When Should You Specify a 2-Layer, 30mil TMM10i Board for Your Next Project?

In the complex world of PCB design, material and configuration selection is a critical decision that can make or break your project's performance, cost, and timeline. While a vast array of options exists, knowing the precise application for a specialized board like the 2-Layer, 30mil TMM10i PCB with Immersion Tin finish is key to leveraging its full potential.

This isn't a one-size-fits-all solution; it's a precision instrument. Specifying it at the right time ensures optimal performance, reliability, and cost-efficiency. You should seriously consider this specific PCB configuration in the following scenarios:

1. When Your Application Operates at High Frequencies (RF & Microwave)

This is the most compelling reason to choose this board. The Rogers TMM10i material is engineered specifically for high-frequency performance.

• Stable Dielectric Constant (Dk of 9.80±0.245): A high and stable Dk allows for the design of smaller wavelength circuits. This means you can create more compact filters, antennas, and couplers without sacrificing electrical performance. The low tolerance ensures your design behaves predictably in production, batch after batch.
• Low Dissipation Factor (0.0020 @ 10 GHz): At microwave frequencies, signal loss is a major concern. The low loss tangent of TMM10i ensures minimal signal attenuation, which is critical for maintaining efficiency in power amplifiers, signal integrity in transceivers, and sensitivity in receiving systems.
• Specify this board for: Power amplifiers, low-noise amplifiers (LNAs), filters, couplers, and oscillators operating in the GHz range.

2. When You Require Superior Thermal and Mechanical Stability

Environmental robustness is non-negotiable in many fields. The TMM10i substrate excels where temperature fluctuations and mechanical stress are a concern.

• CTE Matched to Copper: The Coefficient of Thermal Expansion (CTE) of TMM10i (19/19/20 ppm/°C) is closely matched to the copper foil (~17 ppm/°C). This is crucial for reliability. During thermal cycling (e.g., power on/off or environmental changes), the board and the copper traces expand and contract at nearly the same rate. This drastically reduces the risk of plated through-hole (PTH) barrel cracking, trace delamination, and long-term failure.
• High Decomposition Temperature (Td 425°C): This allows the board to withstand the high temperatures of lead-free solder assembly processes without degrading, ensuring manufacturing yield and long-term reliability.
• Resists Creep and Cold Flow: The thermoset composite structure maintains its dimensional stability under continuous mechanical stress, preventing deformation that could alter electrical characteristics.
• Specify this board for: Automotive radar, satellite communication systems, aerospace electronics, and any application destined for harsh environments.

3. When Your Design Relies on Reliable Plated Through-Holes (PTHs) and Vias

The product description explicitly mentions TMM10i is "designed for high plated thru-hole reliability." This is a foundational feature.

• Robust Via Construction: With a via plating thickness of 20µm and a material that bonds well with copper, the PTHs in this board are exceptionally robust. The 30mil (0.762mm) core thickness is manageable for a 2-layer board, ensuring a reliable plating process throughout the hole barrel.
• No Special Pre-Treatment Required: Unlike pure PTFE materials, TMM10i does not require a sodium napthanate treatment prior to electroless copper plating. This simplifies the fabrication process, reduces potential failure points, and improves overall PTH quality and consistency.
• Specify this board for: Dense interconnects, power grounds, and any design where the integrity of the connection between layers is paramount to the function and lifespan of the product.

4. When You Need a Planar Surface for Fine-Pitch Components or Wire Bonding

The Immersion Tin (ImSn) surface finish is a strategic choice for specific assembly needs.

• Flat, Planar Surface: Immersion tin provides a very flat surface, which is ideal for the fine-pitch components commonly found in RF circuits. It eliminates the "coplanarity" issues that can arise with HASL (Hot Air Solder Leveling) finishes.
• Excellent for Wire Bonding: The thermoset resin base of TMM10i provides a stable, non-porous surface that is highly reliable for both gold and aluminum wire bonding, a critical assembly process in many high-performance RF and microwave multi-chip modules.
• Specify this board for: Designs using fine-pitch BGA or QFN packages, modules requiring wire bonding, or any application where a perfectly flat soldering surface is critical.

5. When Your Circuit Complexity is Managed on Two Layers

A 2-layer design is often sufficient for many RF functional blocks like filters, amplifiers, or antenna feed networks. Using this TMM10i configuration in such cases is a model of cost-effective performance.

