From September 23 to 25, 2025, CIQTEK made a strong impression at ARABLAB 2025, held at the Dubai World Trade Center. At Booth H1-C24 in Sheikh Saeed Hall 1, we demonstrated our latest scientific instruments and oilfield technologies to a diverse international audience.

CIQTEK Showcases Next-Generation Instruments at ARABLAB 2025

 

Highlights & Achievements

  • Comprehensive Portfolio Displayed
    We presented flagship systems in electron microscopy (FIB/SEM, TEM), nuclear magnetic resonance (NMR) spectrometers, and BET surface area & porosimetry analyzers—underscoring our commitment to advancing analytical science.

  • Integration of Oilfield Solutions under the QOILTECH Brand
    Under our specialized QOILTECH line, we introduced tools for petroleum exploration, including RSS, MWD/LWD systems, and near-bit gamma tools. These offerings were well received by participants seeking robust instrumentation for extreme environments.

  • Strong Engagement & Feedback
    At the booth, we addressed technical queries and shared success stories from across the research and industry sectors. Many attendees expressed interest in follow-up collaborations, demos, and trial opportunities.

  • Global Networking & Partnerships
    ARABLAB 2025 brought together distributors, end-users, and scientific institutions from across the world. CIQTEK strengthened relationships and opened dialogues for future regional projects and partnerships in the Middle East and beyond

 

 

CIQTEK thanks all visitors, partners, and colleagues who joined us in Dubai!

We look forward to continued collaboration and impactful research ahead!

Four-dimensional scanning transmission electron microscopy (4D-STEM) is one of the most cutting-edge directions in electron microscopy. By performing a two-dimensional scan across the sample surface while recording a full diffraction pattern at each scan point with a pixelated detector, 4D-STEM generates a four-dimensional dataset containing both real-space and reciprocal-space information.

This technique breaks through the limitations of conventional electron microscopy that typically collects only a single scattering signal. Instead, it captures and analyzes the entire spectrum of electron–sample interactions. With 4D-STEM, researchers can achieve multiple advanced functionalities within a single experiment, including virtual imaging, crystal orientation and strain mapping, electric and magnetic field distribution analysis (differential phase contrast), and even atomic-resolution reconstruction through diffraction stacking. It greatly expands the dimensionality and depth of materials characterization, offering an unprecedented tool for nanoscience and materials research.

 

At the Chinese National Conference on Electron Microscopy 2025 (Sept 26–30, Wuhan), CIQTEK releases its 4D-STEM solution, designed to break through the boundaries of traditional imaging and deliver data with unmatched dimensionality and analytical power.

 

System Workflow

CIQTEK Unveils 4D-STEM Solution for Advanced Electron Microscopy-workflow

 

The CIQTEK 4D-STEM solution features high spatial resolution, multi-dimensional analysis, low-dose operation to minimize beam damage, and flexible data processing, providing researchers with reliable and outstanding methods for advanced materials analysis.

Research on the microscopic behavior of materials is entering a new era of multi-scenario coupling and in-situ dynamic characterizationCIQTEK has launched an innovative In-situ Mechanical Testing Solution, designed with outstanding openness and compatibility. It enables seamless integration of CIQTEK’s full range of electron microscopes with mainstream in-situ testing devices, providing a flexible and efficient platform for coupled analysis in diverse research scenarios.

 

Breaking the limitations of closed systems, the solution integrates all critical elements required for in-situ EM adaptability, featuring:

  • High beam current: >100 nA, ideal for fast EDS/EBSD analysis

  • Large space: 360 × 310 × 288 mm (L × W × H)

  • High load capacity: 5 kg (up to 10 kg with custom fixtures)

  • Multi-view CCDs: ensuring system safety during in-situ operation

  • Multiple interfaces: supporting customized flange accessories

  • Pre-acceptance: full accessory debugging before delivery, ensuring complete functionality without on-site installation issues

The solution can be configured across CIQTEK’s full range of electron microscopy products, including CIQTEK SEM3200SEM5000XDB550 dual-beam systems, and more. It also offers seamless compatibility with tensile stages, heating stages, nanoindenters, and electrochemical workstations from world-leading suppliers. This open architecture enables researchers to flexibly combine the most suitable equipment, maximizing experimental performance.

 

CIQTEK’s in-situ stage solution supported customers in publishing a high-impact paper (DOI: 10.1126/science.adq6807).

