details each application's mechanism and industrial advantages.

Key Takeaways

• 172nm excimer light removes organic dirt from surfaces without chemicals or heat.

• It makes plastic surfaces sticky by creating new bonds, improving paint and glue attachment.

• It breaks down organic waste in water and cures coatings at room temperature, saving energy.

Primary Industrial Uses in Surface Modification

Photochemical cleaning and surface activation represent the two dominant surface modification applications for this technology. Both processes exploit the high-energy photons to alter surface chemistry without thermal damage.

Photochemical Cleaning

You will find photochemical cleaning essential for removing organic contaminants from precision substrates. Silicon wafers, glass panels, and optical components arrive with photoresist residues, oils, and fingerprints that compromise performance. The 172nm Excimer Lamp breaks carbon-carbon and carbon-hydrogen bonds directly. Simultaneously, the radiation generates ozone from ambient oxygen. This ozone oxidizes the fragmented residues into volatile carbon dioxide and water vapor. The process leaves no liquid waste and requires no drying step.

The efficiency figures impress. One documented case shows a 99.9% removal rate for organic matter on silicon wafer surfaces within three minutes. A customer case confirms the same 99.9% removal rate for wafer pretreatment. These results explain why display panel production, touch panel production, and wafer processing increasingly rely on this dry method.

The removal rate of organic matter on the silicon wafer surface reaches 99.9%, and the processing time is only 3 minutes.

Consider the comparison with traditional wet cleaning. A world-leading semiconductor manufacturer replaced chemical solvent-based cleaning with excimer technology. The old method left chemical residues and raised environmental concerns. After adoption, the company achieved residue-free cleaning, improved efficiency by 30%, and reduced waste liquid treatment costs. The deep ultraviolet photons at 7.2 eV break most chemical bonds rapidly. Unlike wet chemistry, no secondary contamination occurs from cleaning agents themselves.

Surface Activation for Adhesion

Surface activation transforms inert polymer surfaces into chemically reactive interfaces. The 172nm radiation creates hydroxyl and carbonyl groups on polymer chains. These functional groups increase surface energy and wettability dramatically. You need this treatment before applying inks, coatings, or adhesives to low-energy plastics.

The quantitative improvements demonstrate the value. Semi-crystalline PEEK shows adhesion strength rising from 3 MPa untreated to approximately 20 MPa at 100 mJ/cm² and 25 MPa at 1000 mJ/cm². Amorphous PEEK improves from 5 MPa to the same elevated levels.

Excimer lamps emitting 172nm increase wettability and surface energy across glass, metals, and polymers. This activation serves as an alternative to plasma and corona treatments. PCB manufacturing relies on this step for reliable solder mask adhesion. Automotive part assembly uses it for bonding plastic components. The process integrates seamlessly into "light cleaning" and "light curing" production lines.

Industries adopting this technology include PVC flooring, decorative films, fibreboards, laminates, wood panels, and automotive plastic parts. The primary industrial uses for surface modification continue expanding as manufacturers discover new applications.

Advanced Oxidation and Curing Applications

Beyond surface modification, the 172nm excimer source drives two critical processes: total organic carbon (TOC) degradation in ultrapure water and low-temperature UV curing. Both applications leverage the same high-energy photons to achieve results impossible with conventional technologies.

TOC Degradation in Water

You need ultrapure water with TOC levels below parts-per-billion for semiconductor fabrication and pharmaceutical production. Traditional UV lamps cannot break down stubborn organic compounds effectively. The 172nm wavelength delivers 7.2 eV per photon, enabling advanced oxidation that degrades organic impurities into harmless carbon dioxide and water.

The oxidation potential of this process far exceeds that of conventional UV oxidation methods. You eliminate chemical additives entirely, avoiding secondary contamination. A 172nm Excimer Module integrates directly into water treatment loops, providing continuous TOC reduction without consumable chemicals. Semiconductor fabs rely on this technology to maintain water purity specifications that directly impact device yield. Pharmaceutical manufacturers use the same approach to meet stringent regulatory requirements for water-for-injection systems.

The process operates continuously and requires no regeneration cycles. You monitor TOC levels in real-time and adjust flow rates accordingly. Unlike chemical oxidation methods, this approach leaves no residual byproducts that could compromise downstream processes.