• Simplified Fabrication: A 2-layer board is less complex to manufacture than a multilayer one, leading to higher fabrication yields, shorter lead times, and lower costs.
• Optimized Stackup: The symmetric stackup (1oz Cu - 30mil TMM10i core - 1oz Cu) provides a consistent environment for controlled impedance lines on both layers, which is perfectly adequate for many microstrip and stripline-inspired designs.
• Ideal for Dedicated RF Modules: The provided PCB Statistics (e.g., 10 components, 15 vias, 2 nets) suggest this board is perfect for a specific, critical function within a larger system.
• Specify this board for: Individual RF sub-assemblies, patch antenna arrays, sensor modules, and other applications where the circuit complexity does not necessitate four or more layers.

When to Look for an Alternative

Conversely, you should consider a different PCB specification if your project has:

• High-Density Digital Logic: Requires 4 or more layers for power integrity and complex routing.
• Extreme Heat Dissipation Needs: While stable, TMM10i's thermal conductivity (0.76 W/m/K) may be lower than specialized metal-core or alumina substrates for high-power applications.
• A Need for On-Board Shielding: This requires dedicated ground planes or buried layers, which a 4+ layer board would provide.
• A Strict Budget for Consumer-Grade Electronics: TMM10i is a performance-grade material; for non-critical, low-frequency applications, standard FR-4 is far more economical.

Conclusion: Making the Strategic Choice

Specifying the 2-Layer, 30mil TMM10i high frequency PCB with Immersion Tin is a strategic decision for engineers and designers who need a reliable, high-performance substrate for demanding high-frequency and thermal applications. It is the ideal choice when your priorities are signal integrity at microwave frequencies, robust plated through-holes, exceptional thermal stability, and a reliable surface for assembly.

By understanding the unique synergy between the TMM10i material, the 30mil thickness, and the immersion tin finish, you can select this board for your next RF power amplifier, satellite communication module, or advanced radar system, ensuring it is built on a foundation of proven performance and reliability.

Why Choose a Silver/Gold Surface Finish for High-Frequency PCBs?

In the world of high-frequency and radio frequency (RF) PCB design, every decision impacts performance. From the laminate material to the trace geometry, engineers labor over details to minimize loss and preserve signal integrity. One of the most critical choices lies in the surface finish—the final coating applied to the exposed copper circuitry. While options like ENIG (Electroless Nickel Immersion Gold) and HASL (Hot Air Solder Leveling) are common, for demanding applications, the silver/gold plate (gold over silver) finish stands out as a superior solution.

Here’s a breakdown of why this specific finish is the go-to choice for high-performance PCBs, such as our TLY-3 2-layer 20mil board.

1. The Unmatched Electrical Performance of Silver

At high frequencies, especially into the millimeter-wave range (like 24 GHz, 77 GHz, and beyond), the "skin effect" becomes dominant. This phenomenon causes the electrical current to flow primarily on the outer surface of the conductor. Therefore, the properties of the surface finish itself directly influence the signal's insertion loss.

• High Conductivity: Pure silver is the most electrically conductive metal, even slightly better than copper. When used as a base plating layer, it creates an exceptionally low-loss path for RF signals. Compared to a standard ENIG finish, which uses a less-conductive nickel barrier layer, silver plating offers significantly lower signal loss at high frequencies.

• Smooth Surface Profile: The electroplating process for silver results in a very flat and uniform surface. This smoothness is crucial for consistent impedance control in delicate transmission lines like microstrips or coplanar waveguides, where surface roughness can increase loss and scatter signals.

2. The Protective and Reliable Role of Gold

While silver is an excellent conductor, it has a major Achilles' heel: it tarnishes and oxidizes easily when exposed to sulfur in the atmosphere. This oxidation layer is non-conductive and would severely degrade performance over time. This is where the thin layer of gold comes in.

• Inert Protection: Gold is a noble metal, meaning it does not oxidize or corrode in normal environments. The thin, immersion gold layer hermetically seals the underlying silver, protecting it from the elements and ensuring long-term shelf life and reliability. 
• Excellent Contact Properties: For PCBs designed to be plugged into a connector or make direct contact with a metal housing (e.g., in an antenna module), gold is ideal. It provides a stable, low-resistance contact interface that won't degrade through repeated mating cycles.