CIQTEK In-situ Mechanical Testing Solution for SEM

 

CIQTEK’s In-situ Mechanical Solution also supports multi-field coupling (mechanical, thermal, electrochemical), enabling nanoscale real-time observation of materials under complex environments. By synchronizing high-resolution imaging with in-situ signals, researchers can capture critical phenomena such as crack propagation, phase transitions, and interfacial reactions with precision.

With a temperature range of -170 to 1200 °C, advanced load control, and rapid response systems, it accurately simulates service conditions of materials across various industries. Combined with EBSD and EDS, it provides comprehensive datasets for understanding material behavior under coupled stimuli.

 

Successfully applied in aerospace materials, new energy devices, and biomedical materials, this solution demonstrates CIQTEK’s exceptional compatibility and scalability in advanced electron microscopy platforms.

In life sciences, achieving high-precision and large-scale 3D structural and dynamic analysis of biological samples such as cells and tissues has become key to breaking through research bottlenecks. CIQTEK has introduced a multi-technology-route Volumetric Electron Microscopy (VEM) solution, integrating SS-SEM, SBF-SEM, and FIB-SEM. This provides an all-around, high-performance, and intelligent platform for biological 3D reconstruction, helping researchers uncover the micro-level mysteries of life.

 

Three Advanced Technical Routes

01. SS-SEM High-Speed Imaging
By combining external serial sectioning with the CIQTEK high-speed HEM6000-Bio SEM, this solution enables rapid imaging and automated acquisition of large-volume samples. Data acquisition efficiency is more than 5× higher than conventional SEM, supporting 24/7 unattended high-throughput operation.

 

02. SBF-SEM In-Situ Sectioning
Based on the CIQTEK ultra-high-resolution SEM5000X with an integrated microtome, this approach achieves in-situ sectioning and imaging cycles. It offers simple operation, high automation, and effectively avoids surface contamination.

 

03. FIB-SEM High-Precision Analysis
Leveraging focused ion beam–electron beam dual-beam systems, this route delivers nanoscale Z-axis resolution to analyze fine structures such as organelles and membranes. It enables in-situ 3D reconstruction without physical slicing.

 

Intelligent Integration & Broad Applications

The CIQTEK VEM solution deeply integrates AI algorithms and a multilingual software platform, supporting a full workflow from data acquisition, image alignment, and segmentation to 3D visualization. Compatible with mainstream reconstruction software, it significantly lowers the learning curve.

 

Application cases span neuroscience, cell biology, and pathogenic microbiology, offering a powerful tool for advancing life science research.

CIQTEK Volumetric Electron Microscopy (VEM) Solution

As semiconductor manufacturing advances to finer process nodes, wafer-level defect analysis, failure location, and micro-nano fabrication have become key to improving yield. CIQTEK introduces the 8-inch Wafer Dual-Beam Full-Size Processing Solution, combining high-resolution imaging and precise ion beam processing to achieve "observation-analysis-cutting" across the entire wafer, providing strong technical support for advanced semiconductor processes.

 

This solution features a 150mm long-stroke high-precision sample stage, enabling full-wafer, non-destructive observation and processing of 8-inch wafers. With an external optical navigation system and intelligent anti-collision algorithms, it ensures rapid and precise wafer positioning and safe operation. The system is equipped with a Schottky field emission electron gun, offering a resolution of 0.9 nm @ 15kV, and an ion beam resolution of 3 nm @ 30kV, capable of defect detection, cross-section slicing, and micro-structure fabrication at the nanoscale.

 

Core Advantages:

  • 150mm Travel Stage:
    • Combines long travel with high precision for an extensive observation range.

    • Excellent compatibility with different-sized fixtures.

    • Robust structure ensures wafer stability and quick, reliable loading.

  • 8-inch Quick Exchange:
    • Intelligent weight-bearing design with a sliding base for stability and durability.

    • Full-size compatibility: Supports 2/4/6/8-inch wafers.

    • Fast sample exchange: Vacuum pumping and sample loading within one minute.

  • Software and Anti-Collision:
    • Fully automatic intelligent navigation with accurate movement and positioning.

    • Multi-axis coordinated motion for full-wafer observation.

    • Smart anti-collision: Trajectory simulation and algorithmic spatial calculations to avoid risks.

    • Multiple real-time monitoring: Real-time multi-angle monitoring of wafer position.

  • External Optical Navigation:

    • Ultra-stable structure design suppresses image shake.

    • High-definition imaging with a precise field of view for full-wafer display.

    • Professional anti-glare lighting reduces wafer surface reflection.

