The 2nd IESMAT Electron Microscopy Day was successfully held on November 6, 2025, in Madrid, Spain, bringing together dozens of microscopy experts, researchers, and professionals from Spain and Portugal. The event served as a valuable platform for sharing knowledge, exploring the latest microscopy technologies, and strengthening connections within the Iberian microscopy community.

As CIQTEK’s official partner in Spain and Portugal, IESMAT provides localized support and professional service for CIQTEK electron microscopy solutions in the region. This year, the event was also recognized by the Portuguese Society of Microscopy, further expanding its reach and influence among the scientific and industrial communities.

During the meeting, IESMAT presented an in-depth introduction to CIQTEK’s electron microscope product portfolio, highlighting advanced features and application advantages of the CIQTEK SEM series. A live demonstration using the CIQTEK Tungsten Filament SEM3200 allowed attendees to experience its high-resolution imaging capabilities and intuitive operation firsthand. The hands-on session sparked active discussions, with many participants engaging directly with IESMAT experts for technical insights and practical guidance.

IESMAT Demonstrating the CIQTEK SEM3200

The event also featured a series of technical presentations and open discussions on microscopy applications across materials science, nanotechnology, and life sciences, reflecting the growing interest and demand for high-performance, user-friendly microscopy tools in the Iberian market.

Looking ahead, CIQTEK and IESMAT will continue to deepen their collaboration to provide cutting-edge electron microscopy technologies, comprehensive customer support, and training opportunities to researchers and laboratories in Spain and Portugal. Together, they aim to empower scientific discovery and innovation through accessible, high-quality instrumentation.

The TRITON-TI represents the pinnacle of dive watch engineering, merging advanced materials with sustainable technology. Crafted from aerospace-grade titanium, this remarkable timepiece weighs 57% less than traditional stainless steel while offering 10 times superior corrosion resistance - making it equally suited for deep-sea exploration and everyday sophistication.

What truly sets the TRITON-TI apart is its innovative solar-powered movement. Harnessing energy from both natural and artificial light sources, it delivers up to 180 days of continuous operation on a full charge, eliminating battery anxiety forever. Professional divers will appreciate its 300-meter water resistance, complemented by a high-temperature fired ceramic bezel and quick-glow luminous markers that ensure perfect readability in the deepest waters.

The watch features a unidirectional rotating bezel for safe dive timing, a secure screw-down titanium crown, and an optical-grade crystal that provides exceptional dial clarity. The subtle matte-gray finish exudes understated elegance, while the silicone strap with titanium buckle offers all-day comfort.

For those seeking uncompromising performance without the weight, the TRITON-TI delivers heavy-duty functionality in an exceptionally lightweight package. It's not just a dive watch - it's your reliable companion for every adventure, above and below the waves.

Researchers from Nanjing University of Science and Technology, led by Prof. Erjun Kan and Assoc. Prof. Yi Wan, together with Prof. Kaiyou Wang’s team at the Institute of Semiconductors, Chinese Academy of Sciences, has achieved a breakthrough in the study of two-dimensional (2D) ferromagnetic semiconductors.

Using the CIQTEK Scanning NV Microscope (SNVM), the team successfully demonstrated room-temperature ferromagnetism in the semiconducting material MnS₂. The findings were published in the Journal of the American Chemical Society (JACS) under the title “Experimental Evidence of Room-Temperature Ferromagnetism in Semiconducting MnS₂.”

https://pubs.acs.org/doi/10.1021/jacs.5c10107

Pioneering Discovery in 2D Ferromagnetic Semiconductors

The discovery of 2D ferromagnetic semiconductors has raised great expectations for advancing Moore’s Law and spintronics in memory and computation. However, most explored 2D ferromagnetic semiconductors exhibit Curie temperatures far below room temperature. Despite theoretical predictions of many potential room-temperature 2D ferromagnetic materials, the experimental synthesis of ordered and stable metastable structures remains a formidable challenge.

In this study, the researchers developed a template-assisted chemical vapor deposition (CVD) method to synthesize layered MnS₂ microstructures within a ReS₂ template. High-resolution atomic characterizations revealed that the monolayer MnS₂ microstructure crystallized well in a distorted T-phase. The optical bandgap and temperature-dependent carrier mobility confirmed its semiconducting nature.

By combining vibrating sample magnetometry (VSM), electrical transport measurements, and micro-magnetic imaging using CIQTEK SNVM, the team provided solid experimental evidence of room-temperature ferromagnetism in MnS₂. Electrical transport measurements also revealed an anomalous Hall resistance component in the monolayer samples. Theoretical calculations further indicated that this ferromagnetism originates from short-range Mn–Mn interactions.