3. The Synergy of the Duo: Best of Both Worlds

The "gold over silver" finish is a classic case of a perfect partnership. Each metal plays a distinct role:

• Silver serves as the workhorse conductor, providing the ultimate electrical performance.
• Gold acts as the protective shield, guaranteeing long-term solderability, stable contact resistance, and reliability.
• This combination delivers a surface that is both electrically superior at high frequencies and robust enough for demanding automotive, aerospace, and telecommunications applications.

Comparison to Other Common Finishes

To fully appreciate the silver/gold finish, it helps to compare it to alternatives:

• vs. ENIG (Electroless Nickel Immersion Gold): ENIG is popular but problematic for very high frequencies. The nickel layer, while preventing copper diffusion, has poor conductivity and introduces magnetic losses, which are detrimental above a few GHz. Silver/gold avoids this lossy nickel layer entirely.
• vs. Immersion Silver: Immersion silver alone is a good option but is more susceptible to tarnishing and has a shorter shelf life than the gold-protected version.
• vs. OSP (Organic Solderability Preservative): OSP is a thin, organic layer that offers little to no protection for exposed contacts and can be unsuitable for certain assembly processes.

Conclusion: A Finish for Mission-Critical Applications

Choosing a silver/gold surface finish is not about luxury; it's a calculated engineering decision for applications where signal integrity and long-term reliability are non-negotiable. For our TLY-3 PCB  20mil Silver Gold board, this finish is the perfect complement to the high-frequency properties of the TLY-3 laminate. It ensures that the exceptional signal performance designed into the board is not compromised at the surface level, making it the ideal choice for:

• 77 GHz Automotive Radar Sensors
• Satellite Communication Phased Arrays
• Millimeter-Wave Antennas (Ka, E, W-Band)

When your design cannot afford unnecessary losses, the silver/gold finish PCB provides the electrical edge and enduring protection you need.

Cutting-edge research platform for micro/nanoscale material behavior studies

The Center for Micro/Nanoscale Behavior of Materials at Xi’an Jiaotong University (XJTU) has established a comprehensive in-situ materials performance research platform based on the CIQTEK SEM4000 Field Emission Scanning Electron Microscope (FE-SEM). By integrating multiple in-situ testing systems, the center has achieved remarkable progress in the application of in-situ SEM techniques and advanced materials science research.

Leading national research infrastructure

The XJTU Center for Micro/Nanoscale Behavior of Materials focuses on the structure–property relationship of materials at the micro/nanoscale. Since its establishment, the center has published over 410 high-impact papers, including in Nature and Science, demonstrating outstanding scientific output.

The center houses one of the most advanced in-situ materials performance research platforms in China, equipped with large-scale systems such as a Hitachi 300 kV environmental TEM with quantitative nanomechanical–thermal coupling capabilities and an environmental aberration-corrected TEM for atomic-scale in-situ studies of thermo-mechanical-gas interactions. Together, these instruments provide powerful technical support for frontier materials research.

Efficient and seamless experience with CIQTEK SEM

In 2024, the center introduced the CIQTEK SEM4000 Field Emission Scanning Electron Microscope.
Dr. Fan Chuanwei, equipment manager at the center, remarked:

“The resolution and stability of the CIQTEK SEM4000 perfectly meet our research demands. What impressed us most was the efficiency. It took less than four months from equipment installation to our first paper published using the system, and the entire process from procurement to operation and after-sales was highly efficient.”

Regarding customized services, Dr. Fan added:

“For our in-situ SEM experiments, CIQTEK tailored a real-time video recording module and designed customized adapter stages for various in-situ setups. The rapid response and flexibility of the CIQTEK team fully demonstrate their professional expertise.”

Integrated in-situ testing capabilities

The SEM4000 platform at XJTU has successfully integrated three core in-situ testing systems, forming a complete in-situ mechanical performance research capability.

• Bruker Hysitron PI 89 Nanomechanical Test System – Enables nanoindentation, tensile, fracture, fatigue, and mechanical property mapping. It has been extensively used in micro/nanoscale mechanical testing of semiconductor devices, leading to significant results in semiconductor materials research.

• KW In-situ Tensile Stage – Offers a loading range from 1 N to 5 kN and supports various grips, including standard compression/tension, compact tension, three-point bending, and fiber tensile testing. Combined with SEM imaging, it allows real-time correlation of mechanical data with microstructural evolution, providing critical insights into deformation mechanisms.