Low-Temperature UV Curing

You face a fundamental challenge when curing adhesives and coatings on heat-sensitive substrates. Conventional mercury lamps emit significant infrared radiation, raising substrate temperatures and causing warping, discoloration, or dimensional changes. The 172nm excimer source solves this problem elegantly.

Unlike conventional medium-pressure mercury UV lamps, excimer lamps emit no IR radiation, resulting in no heat impact on substrates and eliminating the need for elaborate cooling or ozone ventilation.

The thermal stability of excimer technology extends beyond the emission spectrum:

• The surface of an excimer lamp's quartz tube does not get hot (unlike mercury vapor lamps).

• Most excimer lamps run with little-to-no cooling, and are instant ON/OFF with no warm-up or cool-down cycles, confirming thermal stability.

You can cure specialized photopolymer resins at ambient temperatures on plastics, paper, and other delicate materials. High-speed roll-to-roll processes benefit enormously, as you eliminate cooling stations and reduce floor space requirements. The instant ON/OFF capability allows precise energy dosing, preventing over-curing or substrate damage.

Precision applications demand this level of control. When you bond optical components or cure protective coatings on flexible electronics, thermal management becomes critical. A reputable Excimer Lamp Manufacturer will specify the exact energy density required for your resin system, ensuring consistent cure depth without thermal stress.

These advanced oxidation and curing applications represent the second major category of primary industrial uses for this versatile light source. The combination of chemical-free oxidation and cold curing expands manufacturing possibilities across multiple sectors.

The four primary industrial uses—photochemical cleaning, surface activation, TOC degradation, and low-temperature curing—make the 172nm Excimer Lamp essential. You gain precision, cold processing, and chemical-free operation. Industry reports project 10% annual growth. As quality demands rise, adoption of the 172nm Excimer Module will expand. A trusted Excimer Lamp Manufacturer enables next-generation innovation.

FAQ

Does 172nm excimer treatment damage heat-sensitive substrates?

No. The 172nm Excimer Lamp emits no infrared radiation, so substrates remain at ambient temperature. You can process plastics, paper, and flexible electronics without warping, discoloration, or dimensional changes.

How does 172nm surface activation compare to plasma treatment?

Both methods increase surface energy, but excimer offers distinct advantages. You get uniform treatment without vacuum chambers, no electrode contamination, and instant ON/OFF capability. The process integrates inline more easily than plasma systems.

Can you retrofit existing production lines with excimer technology?

Yes. A 172nm Excimer Module mounts directly into current conveyor systems or water treatment loops. You need minimal floor space, no cooling infrastructure, and no chemical storage. Most manufacturers complete integration within days, not weeks.

The artificial intelligence boom is changing more than the way we use technology. Behind every AI model, data center, and intelligent device is a rapidly evolving semiconductor industry that is investing heavily in more advanced chips, higher production capacity, and increasingly precise manufacturing processes.

As AI-driven demand continues to push semiconductor development forward, manufacturers are paying greater attention to every stage of the production process. Advanced chips require not only sophisticated equipment and materials, but also extremely clean and precisely controlled manufacturing environments. One often-overlooked challenge is organic contamination.

Even tiny amounts of organic residue can affect surface properties and process consistency during semiconductor manufacturing. This is one reason why advanced cleaning and surface-treatment technologies are attracting increasing attention.

Among these technologies, 172nm Excimer Lamp solutions offer an interesting approach through high-energy vacuum ultraviolet (VUV) radiation.

Why Does 172nm Light Matter?

A 172nm excimer lamp produces high-energy vacuum ultraviolet radiation that can interact strongly with organic molecules. The energy at this wavelength can break molecular bonds and promote photochemical reactions, making it useful for removing organic contaminants and modifying material surfaces.

Compared with conventional cleaning methods that may depend heavily on chemicals or physical contact, 172nm VUV technology provides a non-contact approach to precision surface treatment.

This makes it attractive for applications where cleanliness, process stability, precision, and equipment integration are important. For semiconductor manufacturing, potential applications include wafer surface cleaning, mask cleaning, organic contamination removal, and surface activation.