This work not only confirms the intrinsic room-temperature ferromagnetism of layered MnS₂ but also proposes an innovative approach for the growth of metastable functional 2D materials.

Two Key Breakthroughs

• Intrinsic Room-Temperature Ferromagnetism in MnS₂ Monolayers:
  The study experimentally demonstrates intrinsic room-temperature ferromagnetism in semiconducting MnS₂, resolving the long-standing conflict between semiconductivity and magnetism.

• Template-Assisted CVD Strategy for Metastable Ferromagnetic Microstructures:
  The developed synthesis strategy enables scalable fabrication of metastable ferromagnetic microstructures.

These advances establish MnS₂ as a model platform for 2D spintronics, offering a new pathway for engineering low-dimensional magnetic materials.

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Figure 2: Micro-Region Magnetic Imaging

Figure 3: Electrical Transport Measurements

CIQTEK SNVM: Key Instrument Behind the Discovery

The CIQTEK Scanning NV Microscope (SNVM) played a crucial role in this research. Its high-precision nanoscale magnetic imaging capabilities were essential for visualizing and confirming the magnetic properties of MnS₂. This study highlights how CIQTEK's advanced scientific instruments are empowering frontier research in materials science and condensed matter physics.

This breakthrough not only drives progress in 2D material studies but also opens new opportunities for spintronics and next-generation memory technologies.

Experience CIQTEK SNVM

CIQTEK SNVM is a world-leading nanoscale magnetic field imaging system, offering:

• Temperature range: 1.8–300 K

• Vector magnetic field: 9/1/1 T

• Magnetic spatial resolution: 10 nm

• Magnetic sensitivity: 2 μT/Hz¹ᐟ²

Based on NV center-based optically detected magnetic resonance (ODMR) and atomic force microscopy (AFM) scanning imaging, the SNVM provides high spatial resolution, high magnetic sensitivity, multifunctional detection, and non-invasive measurement.

It is a powerful tool for magnetic domain characterization, antiferromagnetic imaging, superconductivity studies, and 2D magnetic materials research, enabling scientists to explore materials with high precision and confidence.

In today's era of rapid technological advancement, reliable performance under high-temperature conditions has become a critical requirement across numerous industrial applications. From internal combustion engines and electric vehicle battery management systems in the transportation sector to marine equipment, medical devices, and various outdoor installations, high-temperature environments are ubiquitous. As a professional wire harness manufacturer, Aichie Technology fully recognizes that in such demanding operating conditions, the selection of every component is crucial—particularly wire harness connectors responsible for signal transmission and power delivery. These components must maintain stability at elevated temperatures to ensure the safe and reliable operation of the entire system.

I. The Critical Challenges Facing Wire Harness Connectors in High-Temperature Environments
During vehicle operation, whether involving the engine compartment and exhaust systems of conventional fuel-powered vehicles or the battery packs, motors, and high-power charging systems associated with the rapid development of electric vehicles, substantial heat is continuously generated. Additionally, increasingly extreme global climatic conditions impose stringent requirements on the long-term environmental resistance of external automotive wiring harnesses. The operational temperature range in these scenarios typically spans from 60°C to 260°C, with certain extreme cases—such as firefighting equipment—requiring direct exposure to open flames.

Historically, material options capable of withstanding such extreme thermal conditions were limited and often required complex secondary processing techniques (e.g., electron beam cross-linking), resulting in higher production costs and extended lead times, thereby constraining design flexibility. However, transformative changes are underway. Advances in materials science—particularly in resin formulation technologies—are introducing innovative solutions to the wire harness industry.

II. Material Innovation: The Key to Unlocking High-Temperature Performance
The thermal resistance of wire harness connector assemblies is a systematic challenge that demands comprehensive evaluation and strategic material selection across multiple domains:

1. Cable Jacketing and Insulation: Evolution of the Primary Protective Layer
As the "vascular network" of a wiring system, the cable’s outer jacket and conductor insulation serve as the first line of defense. For many years, high-temperature cable jacketing materials were constrained by limited availability. Today, however, resin manufacturers have introduced advanced thermoplastic polyurethane (TPU) formulations rated for continuous use up to 125°C through sustained research and development efforts. A key advantage of this next-generation TPU is its ability to achieve the required thermal rating without reliance on electron beam cross-linking, eliminating the need for specialized secondary processing. This simplifies manufacturing, significantly reduces costs, shortens delivery cycles, and offers wiring harness designers a more economical and efficient solution.