• Custom In-situ Torsion Stage – Developed by Prof. Wei Xueyong’s team at the School of Instrument Science and Engineering, XJTU, this system enables torsional deformation studies under SEM observation, adding a unique capability to the research platform.

CIQTEK Field Emission SEM4000 at Xi'an Jiaotong University

Dr. Fan commented:

“The systems are well integrated with the SEM and easy to operate. Our researchers quickly became proficient, and these combined techniques have provided a wealth of valuable experimental data and scientific discoveries.”

SEM4000: Designed for in-situ excellence

The outstanding performance of SEM4000 in in-situ studies benefits from its purpose-built engineering design. According to CIQTEK engineers, the large chamber and long-travel stage provide ample space and stability for complex in-situ setups, which is a key advantage over conventional SEMs.

Its modular architecture, featuring 16 flange interfaces, allows flexible customization of vacuum ports and electrical feedthroughs for different in-situ devices. This design makes integration and system expansion remarkably straightforward.

In addition, the integrated in-situ video recording function enables continuous observation and recording of microstructural evolution during experiments, providing crucial data for dynamic process analysis and mechanism exploration.

Continuous innovation for future research

Looking ahead, the XJTU center plans several technology development initiatives based on the SEM4000 platform, reflecting strong confidence in the long-term advancement of CIQTEK scientific instruments.

“We plan to add in-situ heating and EBSD modules for high-temperature and EBSD observations. We also aim to extend our self-developed quantitative in-situ mechanical analysis software, which was originally developed for TEM, to SEM applications. Furthermore, we’re developing an ‘SEM AI Agent’ system to enable automated operation, image acquisition, and data processing through AI assistance,” said Dr. Fan.

“With these continuous improvements, we hope to achieve more breakthroughs in understanding micro/nanoscale material behavior while contributing to the progress and broader adoption of advanced domestic scientific instruments. With CIQTEK’s support, we are confident in realizing these goals.”

The collaboration between Xi'an Jiaotong University and CIQTEK demonstrates the strong potential and technological depth of CIQTEK's high-end scientific instruments in frontier research. From the first paper produced within four months to the successful integration of multiple in-situ testing systems, the CIQTEK SEM4000 has proven to be a cornerstone of XJTU’s advanced materials research platform, earning recognition from one of the nation’s leading research institutions.

A research team led by Prof. Haomin Wang from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, has achieved significant progress in studying the magnetism of zigzag graphene nanoribbons (zGNRs) using the CIQTEK Scanning NV Microscope (SNVM).

Building on their previous research, the team fabricated oriented atomic grooves in hexagonal boron nitride (hBN) by pre-etching with metal nanoparticles and synthesized chiral-controlled graphene nanoribbons within these grooves through a vapor-phase catalytic CVD method. The resulting ~9 nm-wide zGNRs embedded in the hBN lattice exhibited intrinsic magnetic properties, which were directly confirmed experimentally for the first time using SNVM combined with magnetic transport measurements.

This groundbreaking work lays a solid foundation for developing graphene-based spintronic devices. The study, titled “Signatures of magnetism in zigzag graphene nanoribbons embedded in a hexagonal boron nitride lattice”, was published in the renowned journal Nature Materials.

https://doi.org/10.1038/s41563-025-02317-4

Understanding Graphene Magnetism

Graphene, as a unique two-dimensional material, exhibits p-orbital electron magnetism that differs fundamentally from the localized d/f orbital magnetism found in conventional materials. This distinction opens new directions for exploring carbon-based quantum magnetism. Zigzag graphene nanoribbons (zGNRs) are particularly promising for spintronic applications because of their predicted magnetic electronic states near the Fermi level. However, detecting zGNR magnetism through electrical transport measurements has remained highly challenging.

The main difficulties include the limited length of bottom-up synthesized nanoribbons, which complicates device fabrication, and the chemically reactive edges that lead to instability or inhomogeneous doping. Furthermore, in narrow zGNRs, strong antiferromagnetic coupling between edge states makes it difficult to electrically detect magnetic signals. These challenges have hindered direct observation of intrinsic magnetism in zGNRs.

SNVM Reveals Magnetic Signals at Room Temperature

Embedding zGNRs within an hBN lattice enhances edge stability and introduces built-in electric fields, providing an ideal environment for studying magnetism. Using CIQTEK’s room-temperature SNVM, the researchers directly visualized magnetic signals in zGNRs for the first time under ambient conditions.

