In the early years, people relied on paper maps for self-driving trips. However, paper maps cannot be used to check routes while driving, and cannot quickly determine the current location. With the continuous development and progress of technology, navigation devices have quietly entered people's daily lives, bringing great convenience. Next, let's talk about the role of crystal oscillators in navigation devices.

First, the crystal oscillator provides an accurate time reference in the navigation device. By synchronizing with the external GPS satellite, the crystal oscillator can ensure that the time inside the navigation device is consistent with the global standard time. This is essential for the normal operation of the navigation device because it needs to accurately calculate information such as position, speed and direction.

Secondly, the crystal oscillator also provides a stable frequency signal. In radio navigation equipment, the crystal oscillator acts as an oscillator to generate a stable oscillation frequency. These frequency signals are used to modulate and demodulate wireless signals to achieve communication with navigation satellites or ground base stations. The stability and accuracy of the crystal oscillator are essential to ensure reliable communication between navigation equipment and the outside world.

In addition, crystal oscillators also play the role of frequency synthesis in radio navigation equipment. By combining multiple crystal oscillators together, higher frequency band signals can be generated to meet the needs of different navigation systems. This frequency synthesis technology enables radio navigation equipment to operate in a wide frequency range, improving the flexibility and adaptability of the navigation system.

Crystal oscillators play an important role in providing accurate time reference and stable frequency signals in radio navigation equipment. Its stability, accuracy and frequency synthesis capability are essential to ensure the normal operation of navigation equipment and reliable communication with the outside world. Therefore, crystal oscillators play an indispensable role in radio navigation equipment.

Simple Packaged Crystal Oscillators (SPXO)

SPXO is an oscillator for watches, which uses crystal resonance to create an electrical signal with a more precise frequency and are suitable for clock signal generators.

Voltage Controlled Crystal Oscillators (VCXO)

These crystal oscillators have a variable-capacitance diode inserted into a SPXO oscillation loop, and enables the oscillation frequency to change by varying the voltage of the external power supply. The temperature characteristic of these oscillation are equivalent to those of the SPXO loop and takes advantage of the good attributes of crystal resonators.

Temperature Compensated Crystal Oscillators(TCXO)

These high-precision crystal oscillators have a built-in circuit that corrects frequency variations resulting from temperature variations of the crystal resonator. It is optimal for applications where small frequency tolerance is required across a wide temperature.

Oven Controlled crystal Oscillator(OCXO)

OCXO is a super high-precision crystal oscillator with very small frequency variations by a built-in thermostatic bath, to maintain a constant temperature of the crystal resonator. Available to the frequency reference, such as instruments and infrastructure base stations.

Real Time Clock Module(RTC)

RTC is a high-precision crystal application product with built-in tuning-fork crystal oscillator,has an interrupt function and data provide function necessary for calendar clock function,such as year, month, day, hour, minute and second.

In electronic device design, the 32.768KHz crystal oscillator serves as the core component of Real Time Clocks (RTC), where stability andreliability are paramount. While EPSON's MC-306 series has long been a mainstream choice in the market, technological advancements and the need for supply chain diversification have made finding high quality alternatives a key concern for many engineers. The PMX206 series crystal oscillator from Zhejiang A Crystal Electronic Technology Co., Ltd. is specifically designed as a high performance alternative solution to meet this demand. 

Key Features of PMX206 Crystal (8038 SMD Tuning Fork Crystal PMX206, size 8.0*3.8*2.5 mm)

1. Excellent Frequency Stability  

Frequency range: 25.60KHz to 307.20KHz, covering a wide range of application needs  

Standard 32.768KHz frequency, fully compatible with MC-306  

Frequency tolerance: ±5ppm to ±100ppm (referenced at 25℃)  

Temperature coefficient:  0.034±0.006 ppm/℃², ensuring stable operation across various temperature environments  