 

Wafer observation range

Wafer observation range

 

CIQTEK Dual-Beam Electron Microscope Solution combines outstanding hardware with intelligent software systems, enabling efficient defect detection and process optimization through one-click brightness and contrast adjustment, auto-focus, and multi-format image output, empowering users to complete the full chain of tasks from defect discovery to process optimization.

In today’s fast-paced world, keeping track of your health and fitness has never been more important. The ET585 smartwatch brings cutting-edge technology directly to your wrist, offering a comprehensive suite of features designed to monitor, manage, and improve your well-being.

 

The 2.04-inch AMOLED Retina full-touch display delivers vibrant visuals with a 368×448 resolution, making it easy to navigate through apps, health metrics, and notifications. Built for professional health monitoring, ET585 includes ECG and HRV detection, 30-second micro physical examinations, and full-day heart rate monitoring to help detect early signs of arrhythmia and assess cardiovascular health. Blood oxygen, blood pressure, and even non-invasive blood sugar monitoring keep track of essential physiological parameters, while body composition and BMI measurement provide deeper insight into your fitness progress. Emotional fatigue detection and women’s health tracking further personalize your wellness experience.

 

Fitness enthusiasts will love ET585’s support for over 130 sports modes, step counting, calorie tracking, and distance measurement. The watch also monitors sleep patterns scientifically, analyzing snoring and respiratory risks for better rest.

 

Beyond health and fitness, ET585 integrates smart lifestyle features such as Bluetooth calling, music playback and control, NFC access, alarms, weather updates, flashlight, games, and a voice assistant.

 

Whether you’re tracking your daily steps, monitoring heart health, or staying connected on the go, ET585 combines precision, style, and intelligent functionality into one sleek wearable. It’s more than a smartwatch—it’s a personal health companion that adapts to your lifestyle and empowers you to live smarter and healthier.

NFC access control smart wearable

 

Palm Vein Scanner swiping technology, a cutting-edge biometric technology, provides comprehensive support for identity verification. Based on a proprietary multimodal palm swiping camera and paired with SFT biometric algorithms, palm swiping technology significantly improves the security and efficiency of identity verification, enabling rapid authentication and permission management in all scenarios. Furthermore, the contactless service provided by this technology effectively reduces the risk of contact transmission, improves public health and safety, and provides a superior user experience.

 

Palm Prints scanner in Transportation:

 Airport Line

China's first subway line to feature palm-swipe payment ushers in a new era of "contactless travel."

The implementation of the palm-swipe system on the Daxing Airport Line marks the official entry of rail transit into the biometric 3.0 era. Palm-swipe biometric technology redefines subway travel and ushers in a new era of "contactless travel" in smart transportation. This not only significantly improves passenger travel efficiency but also promotes the deep integration of artificial intelligence technology in public services.

 

Palm prints scanner in transporation

 

Wireless Palm vein swiping module used  in Stadium:

 

Palm vein scanner in sports

Swimming Pool

"One-Palm Access": China's first large-scale sports venue full-scene palm scanning application demonstration project

The  Swimming Pool of the National Olympic Center has officially launched its "Palm Scan Access" system. Leveraging innovative multimodal biometric technology, this system redefines the sports and fitness experience, offering contactless access throughout the entire experience with just one palm, creating a new model for smart sports venue services.

 

Gym

Palm Check-in: A New Smart Fitness Experience

Gym's palm check-in marks the first application of palm-scanning biometrics in the fitness industry. Leveraging multimodal biometric technology, it enables contactless, ultra-fast identity verification, effectively addressing issues such as card fraud, long queues, and unsanitary conditions associated with traditional QR code check-in.

 

Palm vein Payment Reader in Retailing:

 

WeChat Payment Palm vein scanner

 

 7-Eleven Convenience Stores

Over 1,500 stores now support palm payment, offering a new "swipe and pay" experience.

As one of the first convenience store brands nationwide to support WeChat palm payment, over 1,500 7-Eleven stores now support palm payment. This feature uses palm biometric recognition technology for contactless checkout, improving overall efficiency, further reducing queues, and accelerating the intelligent upgrade of retail services.

 

 

Contactless Palm vein scanner in Schools:

University

China's first university "Campus One-Person Pass" system

Shenzhen University's "Campus One-Person Pass" system uses palm-swipe biometric technology to provide a secure, contactless authentication experience. After users first enter their palm print on a palm-swipe device and link it to their WeChat campus code, they can pay instantly in cafeterias, convenience stores, and other locations, without the need for a phone or physical card.

