A Comprehensive Guide to RF-60TC: Is It the Superior High-Frequency PCB Substrate for Your Project?

In the rapidly advancing world of wireless technology, the demand for high-performance, reliable printed circuit boards (PCBs) is greater than ever. For engineers and designers working on cutting-edge RF and microwave systems, selecting the right substrate material is a critical decision that directly impacts product performance, efficiency, and longevity. Enter the RF-60TC High Frequency PCB, a premier PTFE-based, ceramic-reinforced composite material engineered to excel in the most demanding high-power applications. This blog delves into the superior properties, extensive manufacturing capabilities, and diverse applications of this exceptional material.

Unveiling the RF-60TC: A Material Engineered for Excellence

The Taconic RF-60TC is not just another PCB substrate; it represents a significant leap forward in material science. Crafted from a polytetrafluoroethylene (PTFE) base infused with ceramic and woven fiberglass, it is specifically formulated to address the unique challenges of high-frequency circuits. A key differentiator is its ability to maintain operational stability at elevated power levels while generating lower operating temperatures. This characteristic is paramount for enhancing power gains and boosting overall system efficiency, particularly in the increasingly prevalent miniaturized antenna systems operating within a controlled dielectric constant (Dk) of 6.15. These advantages are primarily derived from the material's superior dielectric heat dissipation properties and its exceptionally low signal loss, ensuring pristine performance.

A Deep Dive into the Defining Features of RF-60TC

The exceptionalism of the RF-60TC material is underscored by its robust set of technical attributes:

1) Superior Thermal Conductivity: A standout feature is its impressive thermal management capability. The substrate offers thermal conductivity values of 0.9 W/m·K for unclad laminates, which increases to 1.00 W/m·K for 0.5oz copper cladding and 1.05 W/m·K for 1oz cladding. This efficient heat dissipation reduces thermal stress on active components, thereby extending their operational lifespan and guaranteeing long-term reliability for your designs.

2) Stable Dielectric Constant: With a consistent dielectric constant (Dk) of 6.15±0.15 measured at 10 GHz, the RF-60TC provides exceptional electrical predictability. This stability is crucial for impedance control and is a fundamental enabler of device miniaturization, allowing designers to optimize board space without sacrificing electrical performance.

3) Minimal Dissipation Factor: The material exhibits an extremely low dissipation factor (Df) of just 0.002 at 10 GHz (as per IPC-650 2.5.5.5.1). This low loss tangent translates to highly efficient signal transmission, minimizing energy loss and preserving signal strength in sensitive RF applications.

4) Enhanced Dimensional Stability: The RF-60TC features a low coefficient of thermal expansion (CTE), with values of 9.9 ppm/°C in the X and Y axes and 40 ppm/°C in the Z-axis. This enhanced dimensional stability is vital for constructing complex, high-layer-count multilayer PCBs, as it ensures improved reliability of plated through holes (PTHs) across a wide temperature range.

5) Low Moisture Absorption: In harsh environmental conditions, moisture uptake can compromise a PCB's integrity. The RF-60TC boasts a remarkably low moisture absorption rate of 0.03% (IPC-650 2.6.2.1), ensuring consistent performance and unwavering environmental stability.

6) High Flammability Rating: Safety is never compromised. The material meets the stringent UL 94 V-0 flammability standard, confirming its self-extinguishing properties and high resistance to ignition.

Our Advanced PCB Manufacturing Capabilities with RF-60TC

Leveraging this advanced material requires a manufacturing partner with precise technical expertise. We offer comprehensive fabrication services tailored to fully exploit the potential of RF-60TC Taconic High Frequency PCB:

Layer Count Versatility: We expertly manufacture everything from simple Single and Double Layer boards to sophisticated Multilayer and Hybrid multilayer constructions, combining different materials for optimal performance.

Flexible Copper Weight: To meet specific current-carrying and conductivity needs, we provide standard options of 1oz (35 µm) and 2oz (70µm) copper cladding.

Precision Thickness Control: We offer a wide spectrum of substrate thicknesses, including 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), and 60mil (1.524mm), granting unparalleled design flexibility.

Large Format PCBs: Our production facilities can handle substantial board sizes, accommodating panels up to 400mm x 500mm.