2. Optimized Electrical Parameters  

High quality factor (Q): Typical value 75,000  

Series resistance (R1): 35KΩMin 50KΩMax  

Load capacitance (CL): Adjustable 6PF-30PF to accommodate different circuit designs  

Insulation resistance (IR): ≥500MΩ (DC100V±15V)  

Advantages of PMX206 Over MC-306  

1.   Wider Temperature Range  : PMX206 offers an operating range of  40℃ to +85℃, making it more suitable for extreme environments than the standard MC-306  

2.   Better Frequency Stability  : Excellent performance in temperature coefficient and aging rate ensures higher long term reliability  

3.   Flexible Load Capacitance Options  : Adjustable range of 6-30pF facilitates circuit design optimization  

4.   Supply Chain Advantages  : Zhejiang A Crystal, as a professional crystal oscillator manufacturer, provides stable supply assurance  

5.   Cost Effectiveness  : Competitive pricing while maintaining equal or better performance  

For engineers seeking alternatives to EPSON MC-306, the PMX206 offers excellent performance, reliable quality, and competitive pricing. Whether for new product designs or upgrades to existing products, PMX206 is a cost effective option worth considering. By choosing Zhejiang A Crystal, you not only get high quality crystal oscillator products but also professional technical support and supply chain security.  

Contact Us for Technical Support and Sample Requests  

Contact us today to learn how PMX206 can add value to your application!  

For more technical details about the PMX206 crystal or to request samples, please contact our sales team:  

Tel: 0086-576-89808609  

Email: market@acrystals.com  

Website: [www.acrystals.com](http://www.acrystals.com)  

32.768kHz crystal is a commonly used clock source, especially in electronic devices. This crystal is often used in real-time clock (RTC) and timing applications, such as watches, alarm clocks, thermometers, pedometers, etc.

Working principle:

32.768kHz crystal oscillator is an oscillator that generates a stable frequency through resonance phenomenon. It usually consists of a quartz crystal and related circuits.

1. Quartz crystal: Quartz crystal is a key component of the crystal oscillator. It is a material with a highly lattice structure and stable mechanical properties. The shape of the crystal can be cylindrical or flake with electrodes on both sides, flake is more common. The size of the quartz crystal determines the stability of the oscillation frequency.

2. Oscillation circuit: The oscillation circuit drives the quartz crystal to the resonance point and provides feedback to maintain the stability of the oscillation. The oscillation circuit usually consists of an amplifier, a feedback network and a compensation circuit.

- Amplifier: The amplifier is responsible for boosting the crystal oscillator's signal to offset the damping caused by the oscillation circuit and external load.

- Feedback network: The feedback network feeds a portion of the crystal oscillator's output signal back to the amplifier to maintain the stability of the oscillation. This feedback enhances at a specific frequency and attenuates at other frequencies, so that the oscillator only oscillates at the resonant frequency.

- Compensation circuit: The compensation circuit is used to compensate for the influence of temperature, power supply voltage and crystal aging on the oscillation frequency. It can be realized by combining a temperature sensor and a dedicated circuit.

Once the oscillator is working, the quartz crystal will generate a stable oscillation signal at a frequency of 32.768kHz through the oscillation circuit. This signal can be used to drive time-related electronic devices such as RTC after passing through the frequency divider.

It should be noted that the frequency of the 32.768kHz crystal oscillator was chosen because it is 2 to the 15th power and can be easily divided by multiples of 2 to produce a lower frequency clock signal.

A quartz crystal resonator is an electronic component that uses the piezoelectric effect of a quartz crystal to achieve frequency stabilization. The chemical composition of quartz is SiO2, which belongs to the hexagonal oxide mineral system, mainly including low-temperature quartz (α-quartz) and high-temperature quartz (β-quartz). This crystal produces a piezoelectric effect when subjected to pressure or heat, which is the fundamental physical property of its use as a resonant device.