Regarding electrical insulation materials, selection becomes increasingly application-specific:
- In medium to high-temperature ranges (e.g., connector insulators), mineral- or glass-fiber-reinforced polyamide (PA, such as nylon) and polybutylene terephthalate (PBT) resins are commonly employed. These materials exhibit excellent mechanical strength, thermal stability, and dielectric properties.
- For high- to ultra-high-temperature applications, high-performance polymers such as polysulfone (PPSU) and liquid crystal polymer (LCP) are essential. These materials can endure prolonged exposure to elevated temperatures and aggressive chemical environments. While their injection molding requires precise process control and specialized equipment, they enable feasibility in the most demanding operational contexts.

2. Overmolding: Balancing Structural Integrity and Flexibility
The overmolding process creates a robust, sealed protective layer at the junction between the connector and cable, playing a vital role in mitigating stress concentration and enhancing overall durability. In high-temperature applications, the choice of overmolding material directly influences component performance.

As thermal requirements increase, materials tend toward greater rigidity to preserve structural integrity. A proven approach involves using glass-fiber-reinforced PBT or PA resins for overmolding. These materials maintain exceptional dimensional stability and mechanical strength even under sustained high temperatures. Through meticulous structural design, sealing performance can be optimized while ensuring secure connections, achieving high levels of dust and water resistance (as defined by IP ratings), thereby providing comprehensive protection for critical connection points.

3. Mechanical Hardware and Sealing Components: The Role of Metals and Elastomers
Beyond polymeric materials, mechanical hardware (e.g., coupling nuts, panel-mounting brackets) and sealing elements play equally vital roles in high-temperature systems.

Mechanical Hardware: In high-temperature environments, components should ideally be fabricated from electroless nickel-plated brass or stainless steel. These metallic materials offer superior mechanical strength and melting points far exceeding those of plastic counterparts, ensuring structural integrity under extreme thermal stress.

Sealing Elements (e.g., O-rings): To address combined challenges of high temperature, humidity, and contamination, integrating silicone-based O-rings into connector designs proves highly effective. Premium-grade silicone O-rings can operate reliably over extended periods in environments exceeding 200°C. Their inherent elasticity ensures consistent sealing force at the interface, effectively preventing the ingress of harmful substances.

III. Partnering with Experts: Building Reliable Foundations for High-Temperature Applications
In the face of increasingly complex high-temperature application requirements, material upgrades alone are insufficient to overcome systemic engineering challenges. Behind every successful implementation lies an uncompromising commitment to precision and detail. In this context, selecting a wire harness connector supplier with deep technical expertise and a proven capacity for innovation is paramount to ensuring product reliability and project success.

As a trusted partner, Aichie places customer needs at the core of its operations, delivering end-to-end wiring harness solutions throughout the entire product lifecycle. From precise selection of connectors and cables, through full-cycle harness development and manufacturing, to efficient and secure logistics and delivery, we have established a fully integrated service ecosystem. Each stage reflects rigorous engineering judgment and extensive practical experience. An exceptional wire harness supplier should not merely provide compliant individual components but also possess the capability to deliver holistic solutions—from scientific material selection and optimized connection design to precision manufacturing, rigorous testing, and comprehensive validation. Aichie stands as such a strategic partner, actively engaging in every phase of your project development to ensure stable performance of your products in harsh environments, including extreme temperatures. We are committed to translating cutting-edge advancements in materials science into robust, high-reliability wire harness connection solutions that enhance product durability and extend service life. For inquiries, please contact us at Email: sales03@aichie.com.

Conclusion
High-temperature environments present persistent challenges for the wire harness industry—but they also serve as powerful catalysts for technological innovation. The continuous evolution of resin materials, particularly the emergence of more processable high-temperature alternatives such as advanced TPU, is steadily expanding the frontiers of wiring harness design. As your dependable partner in wire harness solutions, Aichie remains at the forefront of technological progress, integrating state-of-the-art materials and manufacturing processes to deliver connectors and harness assemblies capable of stable, durable, and safe operation under any adverse condition—especially in high-temperature settings. Choosing Aichie means choosing proven connection reliability for your application. Let us collaborate from the very beginning to co-develop and implement successful, high-performance solutions.

Email: sales03@aichie.com

Tel/Whatsapp: +86 18027502150

Abstract:

With the rapid development of automotive intelligence and networking, on-board electronic systems are becoming increasingly complex, which puts forward higher requirements for the rate, reliability and anti-interference ability of communication transmission. Optical fiber harnesses, with their advantages of high speed, low loss, anti-electromagnetic interference and lightweight, are gradually becoming the ideal choice for in-vehicle communication systems. This article systematically analyzes the technical features, application advantages and implementation plans of optical fiber harnesses, and looks forward to their development prospects, providing a reference for the upgrade of automotive communication systems.