Custom Solder Mask: Aesthetic and functional choices are available with solder mask colors including Green, Black, Blue, Yellow, Red, and others.

Diverse Surface Finishes: To ensure solderability, durability, and performance, we provide a full suite of surface finishes: Bare copper, HASL, ENIG, Immersion Silver, Immersion Tin, ENEPIG, OSP, and Pure Gold.

Key Applications Driving Innovation

The unique property set of RF-60TC Taconic RF PCB makes them the substrate of choice for a broad spectrum of high-performance applications, including:

• High-Power Amplifiers
• Miniaturized Antennas for GPS, Patch, and RFID Reader Systems
• Precision Filters, Couplers, and Power Dividers
• Satellite Communication Technologies

Conclusion

The RF-60TC Taconic PCB material stands as a testament to innovation, offering an unparalleled combination of thermal management, electrical performance, and mechanical reliability. By choosing this advanced substrate and partnering with a capable manufacturer, you empower your designs to achieve new heights of efficiency and power in the competitive realm of RF and microwave electronics.

What Makes Rogers AD250C PCB the Ideal Choice for High-Frequency Antenna Applications?

In the rapidly evolving world of wireless communication, the demand for high-performance, reliable antenna systems continues to grow. Rogers Corporation’s AD250C antenna laminates stand out as a premier specialty material engineered to address the exacting requirements of modern RF and microwave antenna markets. These advanced laminates are constructed from PTFE-based substrates reinforced with woven glass, resulting in superior high-frequency performance, exceptional passive intermodulation (PIM) characteristics, and outstanding processability for printed circuit board fabrication.

One of the most significant advantages of Rogers AD250C material is its composition. The glass-reinforced polytetrafluoroethylene (PTFE) structure ensures a tightly controlled dielectric constant while delivering remarkably low signal loss. This makes it an excellent foundation for antenna systems where signal integrity is paramount. Furthermore, the material is available with either standard electrodeposited copper foil or reverse-treated ED copper, providing designers the flexibility to optimize circuit efficiency and minimize passive intermodulation, a critical factor in multi-frequency and high-power environments.

Key Features of AD250C Antenna Laminates:

Extremely low dissipation factor of 0.0013 at 10 GHz, ideal for base station and other high-frequency applications, ensuring minimal signal loss and enhanced efficiency.

Consistent dielectric constant (Dk) of 2.50 with a narrow tolerance of±0.04, allowing accurate impedance matching and reliable signal propagation.

Low-profile copper foil options significantly reduce conductor losses, contributing to improved overall antenna gain and performance.

Moisture absorption as low as 0.04% guarantees stable operation under varying environmental conditions, maintaining electrical properties and prolonging service life.

Exceptional copper peel strength reaching 14.8 lbs per inch ensures robust mechanical adhesion between copper layers and substrate, enhancing durability in demanding applications.

PCB Fabrication Capabilities with AD250C:

Our manufacturing services fully support AD250C substrates with a comprehensive suite of PCB solutions. We provide single-layer, double-layer, and multi-layer board configurations, as well as hybrid builds combining different materials. Standard thickness offerings include 20 mil, 30 mil, and 60 mil, with flexibility to accommodate custom requirements. Finished copper weights of 1oz and 2oz are available for traces and pads, balancing current carrying capacity and fine-line patterning.

We can produce large-format PCBs up to 400mm x 500mm, facilitating both individual large antennas and multi-design panelization for cost-effective production. A variety of solder mask colors—including green, black, blue, red, and yellow—are offered for aesthetic and functional preferences. We also support multiple surface finishes such as immersion gold (ENIG), hot air solder leveling (HASL), immersion silver, immersion tin, OSP, ENEPIG, as well as bare copper or selective gold plating.

Application Areas:

AD250C high frequency PCBs are widely used in critical communication infrastructure, including cellular base station antennas, automotive telematics and vehicle-to-everything (V2X) antenna systems, commercial satellite radio antennas, and other high-frequency wireless applications where low loss, high reliability, and consistent performance are essential.

Whether you are developing next-generation 5G infrastructure, advanced automotive radar, or satellite communication equipment, AD250C Rogers PCB provide the electrical and mechanical properties needed to achieve superior performance. Partner with us for your PCB manufacturing needs and leverage our expertise in high-frequency materials to bring your most challenging designs to life.