Figure 1. Magnetic measurement of zGNRs embedded in a hexagonal boron nitride lattice using the Scanning NV Microscope

In electrical transport measurements, the ~9 nm-wide zGNR transistors demonstrated high conductivity and ballistic transport behavior. Under magnetic fields, the devices showed pronounced anisotropic magnetoresistance, with resistance changes up to 175 Ω and a magnetoresistance ratio of approximately 1.3% at 4 K, which persisted up to 350 K. Magnetic hysteresis appeared only when the magnetic field was applied perpendicular to the zGNR plane, confirming magnetic anisotropy. Analysis of the angular dependence of magnetoresistance indicated that the magnetic moments were oriented normal to the sample surface. The decrease in magnetoresistance with increasing source-drain bias and temperature revealed interactions between magnetic response, charge transport, and thermal vibrations.

By combining SNVM imaging with transport characterization, this study provides the first direct evidence of intrinsic magnetism in zGNRs embedded in hBN and demonstrates the potential for electric-field control of magnetic behavior. This work deepens the understanding of graphene magnetism and opens new opportunities for developing graphene-based spintronic devices.

Experience Nanoscale Magnetic Imaging with CIQTEK SNVM

CIQTEK invites researchers to experience the Scanning NV Microscope (SNVM), a world-leading nanoscale magnetic imaging system featuring a temperature range of 1.8–300 K, a 9/1/1 T vector magnetic field, 10 nm magnetic spatial resolution, and 2 μT/Hz¹ᐟ² magnetic sensitivity.

CIQTEK SNVM: the ambient version and the cryogenic version

The SNVM integrates diamond nitrogen-vacancy (NV) center-based optically detected magnetic resonance (ODMR) with atomic force microscopy (AFM) scanning technology. It offers high spatial resolution, superior magnetic sensitivity, multifunctional detection, and non-invasive imaging capabilities, making it an essential tool for research in magnetic domain characterization, antiferromagnetic imaging, superconductivity studies, and two-dimensional magnetic materials.

EE-Type Bobbin

1. Structural Features

The ferrite magnetic core of an EE-Type Bobbin is shaped like two symmetrical "E" letters combined, with the width of the central leg usually equal to that of the two side legs. This symmetrical structural design ensures a more uniform magnetic field distribution when winding the coil, which helps enhance the performance of the transformer. The pins of the EE-Type Bobbin are distributed on both sides of the bobbin, and their quantity and spacing vary according to different models and application requirements. Common sizes include EE5, EE8, EE13, EE19, etc. EE-Type Bobbins of different sizes are suitable for transformers of different power levels. For example, EE5 is used for low-power transformers and often applied in auxiliary power supplies for small electronic devices, while EE19 can be used in higher-power industrial power transformers.

2. Application Scenarios

EE-Type Bobbins are widely used in various types of transformers, including low-frequency transformers and high-frequency transformers. In the low-frequency field (e.g., power-frequency transformers), EE-Type Bobbins are often used in power transmission and distribution systems to convert high voltage into low voltage suitable for household and industrial use. In the high-frequency field (e.g., EE19 switching power supply transformers), EE-Type Bobbins can achieve efficient electrical energy conversion under high-frequency operating conditions, providing stable power for electronic devices. Additionally, EE-Type Bobbins are also applied in fields such as audio transformers and pulse transformers to meet the performance requirements of transformers in different applications.

3. Performance Advantages

The symmetrical structure of the EE-Type Bobbin results in uniform magnetic field distribution and low leakage inductance, which can improve the efficiency and power factor of the transformer. Therefore, it is also widely used in bobbins for EE05 LED driver transformer bobbin. Meanwhile, due to its simple structure, relatively mature manufacturing process, and low cost, it has high cost-effectiveness in the market. Besides, EE-Type Bobbins have high versatility—products with various sizes and pin configurations are easily available, which facilitates engineers' design and application work.

4.Contact us today to explore bulk orders or request technical specifications.

Email: sales008@mycoiltech.com

Whats app ID: +86 18788862885

Name：Alex~Mycoiltech

CIQTEK continues to expand its presence in Europe with the establishment of an SEM demo station in Spain, operated by the trusted local distributor IESMAT. Located in Madrid, the demo station features a CIQTEK High-Performance and Universal Tungsten Filament SEM Microscope SEM3200, providing Spanish users with convenient access to live demonstrations, sample testing, and hands-on operation. The facility also offers professional Spanish-language service and technical consultation, helping local customers better understand and apply CIQTEK’s advanced electron microscopy technologies.