In actual manufacturing, the basic structure of a quartz crystal resonator is: thin slices are cut from the quartz crystal at a specific azimuth angle (such as AT cut or BT cut), electrodes are made by silver plating on both sides, and the leads are welded and then packaged to form a complete device. The products are usually packaged in metal shells, but they can also be packaged in glass, ceramic or plastic. When an alternating voltage is applied to the electrodes, the chip will produce mechanical vibrations, and when the voltage frequency is consistent with the natural frequency of the chip, a significant piezoelectric resonance phenomenon will occur.

The piezoelectric effect of quartz crystal is characterized by bidirectional conversion: applying an electric field produces mechanical deformation (inverse piezoelectric effect), while applying mechanical pressure produces an electric field (postive piezoelectric effect). This characteristic makes its mechanical vibration equivalent to inductance L, which together with static capacitance C0 forms an LC resonant circuit. This structure enables the Q value of the quartz resonator to reach tens of thousands or even millions, which is far superior to ordinary LC oscillation circuits.

Quartz crystal resonators mainly operate in two modes: fundamental frequency and overtone. By optimizing the electrode design and the wafer cutting method, the performance of specific modes can be improved for different application scenarios. Due to their excellent frequency stability, these devices are widely used in communication equipment, computer systems, consumer electronics and other fields.

With the development of technology, modern quartz crystal resonators have been able to meet the diverse needs from ordinary consumer electronics to high-precision industrial equipment. Through special cutting methods and packaging processes, the temperature stability and reliability of the product can be further improved, allowing it to continue to play a key role in emerging fields such as 5G communications and the Internet of Things.

Across chemistry and materials science labs, EPR spectrometers have powered research for decades. But as experimental needs advance, many facilities are facing the same question: When is it time to modernize your EPR system?

Instead of costly full replacements, more labs are turning to targeted modernization to bring aging EPR equipment up to current research standards while maximizing existing hardware investment.

The Hidden Cost of Outdated EPR Instruments

Many EPR spectrometers installed in the 1990s or early 2000s still function for basic CW measurements. However, as field stability weakens, control electronics degrade, and cryogenic components age, research capabilities gradually decline.

A materials group in Germany recently struggled to maintain pulse stability on their 20-year-old system while expanding into low-temperature spin dynamics. With spare parts becoming scarce, their system downtime was increasing.

Similar challenges appear in US chemistry departments, where outdated control software makes EPR training unnecessarily complex for graduate students. Some labs operate systems that only a few technicians can run reliably.

What EPR Modernization Really Delivers

Modernizing an EPR system allows labs to extend instrument lifetime and add advanced functionality significantly. Instead of replacing entire magnets or RF hardware, EPR modernization and upgrades focus on:

 - Digital control electronics with improved field precision

 - Pulse EPR capability with modern phase coherence and timing resolution

 - Seamless integration of nitrogen and helium cryostat systems for variable temperature studies

 - Fully digital software interfaces that simplify both teaching and advanced research

This approach preserves valuable core components while dramatically expanding experimental capability.

Real-World Case: Advanced Materials Research Enabled by EPR Modernization

At a leading national laboratory in China, a research team studying spin defects and paramagnetic centers encountered serious limitations with their legacy EPR system. Their older EPR spectrometer lacked the phase stability and pulse flexibility required for precise coherence and relaxation measurements. After a full digital control and pulse module upgrade delivered by CIQTEK, the lab successfully expanded into advanced pulse EPR experiments while preserving its existing hardware setup. 

Similar modernization projects have been successfully completed at several European research institutes, supporting new work in catalysis, spintronics, and materials characterization.

Why CIQTEK Modernization and Upgrade Is Gaining Momentum Worldwide

Full EPR system replacement can be financially challenging and logistically disruptive. CIQTEK EPR modernization services offer a highly cost-effective alternative by:

 - Extending instrument life by 10 years or more

 - Providing cutting-edge pulse and VT functionality

 - Lowering training barriers with intuitive, modern software

 - Minimizing lab downtime during transition

Importantly, CIQTEK supports EPR modernization and upgrade services with comprehensive local service support worldwide, complemented by expert application training and rapid remote diagnostics to minimize research interruptions.