Introduction

At present, functions such as autonomous driving, Internet of Vehicles and high-definition entertainment have driven a sharp increase in the volume of in-vehicle data, posing challenges to traditional copper wire transmission in terms of speed and stability. Optical fiber communication technology, with its outstanding performance, provides an effective solution for building a new generation of vehicle-mounted networks. This article conducts an analysis from the dimensions of technical principles, application scenarios and system solutions, explores the role of optical fiber harnesses in promoting the upgrade of automotive communication, and looks forward to their prospects for large-scale application.

Technical Overview of Optical Fiber Harnesses

Optical fiber harnesses use light waves as the transmission carrier and rely on optical fiber media to achieve signal transmission. Their core advantages lie in high speed, high reliability, low loss and resistance to electromagnetic interference, fully matching the communication requirements of vehicle systems for large data volume and high real-time performance. Its communication link is mainly composed of optical fiber connectors and optical fiber conductors, which work together to ensure the stable transmission of signals.

​

1.1 Optical Fiber Connector

Optical fiber connectors are core passive components for achieving active optical fiber connections. They are composed of key structures such as optical fiber reinforcement, alignment, elastic docking, locking, and optical cable fixation (see Figure 1). The core working principle is as follows: Ceramic pins and ceramic sleeves are used to achieve precise alignment of optical fibers. The elastic alignment force is provided by the spring in the pre-compressed state - during the connection, the pins retract to generate secondary compression, ensuring that the two pins are always in a compressed contact state and guaranteeing the stability of the connection. This structural design enables the optical fiber connector to feature reliable insertion and extraction as well as low loss, making it suitable for the usage requirements of vehicle-mounted environments. ​

1.2 Optical Fiber Conductor

Optical fibers have a cylindrical structure and are composed of three layers: the core, the cladding, and the coating (see Figure 2). Their transmission core relies on the principle of total light reflection: when light is incident from the core with a high refractive index (optically dense medium) onto the cladding with a low refractive index (optically sparse medium), if the incident Angle is greater than the critical Angle, all the light will be reflected back to the core, achieving leak-free signal transmission. ​

The core technical features of optical fibers can be summarized in six points:

(1) Outstanding transmission efficiency: Fast transmission speed, long distance, capable of simultaneously carrying massive amounts of data, far exceeding traditional wires; ​

(2) Strong anti-interference ability: It transmits optical signals rather than electrical signals, is not affected by electromagnetic interference, and ensures stable signal quality; ​

(3) Wide frequency band: Supports ultra-high-speed data transmission, meeting the parallel communication requirements of multiple systems in vehicles; ​

(4) Extremely low loss: The theoretical transmission loss can be as low as less than 0.0035 dB per kilometer, achieving long-distance transmission without attenuation. ​

(5) High security: No electromagnetic radiation, not easy to be eavesdropped on, suitable for sensitive data transmission scenarios in vehicles; ​

(6) Lightweight and miniaturization: Compared with copper cables, it is smaller in volume and lighter in weight, facilitating on-board layout and maintenance, and reducing the overall burden on the vehicle.

​

The advantages of optical fiber harnesses in the intelligent application of automobiles

When the transmission rate of traditional copper wires reaches over 10 GB/s, the wire diameter needs to be thickened to meet the requirements. This will directly lead to an increase in the overall vehicle weight and cost, which is contrary to the development trend of automotive lightweighting and low cost. While enhancing communication performance, optical fiber harnesses perfectly avoid the aforementioned drawbacks. Their core advantages are specifically reflected in four aspects:

(1) Transmission rate outperforms traditional wires: Optical fiber harnesses can transmit millions of megabytes of data per second, easily meeting the large data volume transmission requirements of autonomous driving, high-definition entertainment, etc. However, the maximum speed of traditional copper wire networks is only 10GB/s, which is difficult to meet the communication upgrade requirements of intelligent vehicles. ​

(2) Extremely low transmission loss: The loss of optical fibers per kilometer is usually less than 0.0035 dB/m, ensuring high-quality signals even during long-distance transmission. The transmission loss of traditional copper wires reaches 0.5 dB/m, and the signal attenuation is severe during long-distance transmission, requiring additional relay equipment. ​

(3) Electromagnetic interference immunity: The light wave transmission characteristics make it immune to electromagnetic interference generated by the vehicle's internal engine, sensors and other electronic devices, and it will not cause interference to other on-board electronic systems, ensuring communication stability and compatibility with the vehicle's electronic systems. ​

(4) Facilitating vehicle lightweighting: Automotive optical fibers represented by plastic optical fibers (POF) are much lighter than traditional metal wires, which can significantly reduce the vehicle's overall weight, improve fuel economy or driving range, and align with the development direction of automotive energy conservation.