From AI Chips to Ultra-Clean Manufacturing

The global AI boom has created enormous demand for advanced semiconductors. However, producing these high-performance chips involves thousands of carefully controlled manufacturing steps. While people often focus on GPU performance, advanced process nodes, high-bandwidth memory, and packaging technologies, the cleanliness of semiconductor surfaces is equally important.

A small amount of organic contamination may appear insignificant, but at the microscopic level, it can interfere with subsequent processing steps. This is why semiconductor manufacturers are constantly exploring more efficient and precise cleaning technologies.

At www.gmyok.com, GMY provides UV and VUV light-source solutions for semiconductor, industrial, environmental, and other precision applications, including 172nm excimer products designed for different cleaning and surface-treatment requirements.

A Practical Solution for Cold Plate Organic Contamination

Semiconductor manufacturing is not the only area where organic contamination matters. Cold plates are increasingly important in high-performance electronics because efficient thermal management is essential for powerful computing systems, AI servers, and other high-density electronic equipment. As computing power continues to increase, manufacturers are looking for better ways to manage heat while maintaining high cleanliness standards.

GMY's 172nm excimer module for cold plate organic particle applications provides a VUV-based solution for addressing organic contamination associated with cold plate processing. The modular design can be integrated into customized equipment and processing systems, giving equipment manufacturers greater flexibility when developing their own cleaning solutions.

For companies working on advanced thermal-management components, 172nm VUV technology provides another option for improving surface cleanliness without relying solely on traditional cleaning processes.

When Smaller Equipment Needs a Smaller Light Source

Not every semiconductor application requires a large production system. Research laboratories, universities, equipment manufacturers, and process-development teams often need compact light sources for testing, prototyping, and small-scale semiconductor processing. This is where GMY's 172nm mini excimer lamp module for Semiconductor Processing can provide a practical solution.

The compact module is designed for semiconductor-related processing applications where installation space and equipment integration are important considerations. It can provide high-energy VUV radiation for organic contamination removal and surface modification while maintaining a compact form factor. For engineers developing new semiconductor processing equipment, a mini excimer module can also make it easier to test VUV technology before moving toward a larger production system.

Beyond Semiconductor Cleaning

The potential applications of 172nm VUV technology extend beyond semiconductor processing. Because of its strong photochemical properties, 172nm excimer technology can also be explored for:

• Organic contamination removal
• Surface activation and modification
• Ultrapure water TOC reduction
• Optical component cleaning
• Display substrate cleaning
• Semiconductor mask cleaning
• Industrial surface treatment
• Photochemical oxidation
• Water purification

One particularly interesting application is ultrapure water treatment. Semiconductor manufacturing requires extremely high-quality water, and controlling total organic carbon (TOC) is an important part of maintaining water purity. High-energy VUV radiation can promote photochemical oxidation reactions that help break down organic compounds. This makes 172nm excimer technology relevant not only to semiconductor surface processing but also to high-purity water applications.

Why Modular VUV Technology Matters

Modern industrial equipment is becoming increasingly customized. Different applications may require different irradiation areas, optical configurations, power levels, installation dimensions, and operating conditions. A standard light source may therefore not always be the most suitable solution. Modular excimer technology offers greater flexibility.

Instead of redesigning an entire system around a fixed lamp, manufacturers can integrate an appropriate VUV module into their existing equipment architecture. This is particularly useful for OEMs and equipment manufacturers developing specialized semiconductor cleaning, surface-treatment, cold plate processing, or water purification systems. At www.gmyok.com, customers can explore GMY's range of UV and VUV light-source products and contact the team to discuss customized requirements and OEM/ODM solutions.

The Future of Semiconductor Manufacturing Is in the Details

The next generation of semiconductor manufacturing will not be defined only by smaller process nodes and more powerful AI chips. It will also depend on countless details: cleaner surfaces, tighter process control, better materials, efficient equipment, and innovative manufacturing technologies. That is why 172nm excimer technology deserves greater attention.

Whether you are developing semiconductor cleaning equipment, researching surface modification, improving cold plate cleanliness, or exploring VUV applications for water purification, the right excimer light source can become an important part of your process.