CIQTEK EPR Modernization: Upgrade Smarter, Not Harder

Whether your lab needs:

 - Full digital control upgrades

 - Pulse EPR expansion modules

 - Variable temperature system integration

 - Modern teaching software platforms

CIQTEK delivers proven EPR modernization and upgrade solutions already operating in labs worldwide.

If your existing EPR system is limiting your research, CIQTEK EPR modernization can unlock new capabilities while protecting your hardware investment.

>> Learn more or schedule a technical consultation now.

In an era of distributed computing and smart devices, edge processing is rapidly gaining momentum. As workloads shift from centralized data centers to edge nodes, maintaining reliable and precise timing becomes paramount. One of the foundational components ensuring this precision is the crystal oscillator, a small yet vital element responsible for generating stable frequency signals.

Precision Timing in Edge Nodes: Why It Matters

Edge nodes often function autonomously or semi-autonomously, handling tasks like data filtering, event detection, and preliminary analytics before forwarding information to the cloud. These decentralized systems must operate in tight synchronization with one another—whether for load balancing, sensor fusion, or time-stamped event coordination.

The accuracy of local clocks directly impacts the response speed and coherence of the entire network. Even minor timing discrepancies can lead to data loss, processing delays, or misaligned decision-making in time-sensitive systems. For example, in an autonomous vehicle or an industrial automation setup, asynchronous behavior across modules may introduce safety risks or lower operational efficiency.

This is where low-phase-noise crystal oscillators come into play. They generate clean, precise clock signals that serve as the timing backbone of microcontrollers and processors within edge devices.

RTC and TCXO: Stable Timing for Remote and Offline Applications

In locations without continuous internet access or GPS signals—such as remote environmental monitoring stations, IoT-enabled agriculture systems, or military-grade communication units—maintaining an accurate internal clock becomes more challenging.

Real-Time Clock (RTC) crystals are commonly used in these cases to track time with minimal power consumption. These oscillators often work alongside a backup power supply to preserve timing data even when the main system is shut down. Although RTCs typically offer modest accuracy, their ultra-low power design makes them ideal for battery-operated and solar-powered edge applications.

For more timing-sensitive applications in temperature-variable environments, Temperature-Compensated Crystal Oscillators (TCXOs) offer a critical advantage. Unlike standard oscillators that may drift due to thermal fluctuations, TCXOs integrate a temperature sensor and compensation circuit, ensuring stable output frequency across a wide range of operating temperatures. This feature is especially valuable in outdoor equipment, transportation systems, and aerospace technology.

Miniaturization and High Frequency: Enabling Advanced Edge Applications

As edge devices shrink in size and increase in complexity, the demand for compact, high-frequency oscillators has surged. These components must fit within constrained PCB real estate while offering the same—if not better—frequency stability and performance as their larger predecessors.

Miniaturized SMD (Surface-Mount Device) crystal oscillators, such as those in the 2016 or 1612 packages, are increasingly adopted in wearable electronics, smart sensors, and portable medical equipment. Their high operating frequencies (ranging from 20 MHz to hundreds of MHz) support high-speed data processing and communication protocols like Bluetooth Low Energy (BLE), Wi-Fi, and LTE-M.

Moreover, higher frequencies allow for more refined timing resolution, which is essential for edge AI workloads, video streaming, and real-time data encryption.

Applications Across Industry Domains

Crystal oscillators in edge environments are not confined to a single vertical. In smart manufacturing, they regulate motion control systems and robotic arms with millisecond-level precision. In telecommunication, small-form TCXOs ensure cellular base stations and repeaters maintain signal integrity. Even in healthcare, portable diagnostic devices rely on micro crystal oscillators to deliver accurate results and continuous patient monitoring.