​

Application scenarios of optical fiber harnesses in Automobiles

Optical fiber harnesses have been widely applied in communication, industry, medical care and other fields, but their implementation in the automotive field still faces challenges such as insufficient basic theories, lack of technical specifications, unclear test standards and limited application practices. Its in-vehicle applications need to focus on adapting to the environmental characteristics of different areas of the car and provide targeted solutions.

​

3.1 Application of Optical Fiber Harnesses in the Layout Area

The usage environment of automobiles is complex, and the requirements for the temperature resistance, water resistance and vibration resistance of wiring harnesses vary significantly in different regions. Based on the risk of liquid contact, the vehicle layout area can be divided into three categories, corresponding to different protection levels of the wiring harness:

(1) Wet zone: The area that is bound to come into contact with liquids during regular use, such as the chassis, engine room and other areas outside the passenger cabin. In rainy and snowy weather, the wire harness connectors in this area are prone to contact with rainwater and sewage, and the highest level of waterproof protection is required. ​

(2) Potential wet areas: These are areas that may come into contact with liquids in specific scenarios, such as the floor of the passenger compartment, door handrails, and seat surfaces. They may come into contact with liquids due to opening the door on rainy days, spilling water cups, or dripping condensate water, and require moderate waterproof protection. ​

(3) Absolute dry zone: An area where there is almost no possibility of liquid contact during normal use, such as the interior of the dashboard and the interior of the ceiling, which has the lowest requirements for waterproof sealing. ​

The waterproof sealing requirements of the three aspects decrease successively from the wet area to the dry area, which is the core basis for the layout of the optical fiber harness.

​

3.2 Optical Fiber Harness Application Solutions

The application of optical fiber harnesses in vehicles must simultaneously meet the requirements of electrical performance and mechanical performance, with a focus on addressing the three core challenges of temperature, vibration, and waterproofing. The specific solutions are as follows:

(1) Optical fiber cables: Multi-dimensional adaptation to vehicle environments

For high-temperature environments:

① Select high-temperature resistant materials (such as silicone wire, XLPE wire) to ensure stable insulation at high temperatures;

② It adopts a double-layer coating + ultraviolet curing process to enhance high-temperature resistance.

③ Optimize the layout plan to avoid the engine exhaust pipe and high-temperature vortex areas, and use high-temperature resistant heat insulation coatings (such as aluminum foil fiberglass tubes), while enhancing the aging resistance. ​

In response to waterproofing requirements: A multi-layer protective structure design is adopted - the outermost plastic sheath provides basic waterproofing and mechanical protection, the inner metal sheath enhances the pressure resistance and waterproofing capacity, and a water-swelling water-blocking layer is set in the middle (which rapidly expands to close the path when water invades). The optical fiber is wrapped with grease inside the cable core to absorb trace amounts of moisture, ensuring the optical fiber remains dry in all aspects. For instance, the automotive optical harness solution of Yangtze Optical Fibre and Cable Co., Ltd. features quartz multimode fibers that meet automotive standards in terms of bending (radius 10mm), tensile strength (150N), temperature adaptability (-40℃ to 125℃), aging (125℃/3000h), and vibration (V3). ​

(2) Optical fiber connector: Dual upgrades for temperature resistance and water resistance

Enhance temperature resistance:

① Design a heat dissipation structure, reserve metal components for heat conduction, add heat dissipation fins to the casing, and use a metal casing to improve heat dissipation efficiency;

② High-temperature resistant materials are selected. The shell and internal structure are made of high-quality engineering plastics resistant to medium and low temperatures, and key components are made of special alloy materials to enhance high-temperature resistance and anti-deformation capabilities. For instance, the non-contact optical connectors launched by Letas Optics offer higher repeatability in insertion and extraction, longer lifespan, lower insertion loss, and lower dust sensitivity compared to traditional products. ​

Enhanced waterproof performance: Adopt a combination solution of heat shrink tubing and sealant - place the heat shrink tubing over the connection part, heat it to shrink and closely adhere to the joint and optical fiber, then evenly apply sealant to fill the gap. After drying and hardening, it forms a double protection to prevent moisture and contaminants from entering. ​

(3) Hybrid connection scheme

It adopts a "fiber optic + electrical connection" hybrid mode: the fiber optic is responsible for high-speed data transmission, and the electrical connection port is responsible for the power supply function of the sensor, taking into account both transmission efficiency and power supply stability, and meeting the requirements of multi-device collaborative operation in vehicles. 