Since the installation of the CIQTEK SEM3200, IESMAT has actively organized a series of seminars and workshops throughout 2025, typically held every one to two months. These events welcome researchers and professionals from academia and industry to explore the performance and advantages of CIQTEK scanning electron microscopes through hands-on sessions and interactive learning experiences.

IESMAT SEM Workshop in January 2025

IESMAT SEM Seminar in Feb, 2025

IESMAT Most Recent SEM Seminar in Sep, 2025

The next event, IESMAT Electron Microscopy Day II, will take place on November 6, 2025, in Madrid. Participants will enjoy:

• Live hands-on electron microscopy with the CIQTEK SEM3200

• Cutting-edge analytics using EDS and EBSD

• Insights into current trends and future directions of electron microscopy in Spain

The SEM demo station at IESMAT marks an important milestone in CIQTEK’s European development strategy. It enhances local accessibility to advanced electron microscopy technologies and provides researchers with authentic, real-world experience. Through close collaboration with partners like IESMAT, CIQTEK is deepening its engagement with the European market, promoting innovation, and building stronger connections with the scientific community.

CIQTEK remains committed to empowering global users through advanced instrumentation, localized service, and continuous collaboration for scientific progress.

This week, CIQTEK was pleased to welcome the team from our Korean distributor GSEM to the CIQTEK Electron Microscope Factory in Wuxi, China. The visit included members from sales, application, and service departments, who participated in a series of intensive and professional training sessions focused on electron microscope operation and maintenance.

The CIQTEK Electron Microscope Factory serves as the company’s dedicated manufacturing and training center for electron microscopy systems. Equipped with advanced production facilities, precision assembly lines, and demonstration laboratories, the factory integrates R&D, manufacturing, quality control, and user training to ensure high performance and reliability across CIQTEK SEM, FIB-SEM, and TEM product lines.

The training was hosted by Mr. Gao, Head of the Electron Microscopy Solutions Department at CIQTEK, together with senior engineers from the CIQTEK electron microscopy team. During the program, participants received systematic instruction on key procedures such as ion pump baking, aperture position inspection, filament centering, high-resolution imaging practice, and accessory installation and calibration.

Throughout the week, the GSEM team worked closely with CIQTEK engineers to gain both theoretical and practical understanding of CIQTEK’s electron microscopy technology. The sessions were designed to ensure that GSEM’s sales and service engineers are fully equipped with the technical expertise required to support local customers in Korea, from system installation and operation to advanced troubleshooting and maintenance.

This training not only enhanced GSEM’s technical capabilities but also strengthened the partnership between CIQTEK and GSEM. With continuous collaboration in product knowledge, application support, and customer service, CIQTEK and GSEM will jointly provide more professional, efficient, and reliable solutions to the Korean electron microscopy market.

CIQTEK remains committed to empowering global partners through professional training, technical collaboration, and continuous innovation in scientific instrumentation.

In the world of wearable technology, the Q520 Smart Ring stands out by proving that meaningful health insights don't require bulky devices. Weighing just 4.2 grams with a slim 2.1mm profile, this elegantly designed ring disappears on your finger while working quietly in the background to monitor your wellbeing. Crafted from medical-grade alloy using advanced vacuum plating technology, it combines durability with a sophisticated look that transitions seamlessly from workout sessions to formal occasions.

What makes the Q520 particularly valuable is its comprehensive approach to health tracking. The ring continuously monitors your heart rhythm, blood oxygen levels, and sleep patterns, providing gentle insights into your daily health trends. Unlike smartwatches that require frequent charging, the Q520 delivers up to six days of use on a single charge, and its 5ATM water resistance means you never need to remove it for showers or swimming. The automatic activity recognition tracks exercises like running and cycling, while the companion app presents your data in clear, understandable formats.

For those seeking a discreet health companion that fits effortlessly into their lifestyle, the Q520 offers the perfect solution. It provides the essential health monitoring most people need, without the complexity or conspicuousness of larger devices, making health awareness a natural part of your daily routine.

The T5 Smart Watch brings a new level of health awareness to your daily life through its thoughtful features and elegant design. Centered around a beautiful 1.43-inch AMOLED display that stays always visible, this watch keeps your important health information readily available without being overwhelming.