As computing shifts closer to where data is generated, timing precision becomes non-negotiable. Crystal oscillators—particularly RTC and TCXO models—play a vital role in ensuring synchronized operations in remote and edge environments. Their contribution is amplified when combined with miniaturized form factors and high-frequency performance, allowing edge hardware to be both compact and powerful.

In this evolving ecosystem, choosing the right oscillator is not merely a design decision—it is a foundational requirement for maintaining operational stability, energy efficiency, and long-term reliability.We can provide you with the most professional and suitable solutions for your professional needs of crystal oscillators. For details, please contact us at ivy@jghcrystal.com and we will contact you within 24 hours.

How to Choose Between RO4350B, PTFE, and Ceramic-Filled Substrates？

Introduction

High-frequency PCBs are critical in modern RF and microwave applications, including 5G communications, radar systems, and satellite technology. Selecting the right substrate material is essential to ensure signal integrity, thermal stability, and manufacturability. Three of the most commonly used high-frequency PCB materials are Rogers RO4350B, PTFE (Teflon), and ceramic-filled laminates.

In this guide, we’ll explore the properties, advantages, and trade-offs of each material and provide insights on how to choose the best option for your application. We’ll also showcase a real-world6-layer RF PCB example using RO4350B and RO4450F bondply to illustrate material selection in practice.

Key Considerations for High-Frequency PCB Materials

Before diving into material specifics, let’s outline the key factors that influence substrate selection:

• -Dielectric Constant (Dk)–Affects signal propagation speed and impedance control.
• -Dissipation Factor (Df)–Determines signal loss at high frequencies.
• -Thermal Conductivity–Important for heat dissipation in power applications.
• -Coefficient of Thermal Expansion (CTE)–Impacts reliability under thermal cycling.
• -Manufacturability–Some materials require specialized processing.
• -Cost- High-performance materials can be expensive.

Now, let’s compare the three leading high-frequency PCB materials.

1. RO4350B: The Cost-Effective High-Performance Option

Rogers 4350B is a woven glass-reinforced hydrocarbon/ceramic laminate that offers a balance between electrical performance and ease of fabrication.

Key Features of RO4350B

• -Dielectric Constant (Dk): 3.48±0.05 @ 10 GHz
• -Dissipation Factor (Df): 0.0037 @ 10 GHz (low loss)
• -Thermal Conductivity: 0.69 W/m/°K (better than FR4)
• -CTE: Low expansion (X/Y: 10-12 ppm/°C, Z: 32 ppm/°C)
• -Tg (Glass Transition Temp): >280°C (excellent thermal stability)
• -Moisture Absorption: 0.06% (minimal impact on performance)

Why Choose RO4350B?

✔Cost-Effective Alternative to PTFE–RO4350B performs close to PTFE but at a lower cost.

✔Compatible with Standard FR4 Processes–No special drilling or plating required.

✔Stable Dk Over Frequency & Temperature–Ideal for RF and microwave circuits.

Example: 6-Layer RF PCB Using RO4350B

Here’s a real-world PCB we manufactured using RO4350B cores and RO4450F bondply:

Layer Count: 6

Dimensions: 98.5 mm×68 mm (±0.15mm)

Min Trace/Space: 4/6 mils

Min Hole Size: 0.3mm

Blind Vias: L1-L2, L3-L6, L5-L6

Board Thickness: 1.8mm

Surface Finish: Immersion Gold

Solder Mask: Green (top & bottom)

Quality Standard: IPC-Class-2

Stackup Structure:

Top Layer (35µm Cu)

RO4350B Core (0.254mm)

Inner Layer (35µm Cu)

RO4450F Bondply (4mil, 2x)

RO4350B Core (0.762mm)

Bottom Layer (35µm Cu)

This design is optimized for RF applications with controlled impedance and low insertion loss.

2. PTFE (Teflon): The Ultra-Low Loss Solution

PTFE (Polytetrafluoroethylene) is the gold standard forultra-high-frequency PCBs due to its extremely low loss.