​

Conclusion

The development of intelligent automobiles has put forward requirements for high speed, low loss, anti-interference and lightweight communication systems, which has driven the upgrade of traditional copper wires to optical fiber harnesses. Optical fiber harnesses, with their core advantages such as transmission efficiency, anti-interference ability and lightweight, perfectly match the communication requirements of vehicles. Through implementation measures such as regional protection design, material and process optimization, and hybrid connection schemes, the adaptation to the complex on-board environment has been achieved. ​

In the future, with the improvement of basic theories, the standardization of technical norms, and the accumulation of application practices, optical fiber harnesses will be applied on a large scale in the automotive industry, becoming the communication support for core functions such as autonomous driving and the Internet of Vehicles, injecting key impetus into the intelligent upgrade of automobiles, and leading in-vehicle communication into a new era of high speed, reliability and efficiency.

The 15th China Symposium on Electron Paramagnetic Resonance (EPR) Spectroscopy was successfully held at Chongqing University from October 24 to 27, 2025. Nearly one hundred experts, scholars, industry representatives, and graduate students gathered to discuss cutting-edge topics in the EPR field, including new techniques and theories, biological spin labeling, and new energy applications.

Grand Launch: CIQTEK Q-Band EPR Spectrometers Make a Stunning Debut

As a pioneer in paramagnetic resonance technology, CIQTEK officially unveiled its new Q-band EPR spectrometer series — the EPR-Q400 High-Frequency Pulse Spectrometer and the EPR-Q300 Continuous-Wave Spectrometer, marking another significant milestone in high-frequency EPR technology.

Compared with traditional X-band EPR, high-frequency EPR offers:

• Higher spectral resolution

• Stronger orientation selectivity

• Enhanced sensitivity

Making it a powerful tool for biomacromolecular structure studies, spin dynamics research, and materials science applications.

Dr. Richard Shi from CIQTEK Introduces the New Q-Band EPR Instruments at the Meeting

Flagship Model: EPR-Q400 High-Frequency Pulse Spectrometer

The EPR-Q400, the flagship model of this release, supports both CW and pulsed EPR measurements, meeting a wide range of research demands. It enables variable-temperature experiments from 4 K to 300 K, providing flexible and precise experimental conditions.

Notably, the Q-band spectrometer adopts the same software platform as CIQTEK X-band EPR systems, greatly reducing the learning curve and ensuring a seamless and user-friendly operation experience.

Dedicated CW Solution: EPR-Q300 Continuous-Wave Spectrometer

For users focusing solely on continuous-wave EPR experiments, CIQTEK introduced the EPR-Q300, offering a targeted and efficient solution for diverse scientific applications.

Continuous Innovation in EPR Technology

This product launch showcases CIQTEK’s robust R&D capabilities and in-depth technical expertise in EPR spectroscopy, thereby further enriching its EPR product portfolio. During the symposium, multiple experts recognized CIQTEK’s responsive and professional technical support, noting that the team not only helps resolve experimental challenges but also actively participates in collaborative research, contributing to high-level scientific achievements.

Upcoming Event: CIQTEK Paramagnetic Academy 2026

To further promote academic exchange and talent development in EPR technology, the CIQTEK Paramagnetic Academy Advanced EPR Workshop will be held from July 17 to 27, 2026, in conjunction with the CIQTEK EPR User Symposium.

These events will serve as an open platform for technical communication, experience sharing, and application discussions among EPR researchers and users.
Stay tuned for more updates and upcoming event announcements.

In today's fast-paced world, staying connected while maintaining your health has never been more important. The T9 Smartwatch beautifully bridges this gap, combining sophisticated design with comprehensive health monitoring in one sleek device. Its 1.27-inch HD display offers crystal-clear visibility, while the lightweight 40-gram design ensures all-day comfort without compromising on style.

What truly sets the T9 apart is its advanced health monitoring system. The watch provides 24/7 heart rate tracking, blood oxygen monitoring, and stress level detection, giving you valuable insights into your wellbeing. For women, it offers specialized health tracking with menstrual cycle reminders and predictions. The built-in breathing training guide helps you manage stress effectively, while intelligent sleep analysis helps optimize your rest patterns.

Beyond health features, the T9 keeps you connected with Bluetooth calling and message notifications. Fitness enthusiasts will appreciate the multiple sports modes that accurately track various activities, and the music control feature adds convenience to your workouts. With its elegant design transitioning seamlessly from day to night, the T9 isn't just a smartwatch - it's your personal health companion that complements your lifestyle while keeping you connected and healthy.

How Does Embedded Copper Coin Technology Enhance Thermal Management in High-Frequency PCBs?

In the demanding world of high-frequency electronics, thermal management is not just a mechanical consideration—it is a critical factor that directly impacts electrical performance, signal integrity, and long-term reliability. As power densities increase in applications like 5G base stations and automotive radar, traditional cooling methods often fall short. This is where embedded copper coin technology emerges as a changing solution, offering a direct and highly efficient path for heat dissipation.