 

Biometric Palm Vein scanner in Shared charging

Biometric Palm vein reader

Jiedian

1-second identification, 2-step operation, 5-second delivery

 

Jiedian's palm-swipe charging service revolutionizes shared charging services with biometric recognition technology. Leveraging cutting-edge multimodal biometrics, it quickly and accurately completes the identification process, further addressing traditional shared charging pain points such as dead phones or poor signal quality, delivering a superior shared charging experience.

In the fields of high-temperature material performance research and phase transition mechanism analysis, traditional external heating methods often fail to combine precise micro-region temperature control with real-time observation.

 

CIQTEK, in collaboration with the Micro-Nano Center of the University of Science and Technology of China, has developed an innovative in-situ heating chip solution. By integrating MEMS heating chips with dual-beam electron microscopes, this solution enables precise temperature control (from room temperature to 1100°C) and micro-dynamic analysis of samples, offering a new tool for studying material behavior in high-temperature environments.

This solution uses the CIQTEK dual-beam SEM and specialized MEMS heating chips, with temperature control accuracy better than 0.1°C and temperature resolution better than 0.1°C. The system also features excellent temperature uniformity and low infrared radiation, ensuring stable analysis at high temperatures. The system supports various characterization techniques during heating, including micro-region morphology observation, EBSD crystal orientation analysis, and EDS composition analysis. This allows for a comprehensive understanding of phase transitions, stress evolution, and composition migration under thermal effects.

 

The system operates without breaking the vacuum, fulfilling the full process requirements for sample preparation and characterization (in-situ micro-region EBSD).

CIQTEK Launches In-situ Heating Chip Solution for High-Precision Analysis

CIQTEK Launches In-situ Heating Chip Solution for High-Precision Analysis

 

The integrated workflow design covers the entire process, from sample preparation (ion beam processing, nano-manipulator extraction) to in-situ welding and heating tests. The system supports multi-angle operation, featuring a 45° heating chip and a 36° copper grid position, which meet the complex experimental needs. The system has been successfully applied in high-temperature performance research of alloys, ceramics, and semiconductors, helping users gain deeper insights into material responses in real-world environments.

 

 

 

September 26–30, Wuhan | 2025 Chinese National Conference on Electron Microscopy
CIQTEK's eight major electron microscopy solutions will be showcased!

In data centers, DAC (Direct Attach Copper) and AOC (Active Optical Cable) are two commonly used high-speed connectivity cables. They may look similar in appearance but differ significantly in functionality and application scenarios. Understanding the differences between them helps make more appropriate choices when building or upgrading data centers.

QSFP28 to QSFP28 AOC cable

What is a DAC Cable?

 

A DAC cable is a copper-based cable with standard connectors (such as SFP+, QSFP+) at both ends. It transmits electrical signals directly without the need for additional signal conversion modules.
Its characteristics are obvious: the transmission distance is short - passive DACs typically reach only 3-7 meters, and active DACs max out at 15 meters. However, it has low cost and low power consumption - passive ones consume almost no power, and active ones operate within 1W. Nevertheless, the copper material makes it susceptible to electromagnetic interference, making it more suitable for short-distance scenarios with simple electromagnetic environments.
In data centers, DACs are commonly used for device connections within the same rack (e.g., between servers and switches) or short-distance interconnections between adjacent racks (within 10 meters). They enable high-speed transmission from 10Gbps to 100Gbps at a relatively low cost.
 
What is an AOC Cable?
 
An AOC cable features multi-mode optical fiber as its core, with integrated optical transceivers at both ends. During operation, electrical signals are first converted to optical signals for transmission through the fiber, then converted back to electrical signals at the destination.
Its advantage lies in long-distance transmission: using OM3 fiber can reach 100 meters, and some products even exceed 300 meters. Additionally, optical fiber is immune to electromagnetic interference, ensuring strong signal stability. However, it has higher costs and power consumption (around 1-2W) due to the need for optical transceivers for signal conversion.
AOCs are suitable for long-distance connections in data centers, such as interconnections between cross-rack or cross-floor devices, or scenarios with extremely high requirements for signal quality like high-performance computing and financial transactions. They support high-speed transmission from 10Gbps to 400Gbps.
 
 
Core Differences and Selection Recommendations
 
The core differences can be summarized as: DAC uses copper to transmit electrical signals, offering short distance, low cost, and susceptibility to interference; AOC uses optical fiber to transmit optical signals, providing long distance, anti-interference capability, and higher cost.
When making a selection, first consider the distance: prioritize DAC for distances within 10 meters, as it is cost-effective and sufficient; choose AOC for distances exceeding 10 meters to ensure stable transmission. Additionally, AOC is more reliable in complex electromagnetic environments or scenarios requiring long-term high bandwidth; DAC is more economical for short-distance connections with limited budgets.
In conclusion, DAC and AOC each have their strengths. Data centers usually use them in combination according to specific connection requirements to ensure efficiency while controlling costs.
 