Key Features of PTFE

• Dk: 2.1–3.5 (varies with filler material)
• Df: As low as 0.0009 (best for mmWave applications)
• Thermal Stability: Excellent, but high CTE (~160 ppm/°C)
• Challenges: Requires specialized drilling/plating processes.

When to Use PTFE?

✔Millimeter-Wave (mmWave) Circuits (24GHz+, 5G, radar)

✔Extremely Low-Loss Applications (satellite comms, aerospace)

✖Not Ideal for Cost-Sensitive Projects (higher fabrication costs)

3. Ceramic-Filled Materials: High Thermal & Mechanical Stability

Ceramic-filled substrates (e.g.,Rogers RO3000 series) offer enhanced thermal conductivity and mechanical strength.

Key Features of Ceramic-Filled Laminates

• Dk: 3.0–10.2 (adjustable based on ceramic content)
• Df: 0.001–0.003 (low loss, but not as good as PTFE)
• Thermal Conductivity: Up to 4 W/m/°K (great for power amplifiers)
• CTE: Matches copper (~17 ppm/°C), reducing warping risks.

Best Applications for Ceramic-Filled PCBs

✔High-Power RF Devices (base stations, power amplifiers)

✔Applications Needing Heat Dissipation (automotive radar, LED PCBs)

Material Selection Guide: RO4350B vs. PTFE vs. Ceramic

Which One Should You Choose?

• For most RF applications (up to 20GHz), RO4350B Frequency PCB is the best balance of cost and performance.
• For mmWave (24GHz+), PTFE is ideal but expensive.
• For high-power/high-thermal applications, ceramic-filled laminates are superior.

Conclusion

Selecting the right high-frequency PCB material depends on your application’s frequency range, thermal requirements, and budget.

RO4350B PCB is the best all-around choice for most RF designs, offering low loss, stable Dk, and easy fabrication.

PTFE is unmatched for ultra-low-loss mmWave circuits but comes at a higher cost.

Ceramic-filled materials excel in high-power and high-thermal scenarios.

Our 6-layer RF PCB example demonstrates howRogers4350B and RO4450F bondply can be used effectively in real-world designs. If you need high-frequency PCBs with optimized material selection, we provide global manufacturing with IPC-Class-2 quality standards.

Need a custom RF PCB solution? Contact us today for expert guidance!

PTFE Materials Are Difficult to Process—How to Solve Lamination and Drilling Challenges?

Introduction

Polytetrafluoroethylene (PTFE), commonly known by the brand name Teflon (TFE), is a high-performance material widely used in printed circuit boards (PCBs) for high-frequency applications. Its low dielectric constant (Dk) and dissipation factor (Df) make it ideal for RF, microwave, and millimeter-wave circuits. However, TFE materials like Rogers RT/duroid 5880 present significant challenges in lamination and drilling due to their unique properties.

In this article, we’ll explore the key difficulties in TFE material PCB fabrication and provide practical solutions to overcome them. We’ll also highlight how our 3-layer rigid PCB with RTduroid 5880 and RO4450F bonding ply successfully addresses these challenges while maintaining high-frequency performance.

Why TFE Materials Are Difficult to Process

PTFE-based laminates like RT/duroid 5880 offer outstanding electrical properties, including:

• -Low dielectric constant (Dk = 2.2±0.02)
• -Ultra-low dissipation factor (Df = 0.0009 at 10 GHz)
• -Excellent thermal stability

However, these benefits come with manufacturing challenges:

1. Lamination Difficulties

• -Poor Adhesion: PTFE is inherently non-sticky, making it difficult to bond with copper layers.
• -Thermal Expansion Mismatch: PTFE has a higher coefficient of thermal expansion (CTE) than copper, leading to potential delamination.
• -Resin Flow Control: Excessive heat and pressure can cause resin squeeze-out, affecting dielectric thickness.