What Makes TMM13i High Frequency PCBs Ideal for Demanding RF and Microwave Applications?

In the world of high-frequency electronics, the choice of printed circuit board (PCB) material is critical to achieving optimal performance and reliability. Rogers Corporation’s TMM13i isotropic thermoset microwave material stands out as an exceptional choice for high-frequency applications. This ceramic thermoset polymer composite is specifically engineered to deliver high reliability in plated through-hole strip-line and micro-strip configurations. By combining the beneficial properties of both ceramic and PTFE substrates, Rogers TMM13i allows designers to leverage the processing ease of soft substrate materials without compromising on electrical or thermal performance.

One of the key features of TMM13i laminate is their exceptionally low thermal coefficient of dielectric constant, rated at -70 ppm/°C. This ensures remarkable stability of the dielectric constant across a broad temperature spectrum, making it an excellent candidate for applications subject to significant temperature variations. Such thermal stability is essential in environments where performance consistency cannot be compromised.

Moreover, TMM13i PCB exhibits isotropic coefficients of thermal expansion (CTE)—19 ppm/°C in the X and Y axes, and 20 ppm/°C in the Z direction. These values are closely matched to those of copper, which significantly enhances the reliability of plated through holes and reduces etch shrinkage. This CTE matching minimizes the risk of delamination or cracking under thermal stress, thereby extending the lifecycle of the assembled PCB.

Another advantage of TMM13i substrate is its high dielectric constant of 12.85±0.35. This property allows for considerable miniaturization of circuit components, supporting the trend toward more compact and integrated electronic devices. In addition, the material’s low dissipation factor of 0.0019 at 10 GHz ensures minimal signal loss and improved energy efficiency, which is particularly valuable in high-speed digital and RF microwave circuits.

Our PCB Manufacturing Capabilities with TMM13i Material

We take pride in offering advanced PCB fabrication services utilizing Rogers TMM13i high-frequency laminates. Our manufacturing facilities support a wide variety of PCB configurations—including single-layer, double-layer, multilayer, and hybrid boards—to meet diverse and customized project requirements.

We provide flexible copper weight options, including 1 oz (35 µm) and 2 oz (70 µm), to address specific conductivity and current-carrying needs. Our processes also support multiple dielectric thicknesses, from 15 mil (0.381 mm) up to 500 mil (12.7 mm), accommodating both standard and high-power designs.

For larger format designs, we can produce PCBs with dimensions up to 400 mm x 500 mm. Additionally, we offer a variety of solder mask colors—such as green, black, blue, yellow, and red—enabling alignment with your aesthetic branding or functional identification requirements.

To ensure superior performance and longevity, we provide a comprehensive selection of surface finishes: bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), immersion tin, immersion silver, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and pure gold.

Applications of TMM13i High Frequency PCBs

TMM13i-based PCBs are ideally suited for a broad range of high-performance applications. These include chip testers, dielectric polarizers, lenses, filters, couplers, and various RF and microwave circuits. Their excellent electrical properties also make them a preferred material in satellite communication systems, where signal integrity and thermal stability are paramount.

Whether you are designing advanced aerospace systems, telecommunications infrastructure, or sophisticated test and measurement equipment,TMM13i High Frequency PCBs provide the reliability and performance needed to succeed in demanding environments.

Why is TLX-9 the Preferred High-Frequency Laminate for Demanding Aerospace and Telecom Systems?

In the rapidly advancing world of high-frequency electronics, the choice of printed circuit board (PCB) material is critical to the performance, reliability, and efficiency of the end product. Taconic’s TLX-9 high-frequency PCB material stands at the forefront of this innovation, offering an exceptional blend of electrical, mechanical, and thermal characteristics tailored for demanding applications. This article delves into the core attributes, capabilities, and uses of TLX-9, illustrating why it is a top-tier choice for engineers and designers in industries where precision and performance are non-negotiable.

An Introduction to TLX-9 High Frequency Material

TLX-9 is a premium-gradehigh-frequency laminate constructed from a polytetrafluoroethylene (PTFE) base reinforced with woven fiberglass. This sophisticated composite represents a significant achievement in copper-clad PTFE technology, merging outstanding high-frequency electrical properties with excellent mechanical durability. It is manufactured under strict controls to ensure consistent performance, making it ideal for applications where signal integrity and operational stability are paramount.