GMY is committed to providing reliable UV and VUV light-source solutions for semiconductor processing, industrial applications, environmental technologies, and other precision applications. Want to learn more about 172nm excimer technology? Visit www.gmyok.com to explore GMY's 172nm excimer lamp and module solutions, or contact the GMY team to discuss your specific application and customization requirements.

A 172nm Excimer Lamp operates as a cold, quasi-monochromatic Vacuum Ultraviolet (VUV) light source driven by dielectric barrier discharge technology. High-energy photons directly break substrate chemical bonds through photolysis. This photon cleavage action processes materials without transferring thermal radiation to the target surface, allowing manufacturing engineers to achieve damage-free precision processing.

Among modern surface-treatment technologies, 172nm Excimer Lamp solutions offer an advanced, non-thermal approach to high-precision photochemical modification and organic contamination removal.

How a 172nm Excimer Lamp Works

Conventional ultraviolet light sources rely on thermal heating or complex multi-wavelength mercury discharges. In contrast, a 172nm Excimer Lamp generates pure vacuum ultraviolet light through direct electrical excitation of noble gases. The internal lamp operation relies on fundamental atomic physics to convert raw electrical power into high-energy photon output without transferring unwanted heat energy to processing targets.

The excitation sequence begins inside a sealed synthetic quartz discharge envelope filled exclusively with high-purity inert xenon gas. Alternating high-voltage electrical supplies generate a strong electric field across the internal gas volume. This intense electric field accelerates free electrons, driving rapid collisions with ground-state xenon atoms to form temporary diatomic excimer molecules.

Excimer molecules exist exclusively within excited states and dissociate back into individual xenon atoms within nanoseconds. This spontaneous decay releases bound excitation energy directly as single high-energy ultraviolet photons centered tightly at 172nm. The resulting quasi-monochromatic emission spectrum contains zero infrared thermal wavelengths, completely eliminating thermal radiation during sensitive processing.

High-Efficiency Dielectric Barrier Discharge

The dielectric barrier discharge (DBD) method enables continuous, stable generation of noble gas excimers. High-grade synthetic quartz glass serves as an effective dielectric barrier material between external drive electrodes and the xenon gas fill.

Applying high-voltage alternating current creates thousands of uniform micro-discharges across the active surface area every second. This restricts electrical current flow, preventing localized thermal arcing while optimizing energy transfer directly to lightweight electrons.

Operating a 172nm Excimer Lamp yields outstanding energy utilization, achieving an electrical-to-optical conversion efficiency of up to 40%. Industrial systems obtain concentrated vacuum ultraviolet output while maintaining remarkably low operational temperatures.

Non-Thermal Photochemical Processing

Photon energy dictates how light interacts with target matter. A 172nm Excimer Lamp emits VUV photons carrying a specific quantum energy level of 7.2 electron volts (eV). This high photon energy easily exceeds the characteristic molecular bond energies found within most organic compounds, including carbon-carbon (3.6 eV) and carbon-hydrogen (4.3 eV) bonds.

Because 7.2 eV surpasses these chemical thresholds, the light breaks molecular chains directly upon contact via photolysis. Unlike traditional thermal treatments that rely on heat to force chemical reactions, VUV photons interact directly with molecular valence electrons without disturbing lattice vibrations. The target surface undergoes immediate molecular restructuring without experiencing measurable temperature rise.

At www.gmyok.com, GMY provides advanced UV and VUV light-source solutions for precision industrial processing, semiconductor manufacturing, and specialized surface treatment applications.

Preventing Thermal Substrate Damage

Industrial manufacturing environments frequently process delicate, heat-sensitive materials that degrade under conventional thermal treatment. Ultra-thin polymer films such as polypropylene, polyethylene, and PET suffer rapid structural deformation, surface melting, and optical haze when exposed to elevated temperatures.

Cold photochemical processing eliminates these thermal bottlenecks. The focused 172nm light alters only the top molecular layers within an extremely shallow penetration depth of just a few nanometers, leaving bulk substrate materials completely unheated and structurally sound.

For delicate electronic components, flexible display substrates, and semiconductor wafers, GMY's 172nm mini excimer lamp module offers high-energy surface modification and organic cleaning in a compact, easily integrated form factor.