2. Drilling Challenges

• -Material Softness: PTFE is soft and prone to smearing during drilling, leading to poor via quality.
• -Thermal Sensitivity:Excessive heat from drilling can degrade PTFE’s electrical properties.
• -Hole Wall Roughness: Improper drilling can result in rough via walls, affecting signal integrity.

Solutions for Successful TFE PCB Fabrication

1. Optimizing Lamination for TFE Materials

a) Use Special Bonding Materials

To improve adhesion, we use RO4450F bonding ply—a thermoset material compatible withPTFE laminates. In our 3-layer PCB stackup, RO4450F ensures strong interlayer bonding while maintaining electrical performance.

Our PCB Stackup Example:

Layer 1: Copper (35μm)

Core: RT/duroid 5880 (1.575 mm)

Layer 2: Copper (35μm)

Bonding Ply: RO4450F (0.102 mm)

Core: RT/duroid 5880 (1.575 mm)

Layer 3: Copper (35μm)

b) Controlled Lamination Parameters

• Temperature & Pressure: Precise control prevents resin flow issues and maintains consistent dielectric thickness.
• Slow Ramp-Up Rates: Gradual heating minimizes thermal stress, reducing delamination risks.

2. Overcoming Drilling Challenges

a) Specialized Drill Bits & Parameters

• Carbide Drill Bits: Harder than standard drills, reducing PTFE smearing.
• Optimized RPM & Feed Rate: Prevents excessive heat buildup.

b) Laser Drilling for Micro-Vias

• For smaller holes (0.4mm in our PCB), laser drilling provides cleaner, more precise vias with minimal wall roughness.

c) Post-Drilling Treatments

• Plasma Etching: Removes PTFE residue from via walls.
• Via Plating (20μm in our PCB): Ensures reliable electrical connections.

Case Study: Our 3-Layer RT/duroid 5880 PCB

To demonstrate successful TFE material processing, here’s a breakdown of our high-frequency PCB solution:

Key Specifications:

Material: RT/duroid 5880 (core) + RO4450F (bonding ply)

Layers: 3

Board Thickness: 3.3 mm

Min Trace/Space: 5/7 mils

Min Hole Size: 0.4 mm

Via Plating Thickness: 20μm

Surface Finish: Immersion Gold (enhances signal integrity)

Why This Design Works for High-Frequency Applications?

✔Low Signal Loss: RT/duroid 5880’s ultra-low Df ensures minimal RF attenuation.

✔Stable Dk: Uniform dielectric constant across frequencies.

✔Robust Construction: RO4450F bonding ply prevents delamination.

✔Precision Drilling: 0.4mm vias with 20μm plating ensure reliable interconnects.

Conclusion: Partner with a PCB Supplier Experienced in TFE Materials

Fabricating High Frequency PTFE PCB with RT/duroid 5880 and other PTFE-based materials requires specialized expertise in lamination, drilling, and thermal management. By optimizing bonding materials, drilling techniques, and lamination processes, we deliver high-performance PCBs for RF, aerospace, and millimeter-wave applications.

Looking for a reliable TFE PCB supplier? Our 3 Layer High Frequency PCB RT/duroid 5880 is IPC-Class-2 compliant, electrically tested, and available worldwide. Contact us today for high-frequency PCB solutions tailored to your needs!

What Are the Design Considerations for Hybrid High-Frequency PCBs?

Introduction

Hybrid (mixed dielectric) high-frequency PCBs combine different materials to optimize electrical performance, thermal stability, and manufacturability. These mixed dielectric hybrid boards are widely used in RF/microwave applications, aerospace, radar systems, and telecommunications, where signal integrity and thermal management are critical.

Designing hybrid PCB requires careful consideration of material properties, layer stackup, signal integrity, and manufacturing constraints. In this article, we explore key design considerations and provide practical insights, using a 4-layer hybrid PCB (RO4350B + High-Tg FR-4 S1000-2M) as an example.