Moreover, Taconic TLX-9 complies with the UL 94 V-0 flammability standard, enhancing its suitability for safety-sensitive environments. The material is also compatible with standard PCB fabrication processes—including shearing, drilling, milling, and plating—enabling straightforward integration into existing production workflows without the need for specialized equipment or techniques.

Key Features and Technical Specifications

The superior performance of TLX-9 PCB stems from its carefully engineered properties:

1) Dielectric Constant (Dk): At 10 GHz, the dielectric constant is 2.50, offering exceptional signal stability and reduced propagation delay, which is crucial for high-speed and high-frequency circuit operation.

2) Dissipation Factor (Df): With an ultra-low dissipation factor of 0.0019 at 10 GHz, TLX-9 minimizes signal loss, thereby enhancing the efficiency of power transmission and preserving signal clarity in RF and microwave applications.

3) Moisture Absorption: Boasting a moisture absorption rate of less than 0.02%, TLX-9 maintains consistent performance even under high-humidity conditions, ensuring long-term reliability and reducing the risk of degradation.

4) Dielectric Strength: The material offers a dielectric breakdown strength exceeding 60 kV, making it highly suitable for high-power and high-voltage applications such as radar systems and microwave amplifiers.

5) Resistivity: TLX-9 exhibits high volume and surface resistivity, both rated at 10⁷MΩ/cm and MΩrespectively, providing superior insulation resistance and minimizing current leakage.

6) Peel Strength: The laminate demonstrates strong bond integrity, with a peel strength of 12.0 lbs per linear inch for 1 oz copper, ensuring that copper layers remain securely attached throughout the assembly process and product lifecycle.

7) Thermal Expansion: The coefficient of thermal expansion (CTE) is tightly controlled, with X-Y CTE values of 9–12 ppm/°C and Z-axis CTE ranging from 130–145 ppm/°C. This dimensional stability across temperatures prevents deformation and supports the structural integrity of multilayer and high-density designs.

PCB Fabrication Capabilities with TLX-9

TLX-9 substrate supports a wide range of PCB configurations, including single-sided, double-sided, multilayer, and hybrid constructions. Available in thicknesses of 5, 10, 20, and 30 mils, it provides flexibility for various design requirements. The finished copper weight can be specified as 1 oz or 2 oz, supporting both fine-line tracing and higher current carrying capacity.

The maximum panel size available is 400 mm x 500 mm, accommodating both large-format boards and multi-design panelization. A variety of solder mask colors are offered, including green, black, blue, red, and yellow. Surface finish options include immersion gold (ENIG), hot air solder leveling (HASL), immersion silver, immersion tin, bare copper, OSP, electroplated gold, and ENEPIG, providing ample choices based on application needs and assembly conditions.

Typical Applications

TLX-9 Taconic RF PCBs are widely used in advanced electronic systems where high reliability and signal fidelity are essential. Common applications include:

• Low Noise Amplifiers (LNA)
• Low Noise Block Converters (LNB)
• Low Noise Converters (LNC)
• Large-format antenna systems for Personal Communication Services (PCS) and Personal Communication Networks (PCN)
• High Power Amplifiers

These applications benefit from the material’s stable electrical properties, low loss characteristics, and robust construction, making TLX-9 Taconic High Frequency PCB a preferred substrate in aerospace, military, telecommunications, and other high-performance sectors.

Conclusion

TLX-9 Taconic RF PCB Circuit Board combines cutting-edge material science with practical manufacturability, offering a reliable solution for the most challenging high-frequency designs. Its balanced performance across electrical, thermal, and mechanical domains ensures that it meets the rigorous demands of modern RF and microwave applications. Whether for consumer communication devices or mission-critical aerospace systems, TLX-9Taconic PCB Substrate delivers consistent quality and superior performance, establishing itself as a material of choice among engineers and designers worldwide.

Why Should You Choose DiClad 870 for Your High-Frequency and Low-Loss PCB Designs?

In the world of high-frequency electronics, the choice of printed circuit board material is critical to achieving optimal performance and reliability. Rogers DiClad 870 stands out as an exceptional high-frequency laminate, specifically engineered to meet the rigorous demands of advanced RF and microwave applications. This woven fiberglass-reinforced, PTFE-based composite delivers superior electrical properties, dimensional stability, and mechanical durability—making it an ideal substrate for high-speed digital and analog designs.