What makes the T5 special is its practical approach to health monitoring. The heart health feature lets you check your heart rhythm anytime, providing helpful insights about your cardiovascular status. The 30-second health check gives you a quick overview of your stress levels and body temperature, while the blood sugar trends feature helps you understand how your levels change throughout the day. For those keeping an eye on their metabolic health, the watch also tracks indicators like uric acid and lipids.

The T5 quietly works in the background, monitoring your heart rate, blood oxygen, sleep patterns, and blood pressure around the clock. With water-resistant construction and comfortable design, it fits seamlessly into your daily routine - whether you're working, exercising, or resting. For anyone looking to stay more connected to their wellbeing, the T5 offers gentle guidance and useful insights in a package that feels both sophisticated and approachable.

In the modern power electronics field, transformers are key devices for voltage conversion, electrical energy transmission, and distribution. Their performance directly affects the stable operation of the entire system. As a core structural component of transformers, the bobbin is like the framework of a building, playing a crucial role in the transformer's performance. Today, let's delve into the world of transformer bobbins and explore the mysteries of different types such as EF, EFD, ER, EE, POT, UU, EI, and PEE.

1. Basic Understanding of Bobbins

(1) Definition and Function of Bobbins

A bobbin, commonly known as a framework or spool in Chinese, is a key component in transformers used to support and wind coils. It not only provides physical support for the coils to ensure the accuracy of the coil's shape and position during winding but also serves as electrical isolation and insulation. This prevents short circuits between coils and between coils and the iron core, ensuring the safe and reliable operation of the transformer. Figuratively speaking, the bobbin is like the "skeleton" of the transformer, giving it its basic structural form while providing the necessary conditions for efficient electrical energy conversion.

(2).Overview of Bobbin Classification Methods

①.Classification by Magnetic Core Type: This is the most common classification method, as different magnetic core types correspond to different transformer application scenarios and performance requirements. Common types include EI, EE, EF, EPC, ER, RM, PQ, UU, etc. Each type can be further subdivided by magnetic core size, such as EE5, EE8, EE13, EE19, etc. This classification ensures that the bobbin of a high frequency electronic transformer can perfectly match a specific magnetic core, thereby maximizing the transformer's performance.

②.Classification by Shape: Bobbins can be divided into vertical and horizontal types based on shape. Vertical bobbins have pins perpendicular to the mounting plane and are typically used in compact spaces where vertical transformer installation is required, such as in power modules of small electronic devices. Horizontal bobbins have pins parallel to the mounting plane, occupying more horizontal space on the circuit board. However, they have advantages in applications with height restrictions, such as the bobbin of the PEE64 power adapter transformer in some flat-type power adapters.

③.Classification by Operating Frequency: Based on the transformer's operating frequency, bobbins can be categorized into high-frequency bobbins and low-frequency bobbins. Here, "frequency" refers to the number of periodic changes in the transformer during operation (measured in Hertz (Hz), often also in kilohertz (kHz), megahertz (MHz), or gigahertz (GHz)), not the number of uses. High-frequency bobbins are usually used in high-frequency transformers, such as the bobbin of the EE13 switching power supply transformer, with operating frequencies up to tens of kHz or even several MHz. The design and material selection of such bobbins must consider high-frequency characteristics, such as reducing high-frequency losses and improving insulation performance. Low-frequency bobbins are mainly used in low-frequency transformers, such as power frequency transformers, with typical operating frequencies of 50Hz or 60Hz. Low-frequency bobbins have relatively lower requirements for high-frequency characteristics but may have higher demands for mechanical strength and stability.

④.Classification by Pin Usage: Bobbins are divided into through-hole bobbins (DIP) and surface-mount bobbins (SMD) based on pin usage. Through-hole bobbins have long pins that can be directly inserted into the through-holes of the circuit board for soldering. This mounting method offers high mechanical strength and ease of maintenance and replacement but occupies more space on the circuit board. Surface-mount bobbins have short pins or use solder pads with Surface Mount Technology (SMT), allowing direct mounting on the surface of the circuit board. They have the advantages of small space occupation and suitability for high-density assembly, and are widely used in SMD-EFD20 home appliance transformer bobbins in modern home appliances.

3.Continuous updates...

4.Contact us today to explore bulk orders or request technical specifications.

Email: sales008@mycoiltech.com

Whats app ID: +86 18788862885

Name：Alex~Mycoiltech