Here’s a detailed breakdown of how this technology enhances thermal management:

1. The Fundamental Principle: Creating a Low-Thermal-Resistance Path

At its core, an embedded copper coin is a solid, thick piece of pure copper that is precision-machined and pressed into a milled cavity within the PCB's substrate during the lamination process. The key to its effectiveness lies in its ability to create a low-thermal-resistance pathway from the heat source to a heat sink or the opposite side of the board.

• Direct Thermal Connection: The coin is placed directly beneath a specific high-power component, such as a Power Amplifier (PA), Field-Programmable Gate Array (FPGA), or processor. This creates an intimate thermal connection, bypassing the insulating layers of the PCB laminate.

• Superior Thermal Conductivity: Copper has a thermal conductivity of approximately 400 W/mK, which is orders of magnitude higher than standard FR-4 (~0.3 W/mK) or evenhigh-frequency materials like M6. This massive disparity means heat is drawn away from the component and into the coin with remarkable efficiency.

2. Superiority Over Traditional Methods

To appreciate the copper coin's advantage, it's helpful to compare it to common alternatives:

• Vs. Thermal Vias: A cluster of thermal vias is a common solution. However, each via is a cylinder plated with a thin layer of copper (e.g., 20µm), filled with air or a thermal epoxy. The effective cross-sectional area of solid copper in a via field is relatively small. A solid copper coin, in contrast, provides a massive, uninterrupted cross-section of pure copper, resulting in significantly lower thermal resistance and much more efficient heat spreading.

• Vs. External Heat Sinks: While effective, top-side heat sinks can be bulky, heavy, and interfere with component placement or airflow. An embedded coin can often reduce the size and weight of an external heat sink or, in some cases, eliminate the need for one altogether, enabling more compact and elegant designs.

3. Direct Benefits for High-Frequency Performance

The thermal benefits of the copper coin translate directly into enhanced electrical performance, which is crucial for high-frequency PCBs:

• Preventing Performance Drift: Many active components, especially RF components, have performance parameters (like gain, output power, and noise figure) that are sensitive to temperature. By maintaining a stable, lower operating temperature (T_j, junction temperature), the copper coin ensures the component performs consistently within its specified range.

• Improving Signal Integrity: Excessive heat can increase the dissipation factor (Df) of the PCB laminate and alter its dielectric constant (Dk). This can lead to signal attenuation, impedance mismatches, and phase shifts. Effective cooling via a copper coin helps maintain the stable electrical properties of the surrounding M6 material or IT-180 material.

• Enabling Higher Power Density: By efficiently managing the "hotspots," designers can safely use more powerful components or pack them more densely on the board without fear of thermal throttling or failure, pushing the boundaries of what's possible in a given form factor.

4. Enhancing Mechanical Reliability and Lifespan

Thermal cycling—the repeated heating and cooling of a board during operation—is a primary cause of failure in electronics.

• Reduced Thermal Stress: By effectively dissipating heat, the copper coin minimizes the peak temperature and the temperature delta across the board and within the component itself. This reduces the mechanical stress on solder joints and the PCB laminate, preventing cracking and delamination.

• Increased Mean Time Between Failures (MTBF): A cornerstone of reliability engineering is that component failure rates decrease exponentially with lower operating temperatures. By keeping critical components cool, the embedded copper coin directly contributes to a longer, more reliable operational lifespan for the entire system.

Implementation in a Hybrid PCB

In a sophisticated board like the Copper Coin Embedded 6-Layer M6 IT180 Hybrid PCB, the coin is strategically placed in the center of the PCB stackup. It connects directly from the component on the outer layer down to the internal ground planes or to the bottom side, where it can be attached to an external chassis or heat spreader. This integration is seamless and is completed during lamination, ensuring a robust mechanical bond and optimal thermal transfer without compromising the board's structural integrity.

Conclusion

Embedded copper coin PCB technology is a powerful and targeted thermal management solution that directly addresses the thermal bottlenecks in high-frequency, high-power PCBs. It moves beyond the limitations of traditional vias and heat sinks by providing a low-resistance, high-conductivity thermal highway. The result is not just a cooler-running board, but one that delivers superior electrical performance, greater design flexibility, and unparalleled long-term reliability—making it an indispensable technology for next-generation applications in 5G, automotive, and aerospace.

How Does the RO3035 Laminate's Thermal Stability Enhance PCB Reliability?