One of the key advantages of Rogers DiClad 870 is its unique construction. By utilizing a higher proportion of PTFE content and fewer plies of woven fiberglass, it achieves a lower dielectric constant and exceptionally low dissipation factor. What sets it apart from non-woven PTFE laminates is its enhanced dimensional stability, thanks to the strategic alignment of coated fiberglass plies in the same direction. This structural integrity ensures consistent performance even under varying operational conditions.

Key Features of DiClad 870 High Frequency Laminates

1) Stable Dielectric Constant: DiClad 870 maintains a consistent dielectric constant of 2.33 across a broad frequency spectrum—from 1 MHz all the way up to 10 GHz. This uniformity ensures reliable signal transmission with minimal phase distortion, making it suitable for high-speed and high-frequency designs.

2) Low Dissipation Factor: With an ultra-low dissipation factor of just 0.0013 at 10 GHz, these laminates significantly reduce signal loss, preserve energy efficiency, and enhance signal integrity—especially crucial in sensitive RF and microwave circuits.

3) Excellent Copper Adhesion: The laminate demonstrates outstanding copper peel strength, measuring 14 lbs/in when tested with 35μm foil per IPC TM-650 2.4.8. This strong bond between copper and substrate ensures long-term reliability and reduces the risk of delamination.

4) Minimal Moisture Absorption: DiClad 870’s moisture absorption rate is an impressively low 0.02%, allowing it to perform reliably in humid or challenging environments without compromising electrical properties.

5) High Flame Resistance: Complying with UL 94-V0 standards, this material offers excellent flammability resistance, contributing to safer end-products and compliance with international safety regulations.

PCB Manufacturing Capabilities with DiClad 870

We provide comprehensive manufacturing solutions for DiClad 870 PCBs, supporting a wide range of design requirements:

Layer Configurations: From single and double-sided boards to complex multi-layer and hybrid stack-ups, we accommodate diverse project needs with precision.

Dielectric Thickness Options: Choose from standard thicknesses including 31mil (0.787mm), 93mil (2.286mm), and 125mil (3.175mm) to meet specific impedance and mechanical requirements.

Copper Weights: Available in 1oz (35µm) and 2oz (70µm) options, providing flexibility in current carrying capacity and thermal management.

Panel Size: We support PCB dimensions up to 400mm x 500mm, ideal for both large single-board layouts and multi-design panelization.

Solder Mask Varieties: Customize the appearance of your boards with a selection of solder mask colors including Green, Black, Blue, Red, Yellow, and more.

Surface Finishes: Our offerings include Immersion Gold (ENIG), HASL, Immersion Silver, Immersion Tin, Bare Copper, OSP, ENEPIG, and Pure Gold, giving you the flexibility to choose based on solderability, durability, and application environment.

Typical Applications

DiClad 870 substrates are widely used in applications where consistent dielectric properties and low loss are essential. Common uses include:

• RF components such as filters, couplers, and low-noise amplifiers
• Power dividers and combiners in telecommunications infrastructure
• Base station antennas and signal distribution networks
• Radar feed networks, commercial phased array systems, and aerospace guidance systems
• Digital radio antennas and other high-frequency communication devices

Whether you are designing for aerospace, defense, telecom, or high-performance computing, DiClad 870high frequency PCB offers a reliable foundation for building circuits that demand tight impedance control, minimal signal loss, and unwavering performance.

In today’s fast-paced world, keeping track of your health and staying connected is more important than ever. The ET458 Smartwatch offers a perfect blend of advanced technology, stylish design, and practical daily features. With its 1.56-inch AMOLED HD screen, every detail is crisp and colorful, making notifications, fitness data, and watch faces a joy to view.

The ET458 is more than just a smartwatch – it’s your personal health assistant. Featuring ECG detection, one-touch micro-physical examination, and continuous monitoring of heart rate, blood oxygen, and sleep patterns, it helps you understand your body like never before. Emotional fatigue detection allows you to stay aware of stress levels, giving you the tools to manage both physical and mental wellness.