Key Applications and Advantages

Because of its strong photochemical properties and zero-thermal-impact mechanism, 172nm excimer technology is widely applied across advanced manufacturing sectors:

• Optical display functional coating pretreatment
• High-temperature capacitor polymer film modification
• Semiconductor wafer and mask organic particle removal
• Cold plate surface activation and cleaning
• Precision glass and ceramic substrate cleaning
• Ultrapure water TOC reduction
• Damage-free thin film surface energy enhancement

In specialized industrial applications such as electronic thermal management, GMY's 172nm excimer module for cold plate organic particle removal delivers stable VUV irradiation to ensure pristine surface cleanliness without affecting underlying metallic or polymer structures.

Mercury-Free Eco-Design and Modern Integration

Modern high-precision manufacturing facilities increasingly adopt 172nm Excimer Lamps over traditional mercury discharge lamps. Unlike mercury lamps that demand lengthy warm-up times and generate hazardous waste, excimer systems offer instant turn-on/turn-off capabilities, maximizing throughput in automated production environments.

The mercury-free xenon design eliminates toxic material handling, ensuring cleanroom safety while lowering regulatory compliance overhead. With high conversion efficiency and flexible modular dimensions, excimer systems can be smoothly integrated into custom OEM equipment architectures.

Frequently Asked Questions (FAQ)

What makes a 172nm excimer lamp a cold light source?
High-energy 7.2 eV photons cleave molecular bonds directly through photolysis. Because the quasi-monochromatic spectrum emits zero infrared thermal wavelengths, the target substrate undergoes photochemical reactions without experiencing temperature rise.

How efficient is a 172nm excimer lamp system?
The dielectric barrier discharge mechanism transfers electrical energy directly to xenon gas atoms without heating heavy ions, achieving an electrical-to-optical conversion efficiency of up to 40%.

Why do manufacturers prefer mercury-free excimer lamps?
Excimer lamps provide instant switching, superior optical output stability, and complete freedom from toxic mercury hazards, reducing cleanroom maintenance and environmental compliance costs.

GMY is committed to delivering reliable UV and VUV light-source solutions for advanced semiconductor, electronic, and industrial manufacturing. Want to explore 172nm excimer technology for your production line? Visit www.gmyok.com to view our complete product catalog or contact the GMY team for custom OEM/ODM solutions.

From August 2 to 6, 2026, the 65th Annual Rocky Mountain Conference on Magnetic Resonance (RMCMR 2026) was held at the Snowbird Resort & Conference Center in Snowbird, Utah, USA. CIQTEK participated at Booth 8, presenting products and upgrade solutions for Electron Paramagnetic Resonance (EPR) and Nuclear Magnetic Resonance (NMR) research.

RMCMR comprises the EPR Symposium and the Solid-State NMR Symposium. The conference focuses on advances in magnetic resonance and its applications in biological, chemical, engineering, and quantum information sciences, providing a platform for scientific exchange and professional interaction.

Oral Presentation: AI-Enhanced EPR Spectral Processing

On Thursday, August 6, at 9:40 AM, CIQTEK Magnetic Resonance Solution Manager Dr. Jeff Sun delivered an oral presentation in the 2026 EPR Tentative Program session. Titled "Next-Generation EPR: Combining High-Performance Q Band Instrumentation with Artificial Intelligence Enhanced Spectral Processing," the talk demonstrated how CIQTEK integrates high-frequency Q-band hardware with AI-driven algorithms to revolutionize spectral resolution and data efficiency.

Showcasing the l Magnetic Resonance Portfolio

At Booth 8, CIQTEK's display materials covered a range of magnetic resonance products and upgrade solutions, including:

· EPR modernization solutions for existing EPR systems;

· Pulsed EPR product series, including EPR100 and EPR-Q400;

· Continuous-wave EPR product series, including EPR200M and EPR300;

· Solutions related to 400 MHz and 600 MHz NMR spectrometers;

· A compatible upgrade solution for existing NMR systems, designed for 300–600 MHz magnets.

CIQTEK thanks the RMCMR organizing committee and looks forward to continued engagement with the global magnetic resonance research community at future scientific events.