In high-frequency electronics, heat is an inevitable byproduct of operation. Components like power amplifiers (PAs) in cellular base stations or automotive radar modules generate significant heat. If the PCB substrate is not stable, this heat can cause catastrophic failures. The RO3035 laminate is engineered to prevent these failures through several key mechanisms:

1. Matched Coefficient of Thermal Expansion (CTE) Prevents Mechanical Failure

One of the most critical aspects of thermal stability is how much a material expands and contracts when heated or cooled.

The Problem: If the PCB laminate expands at a significantly different rate than the copper traces and plated through-holes, it creates immense stress. This can lead to cracked vias, broken circuit traces, and delamination (separation of the copper from the substrate). For a board with 21 vias and 63 pads, as in our standard offering, via integrity is paramount.

The RO3035 Solution: RO3035 has a low and well-controlled in-plane CTE:

• X & Y Axis: 17 ppm/°C
• Z Axis: 24 ppm/°C 

Crucially, the in-plane CTE (17 ppm/°C) is very close to that of copper (≈17 ppm/°C). This "CTE match" means the substrate and the copper circuits expand and contract in harmony during thermal cycles.

Reliability Enhancement: This drastically reduces mechanical stress on the plated through-holes and the copper-to-laminate bond. It prevents via barrel cracking and pad lifting, which are common failure points in less stable materials, ensuring the electrical connections remain intact over thousands of thermal cycles.

2. High Decomposition Temperature (Td > 500°C) Ensures Material Integrity

During assembly and operation, theRogersRO3035 PCB is subjected to high temperatures.

• The Problem: Standard FR-4 materials have a lower glass transition temperature (Tg) and can begin to decompose at soldering temperatures, leading to blistering, delamination, and a loss of mechanical strength.
• The RO3035 Solution: RO3035 is a ceramic-filled PTFE composite with an exceptionally high Decomposition Temperature (Td) exceeding 500°C. This is far beyond the peak temperatures encountered in typical lead-free soldering processes (which are around 240-260°C).
• Reliability Enhancement: The board remains mechanically and chemically stable during all assembly stages and throughout its operational life. This guarantees that the 0.37mm thin board will not warp, blister, or degrade when subjected to the heat of soldering components or from internal power dissipation, ensuring the physical integrity of the assembly.

3. Stable Dielectric Constant (Dk) Over Temperature Maintains Electrical Performance

For high-frequency circuits, electrical stability is just as important as mechanical stability.

• The Problem: In many materials, the Dielectric Constant (Dk) can shift significantly with temperature changes. For a circuit designed to operate at a specific frequency (e.g., 24 GHz for automotive radar or 28 GHz for 5G), a drifting Dk causes a shift in the impedance and the resonant frequency. This leads to signal distortion, loss of gain, and overall system performance degradation.
• The RO3035 Solution: Rogers 3035 offers a remarkably stable Dk of 3.50±0.05 across a wide temperature range. This is a core feature of its "thermal stability."
• Reliability Enhancement: Your circuit's performance remains predictable and consistent whether it's a cold start in winter or operating at peak load on a hot summer day. This is non-negotiable for applications like global positioning satellite antennas and cellular power amplifiers, where signal integrity is critical.

4. Low Dissipation Factor (Df) Minimizes Signal Loss and Heat Generation

The electrical properties of the laminate also contribute to thermal management.

• The Problem: At high frequencies, materials with a high loss tangent (Df) convert significant signal energy into heat. This self-heating effect can raise the board's local temperature, creating a feedback loop that further degrades performance and stresses components.
• The RO3035 Solution: With an ultra-low Dissipation Factor of 0.0015 at 10 GHz, RO3035 minimizes dielectric losses.
• Reliability Enhancement: Less signal energy is lost as heat. This results in a lower operating temperature for the PCB itself, which directly increases the mean time between failures (MTBF) for both the board and the surface-mounted components. This is a key benefit for power amplifiers, where efficiency and heat management are major design challenges.

Conclusion: A Synergistic Effect for Ultimate Reliability

The thermal stability of the RO3035 high frequency laminate is not a single property but a synergistic combination of its matched CTE, high Td, stable Dk, and low Df. For our RO3035 2-layer 10mil Immersion Gold PCB, this means:

• Mechanically Robust: It can withstand the rigors of assembly and harsh operating environments without suffering from cracked vias or delamination.
• Electrically Predictable: Its performance remains locked in, ensuring that your high-frequency design works as intended throughout its lifespan.
• Thermally Efficient: It runs cooler and manages heat more effectively, leading to a more reliable end-product.

This holistic thermal stability is precisely why this RO3035 10mil PCB is specified for the most demanding applications in the automotive, aerospace, and telecommunications industries, where failure is not an option. By choosing a PCB built onRO3035 substrate, you are not just buying a board; you are investing in long-term, predictable performance.