For those with an active lifestyle, the ET458 supports multiple sports modes, while IP68 waterproofing and a long-lasting 380mAh battery ensure it keeps up with your adventures. Its ultra-bright flashlight with four modes – constant light, night running, warning, and SOS – adds an extra layer of safety and convenience.

The ET458 also excels in smart connectivity. With Bluetooth calling, NFC access control, and Alipay payment, you can handle daily tasks effortlessly from your wrist. Plus, the vast online watch face library allows you to personalize your watch to match your style.

Whether you’re focused on fitness, wellness, or staying connected on the go, the ET458 Smartwatch combines elegance, durability, and advanced health features. It’s not just a watch – it’s a comprehensive companion for modern life.

In the fields of life sciences, biomedicine, food inspection, and soft matter research, achieving high-resolution imaging of hydrated and beam-sensitive samples has always been a major challenge. Conventional sample preparation methods, such as chemical fixation, dehydration, and drying, often result in shrinkage, deformation, or structural damage, leading to results that deviate from the true state of the sample.

Leveraging its advanced scanning electron microscopy technology, CIQTEK has introduced the Cryo-SEM Solution, which integrates low-temperature freezing and vacuum transfer. This enables in-situ, non-destructive, and high-fidelity microscopic observation of biological and sensitive samples, truly “freezing” the microscopic details of life.

With liquid-nitrogen slush rapid-freezing technology, samples can be vitrified instantly at -210 °C, preserving their original morphology and chemical composition to the greatest extent. The integrated cryo-preparation system combines freeze-fracture, sublimation coating, and low-temperature transfer, avoiding the complexity and potential errors of conventional manual preparation. Throughout the entire process, samples are maintained under cryogenic vacuum conditions and transferred to the SEM cryo-stage, where high-resolution imaging at -180 °C effectively suppresses electron beam damage and significantly improves image quality.

Cryo-prepared boxwood leaf showing intact vein structures, while the untreated sample exhibits severe shrinkage.

Yogurt

Mold

Cryo-prepared yogurt sample clearly reveals protein networks and fungal hyphae.

In addition, the system offers strong compatibility, adaptable across CIQTEK's full range of SEMs and dual-beam FIBSEM systems, meeting diverse needs from routine observation to advanced analysis.

The CIQTEK Cryo-SEM Solution is more than just a set of instruments. It embodies a scientific approach dedicated to faithfully restoring the microscopic world. It empowers researchers to overcome technical limitations, capture critical details at the micro scale of life, and drive both fundamental research and applied development to new heights.

September 26–30, Wuhan

At the 2025 Chinese Electron Microscopy Academic Conference, CIQTEK will unveil eight cutting-edge EM solutions.

Stay tuned!

Dear Industry Professionals and Partners,

We are thrilled to extend a formal invitation to the upcoming SPS Atlanta, taking place from September 16-18, 2025 at 1517 booth, Atlanta, Georgia USA. 

The 2024 product catalog and the latest industry catalog have been updated on the WAIN official website (https://www.wainelectric.com/download). We welcome everyone to browse and download them.

CIQTEK is pleased to announce the successful installation and training of the FIBSEM DB550 at our Korean distributor GSEM’s Electron Microscope Center. This milestone marks an important step in expanding access to advanced focused ion beam scanning electron microscope (FIBSEM) technology in South Korea.

The DB550 combines high-resolution imaging with precise ion beam milling, enabling researchers to perform 3D reconstruction, cross-sectional analysis, and nanoscale material modification with efficiency and accuracy. With these capabilities, the system opens new possibilities for semiconductor analysis, materials science, and life science research.

Following installation, CIQTEK engineers provided hands-on training to the GSEM team, covering both standard workflows and advanced applications. The interactive sessions ensured that users gained practical experience in operating the instrument, from sample preparation to high-resolution imaging and data analysis. The enthusiasm and engagement of the GSEM team highlighted the strong potential for the DB550 to support diverse research projects at the center.

This collaboration reflects CIQTEK’s commitment to working closely with partners worldwide. By equipping GSEM’s facility with the DB550, we are not only strengthening our presence in the Korean market but also helping local researchers gain access to cutting-edge tools for scientific innovation.

We look forward to seeing the exciting results that GSEM’s Electron Microscope Center will achieve with the DB550, and we remain committed to providing ongoing technical support and collaboration.