1. Material Selection and Compatibility

Key Factors in Material Selection

Dielectric Constant (Dk) & Loss Tangent (Df):

• -High-frequency signals require stable Dk and low-loss materials (e.g., Rogers RO4350B with Dk=3.48, Df=0.0037).
• -FR-4 (S1000-2M) provides mechanical support but has higher loss, so it’s best used in non-critical layers.

Thermal Expansion (CTE) Mismatch:

• -RO4350B has a CTE close to copper (X/Y: 10-12 ppm/°C), reducing warpage and via reliability issues.
• -S1000-2M offers excellent Z-axis CTE for plated through-hole (PTH) reliability.

Thermal Conductivity & Tg:

• -RO4350B has a high Tg (>280°C) and thermal conductivity (0.69 W/m/°K), making it suitable for high-power RF designs.
• -S1000-2M (Tg 180°C) provides mechanical stability and lead-free compatibility.

Example PCB Construction

Our 4-layer hybrid circuit board combines:

Signal Layers (RO4350B): Optimized for RF performance.

Core/Prepreg (FR-4 S1000-2M): Provides structural integrity.

Stackup:

Layer 1 (RF Signal): 35μm Cu + RO4350B (0.254mm)

Layer 2 (Ground/Power): 35μm Cu + Prepreg (0.254mm)

Layer 3 (Inner Signal): 35μm Cu + S1000-2M (0.8mm)

Layer 4 (Bottom Layer): 35μm Cu

2. Signal Integrity and Impedance Control

Critical Design Rules

Controlled Impedance Routing:

• RO4350B’s stable Dk allows precise impedance matching (e.g., 50Ωmicrostrip lines).
• Use field solvers to calculate trace width/spacing (e.g., 4/6 mil traces in our example).

Minimizing Crosstalk & Loss:

• Keep high-speed traces short and avoid sharp bends.
• Use ground planes (Layer 2 in our stackup) to reduce interference.

Via Optimization:

• Our example Hybrid PCB Board PCB uses 0.20mm minimum hole size with 20μm plating thickness for reliability.
• Avoid blind vias to simplify manufacturing (as seen in our design).

3.Thermal Management Considerations

Preventing Delamination & Warpage

• CTE Matching: RO4350B’s low CTE reduces stress between layers.
• Thermal Relief in Pads: Prevents excessive heat during soldering.

Heat Dissipation Strategies

• Copper Weight: Our PCB uses 1oz (35μm) copper for balanced current handling and heat spreading.
• Surface Finish: ENIG (Electroless Nickel Immersion Gold) ensures reliable solderability and corrosion resistance.

4. Manufacturing and Reliability

Fabrication Tolerances

• Board Dimensions: 173mm x 85.3mm (±0.15mm tolerance).
• Solder Mask & Silkscreen: Green solder mask (top/bottom) with white/green silkscreen for component marking.

Quality Assurance

• 100% Electrical Testing: Ensures no short/open circuits before shipment.
• IPC-Class-2 Compliance: Guarantees reliability for commercial applications.

5. Applications of Hybrid High-Frequency PCBs

Our example PCB (RO4350B + S1000-2M) is ideal for:

✅Radar & Guidance Systems (stable Dk, low loss)

✅5G & Millimeter-Wave Antennas (precise impedance control)

✅Aerospace & Defense Electronics (high thermal reliability)

Conclusion

Designing hybrid high-frequency PCBs requires a balance between material properties, signal integrity, and manufacturability. By selecting compatible materials (like RO4350B FR-4 hybrid PCB), optimizing stackup, and following best practices in impedance control and thermal management, engineers can achieve high-performance RF/microwave designs.

Looking for a reliable hybrid PCB supplier? Our 4-layer mixed-dielectric PCB (RO4350B + S1000-2M) meets stringent RF and thermal requirements while ensuring cost-effective production. Contact us today for your high-frequency PCB needs!