Boasting over 100 product testing devices, every DAC and AOC cable from Fiberwdm meets stringent standards. Their dedicated technical support team addresses all product - related issues, from operation to technical challenges. Whether you need a cost - effective short - range DAC or a high - performance long - distance AOC, Fiberwdm delivers tailored solutions to enhance your data center's stability and efficiency.​
 
 
 

Passive Optical Network (PON) is the core technology for fiber-optic broadband. Leveraging the advantages of "passivity" (no power supply required for the Optical Distribution Network/ODN), low cost, high reliability, and wide coverage (up to 20 km), it has become the mainstream of broadband networks. GPON, XG-PON, and XGS-PON represent three key phases in the evolution of PON technology, with core differences centered on bandwidth capability and symmetry—factors that directly define their technical positioning. This article examines the core distinctions among the three from the perspectives of technological evolution, core parameters.

 

I. Technological Evolution: The Iteration Logic from "Basic Gigabit" to "Symmetric 10G"

 
The evolution of these three technologies is essentially a process of "bandwidth expansion" and "symmetry optimization". All comply with standards set by the ITU-T (International Telecommunication Union-Telecommunication Standardization Sector), with gradually improved compatibility:

 

  • GPON: Launched in the 2000s as the "first-generation gigabit PON," it addressed the transition from "100-Mbps broadband" to "gigabit access" and served as the primary technology for early Fiber-to-the-Home (FTTH) deployments.
  • XG-PON: Introduced in the 2010s as the "second-generation PON," it targeted download-intensive needs (e.g., high-definition videos, cloud gaming) by increasing downstream bandwidth to 10G, driving the popularization of "gigabit home access."
  • XGS-PON: Commercialized in the 2018s as the "third-generation PON," it addressed XG-PON’s upstream bandwidth limitations by enabling "symmetric 10G upstream/downstream," making it suitable for scenarios requiring high bidirectional bandwidth.

 

GPON XGS-PON NG-PON

 

II. Comparison of Core Parameters: A Clear Overview of Differences

 

Comparison Dimension

GPON (Gigabit PON)

XG-PON (10G PON) XGS-PON (Symmetric 10G PON)
Standards Basis ITU-T G.984 Series ITU-T G.987 Series ITU-T G.9807 Series

Upstream/Downstream Bandwidth

Symmetric 1.25 Gbps Asymmetric (10 Gbps downstream, 2.5 Gbps upstream) Symmetric 10 Gbps (upstream/downstream)
Typical User Speed Mostly 100-Mbps class (50-100 Mbps), with some gigabit speeds 1-Gbps class downstream (500 Mbps-1 Gbps), 100-Mbps class upstream Symmetric 1-Gbps class (500 Mbps-1 Gbps)
Bandwidth Symmetry Symmetric Asymmetric Symmetric
Maximum Splitting Ratio 1:64 (supports 64 user splits) 1:128 1:128
Core Technical Features Mature and stable, low cost; supports triple-play (voice, data, video) Significantly enhanced downstream bandwidth; suitable for download-intensive scenarios Balanced upstream/downstream bandwidth; supports high bidirectional bandwidth scenarios

 

III. Demand-Driven Technological Iteration

 
From GPON to XG-PON and then to XGS-PON, this evolution is not a case of "new technologies completely replacing old ones," but rather a typical example of "demand-driven advancement":
 
  • GPON has laid the foundation for Fiber-to-the-Home (FTTH). With its mature technology and low cost, it addresses the "from scratch" need for broadband access, and still serves scenarios with low bandwidth requirements today.
  • XG-PON has broken through downstream bandwidth bottlenecks. Its asymmetric design matches users' "download-prioritized" needs, making it the mainstream technology for current home gigabit broadband.
  • XGS-PON achieves balanced bidirectional bandwidth. Equipped with symmetric 10G capability, it adapts to new scenarios such as 5G and cloud storage, and represents the core evolutionary direction of optical networks in the next 5-10 years.

 

The core logic of these three technologies has always been "matching current and short-term bandwidth needs at a reasonable cost," and together they form a complete technical system for optical networks, covering everything from basic services to future upgrades.

 

Explore Fiberwdm's GPON, XG-PON and XGS-PON products.